Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review (Adv. Mater. 52/2022)

Name: Work Video:
Duration: 3 min 30 s
Yingfeng Wen; Chao Chen; Yunsheng Ye; Zhigang Xue; Hongyuan Liu; Xingping Zhou; Yun Zhang; Dequn Li; Xiaolin Xie; Yiu‐Wing Mai
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