Publication Information

{'id': 'https://openalex.org/W4251733017', 'doi': 'https://doi.org/10.1109/ectc.1990.122230', 'title': 'The impact of packaging on the reliability of flip chip solder bonded devices', 'display_name': 'The impact of packaging on the reliability of flip chip solder bonded devices', 'publication_year': 2002, 'publication_date': '2002-12-04', 'ids': {'openalex': 'https://openalex.org/W4251733017', 'doi': 'https://doi.org/10.1109/ectc.1990.122230'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/ectc.1990.122230', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'proceedings-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5005432424', 'display_name': 'K.J. Lodge', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I100288624', 'display_name': 'John Innes Centre', 'ror': 'https://ror.org/055zmrh94', 'country_code': 'GB', 'type': 'facility', 'lineage': ['https://openalex.org/I100288624', 'https://openalex.org/I2799693246', 'https://openalex.org/I4210087105']}], 'countries': ['GB'], 'is_corresponding': False, 'raw_author_name': 'K.J. Lodge', 'raw_affiliation_strings': ['Allen Clark Research Centre, Plessey Research Caswell Limited, Towcester, Northamptonshire, UK'], 'affiliations': [{'raw_affiliation_string': 'Allen Clark Research Centre, Plessey Research Caswell Limited, Towcester, Northamptonshire, UK', 'institution_ids': ['https://openalex.org/I100288624']}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5076909883', 'display_name': 'D.J. Pedder', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I100288624', 'display_name': 'John Innes Centre', 'ror': 'https://ror.org/055zmrh94', 'country_code': 'GB', 'type': 'facility', 'lineage': ['https://openalex.org/I100288624', 'https://openalex.org/I2799693246', 'https://openalex.org/I4210087105']}], 'countries': ['GB'], 'is_corresponding': False, 'raw_author_name': 'D.J. Pedder', 'raw_affiliation_strings': ['Allen Clark Research Centre, Plessey Research Caswell Limited, Towcester, Northamptonshire, UK'], 'affiliations': [{'raw_affiliation_string': 'Allen Clark Research Centre, Plessey Research Caswell Limited, Towcester, Northamptonshire, UK', 'institution_ids': ['https://openalex.org/I100288624']}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 1, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 0.0, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 5, 'citation_normalized_percentile': {'value': 0.0, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 73, 'max': 75}, 'biblio': {'volume': None, 'issue': None, 'first_page': None, 'last_page': None}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.9958, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.9958, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T12017', 'display_name': 'Recycling and Waste Management Techniques', 'score': 0.9694, 'subfield': {'id': 'https://openalex.org/subfields/2311', 'display_name': 'Industrial and Manufacturing Engineering'}, 'field': {'id': 'https://openalex.org/fields/23', 'display_name': 'Environmental Science'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.9651, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/temperature-cycling', 'display_name': 'Temperature cycling', 'score': 0.69874936}, {'id': 'https://openalex.org/keywords/passivation', 'display_name': 'Passivation', 'score': 0.5211318}, {'id': 'https://openalex.org/keywords/electronic-packaging', 'display_name': 'Electronic Packaging', 'score': 0.48570976}], 'concepts': [{'id': 'https://openalex.org/C79072407', 'wikidata': 'https://www.wikidata.org/wiki/Q432439', 'display_name': 'Flip chip', 'level': 4, 'score': 0.8319479}, {'id': 'https://openalex.org/C50296614', 'wikidata': 'https://www.wikidata.org/wiki/Q211387', 'display_name': 'Soldering', 'level': 2, 'score': 0.7585118}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.72358155}, {'id': 'https://openalex.org/C177564732', 'wikidata': 'https://www.wikidata.org/wiki/Q7698333', 'display_name': 'Temperature cycling', 'level': 3, 'score': 0.69874936}, {'id': 'https://openalex.org/C43214815', 'wikidata': 'https://www.wikidata.org/wiki/Q7310987', 'display_name': 'Reliability (semiconductor)', 'level': 3, 'score': 0.6200037}, {'id': 'https://openalex.org/C33574316', 'wikidata': 'https://www.wikidata.org/wiki/Q917260', 'display_name': 'Passivation', 'level': 3, 'score': 0.5211318}, {'id': 'https://openalex.org/C165005293', 'wikidata': 'https://www.wikidata.org/wiki/Q1074500', 'display_name': 'Chip', 'level': 2, 'score': 0.49724677}, {'id': 'https://openalex.org/C69567186', 'wikidata': 'https://www.wikidata.org/wiki/Q5358403', 'display_name': 'Electronic packaging', 'level': 2, 'score': 0.48570976}, {'id': 'https://openalex.org/C134132462', 'wikidata': 'https://www.wikidata.org/wiki/Q45621', 'display_name': 'Ceramic', 'level': 2, 'score': 0.484014}, {'id': 'https://openalex.org/C125619702', 'wikidata': 'https://www.wikidata.org/wiki/Q7783038', 'display_name': 'Thermal copper pillar bump', 'level': 5, 'score': 0.47557107}, {'id': 'https://openalex.org/C49040817', 'wikidata': 'https://www.wikidata.org/wiki/Q193091', 'display_name': 'Optoelectronics', 'level': 1, 'score': 0.43643227}, {'id': 'https://openalex.org/C159985019', 'wikidata': 'https://www.wikidata.org/wiki/Q181790', 'display_name': 'Composite material', 'level': 1, 'score': 0.28783995}, {'id': 'https://openalex.org/C119599485', 'wikidata': 'https://www.wikidata.org/wiki/Q43035', 'display_name': 'Electrical engineering', 'level': 1, 'score': 0.2609745}, {'id': 'https://openalex.org/C204530211', 'wikidata': 'https://www.wikidata.org/wiki/Q752823', 'display_name': 'Thermal', 'level': 2, 'score': 0.20122182}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.1313394}, {'id': 'https://openalex.org/C163258240', 'wikidata': 'https://www.wikidata.org/wiki/Q25342', 'display_name': 'Power (physics)', 'level': 2, 'score': 0.0}, {'id': 'https://openalex.org/C68928338', 'wikidata': 'https://www.wikidata.org/wiki/Q131790', 'display_name': 'Adhesive', 'level': 3, 'score': 0.0}, {'id': 'https://openalex.org/C121332964', 'wikidata': 'https://www.wikidata.org/wiki/Q413', 'display_name': 'Physics', 'level': 0, 'score': 0.0}, {'id': 'https://openalex.org/C2779227376', 'wikidata': 'https://www.wikidata.org/wiki/Q6505497', 'display_name': 'Layer (electronics)', 'level': 2, 'score': 0.0}, {'id': 'https://openalex.org/C62520636', 'wikidata': 'https://www.wikidata.org/wiki/Q944', 'display_name': 'Quantum mechanics', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C153294291', 'wikidata': 'https://www.wikidata.org/wiki/Q25261', 'display_name': 'Meteorology', 'level': 1, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/ectc.1990.122230', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 0, 'referenced_works': [], 'related_works': ['https://openalex.org/W4251733017', 'https://openalex.org/W3191141382', 'https://openalex.org/W2971221497', 'https://openalex.org/W2936080818', 'https://openalex.org/W2155179766', 'https://openalex.org/W2141869744', 'https://openalex.org/W2138993883', 'https://openalex.org/W2080643270', 'https://openalex.org/W2054726112', 'https://openalex.org/W1900362976'], 'abstract_inverted_index': {'The': [0, 71], 'authors': [1], 'report': [2], 'on': [3], 'the': [4], 'assessment': [5], 'of': [6, 52, 112], 'flip-chip': [7, 75], 'solder-joint': [8], 'reliability': [9], 'for': [10], 'a': [11, 17, 26], 'hybrid': [12], 'device': [13, 30, 53], 'assembly': [14, 31], 'in': [15, 65, 90, 100], 'which': [16], 'zirconium-titanium-stannate': [18], '(ZTS)': [19], 'dielectric': [20], 'ceramic': [21], 'chip': [22, 57], 'is': [23], 'flip-chip-bonded': [24], 'to': [25, 34, 41, 46, 105], 'silicon': [27], 'circuit.': [28], 'This': [29], 'was': [32, 60], 'subjected': [33], 'severe': [35], 'thermal': [36], 'cycling': [37], 'testing': [38], 'involving': [39], 'up': [40], '2000': [42], 'cycles': [43], 'from': [44], '-55': [45], '+125': [47], 'degrees': [48], 'C.': [49], 'A': [50], 'range': [51], 'solder-bond': [54], 'geometries': [55], 'and': [56, 68, 115], 'passivation': [58], 'structures': [59], 'investigated,': [61], 'with': [62, 85], 'devices': [63, 91], 'packaged': [64, 102], 'both': [66], 'hermetic': [67], 'nonhermetic': [69], 'enclosures.': [70], 'results': [72], 'showed': [73], 'that': [74, 92], 'solder': [76], 'bonds': [77], 'can': [78], 'be': [79], 'extremely': [80], 'reliable': [81], 'under': [82], 'such': [83], 'tests,': [84], 'no': [86], 'failures': [87, 97], 'being': [88], 'detected': [89], 'were': [93, 98], 'hermetically': [94], 'packaged.': [95], 'Fatigue': [96], 'observed': [99], 'nonhermetically': [101], 'devices.': [103], 'Extrapolation': [104], 'likely': [106], 'operating': [107], 'conditions': [108], 'predicted': [109], 'field': [110], 'lifetimes': [111], 'between': [113], '15': [114], '300': [116], 'yr.<': [117], '<ETX': [118], 'xmlns:mml="http://www.w3.org/1998/Math/MathML"': [119], 'xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>': [120]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W4251733017', 'counts_by_year': [], 'updated_date': '2024-12-05T23:22:54.138132', 'created_date': '2022-05-12'}