Publication Information

{'id': 'https://openalex.org/W2350159546', 'doi': None, 'title': 'Recent Advances of Flip-Chip Underfill Process (1)', 'display_name': 'Recent Advances of Flip-Chip Underfill Process (1)', 'publication_year': 2008, 'publication_date': '2008-01-01', 'ids': {'openalex': 'https://openalex.org/W2350159546', 'mag': '2350159546'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'http://en.cnki.com.cn/Article_en/CJFDTOTAL-DYFZ200801007.htm', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S2764657968', 'display_name': 'Electronics & Packaging', 'issn_l': None, 'issn': None, 'is_oa': False, 'is_in_doaj': False, 'is_core': False, 'host_organization': None, 'host_organization_name': None, 'host_organization_lineage': [], 'host_organization_lineage_names': [], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'journal-article', 'indexed_in': [], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5103001257', 'display_name': 'Qiang Huang', 'orcid': 'https://orcid.org/0000-0003-2350-5127'}, 'institutions': [{'id': 'https://openalex.org/I2800372957', 'display_name': 'China Electronics Technology Group Corporation', 'ror': 'https://ror.org/0098hst83', 'country_code': 'CN', 'type': 'company', 'lineage': ['https://openalex.org/I2800372957']}], 'countries': ['CN'], 'is_corresponding': True, 'raw_author_name': 'Huang Qiang', 'raw_affiliation_strings': ['China Electronic Technology Group Corporation No'], 'affiliations': [{'raw_affiliation_string': 'China Electronic Technology Group Corporation No', 'institution_ids': ['https://openalex.org/I2800372957']}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 1, 'corresponding_author_ids': ['https://openalex.org/A5103001257'], 'corresponding_institution_ids': ['https://openalex.org/I2800372957'], 'apc_list': None, 'apc_paid': None, 'fwci': 0.0, 'has_fulltext': False, 'cited_by_count': 0, 'citation_normalized_percentile': {'value': 0.0, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 0, 'max': 63}, 'biblio': {'volume': None, 'issue': None, 'first_page': None, 'last_page': None}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.9963, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.9963, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.9959, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T12495', 'display_name': 'Electrostatic Discharge in Electronics', 'score': 0.9846, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [], 'concepts': [{'id': 'https://openalex.org/C79072407', 'wikidata': 'https://www.wikidata.org/wiki/Q432439', 'display_name': 'Flip chip', 'level': 4, 'score': 0.9919401}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.69319594}, {'id': 'https://openalex.org/C43214815', 'wikidata': 'https://www.wikidata.org/wiki/Q7310987', 'display_name': 'Reliability (semiconductor)', 'level': 3, 'score': 0.5916822}, {'id': 'https://openalex.org/C165005293', 'wikidata': 'https://www.wikidata.org/wiki/Q1074500', 'display_name': 'Chip', 'level': 2, 'score': 0.51318127}, {'id': 'https://openalex.org/C98045186', 'wikidata': 'https://www.wikidata.org/wiki/Q205663', 'display_name': 'Process (computing)', 'level': 2, 'score': 0.4753991}, {'id': 'https://openalex.org/C125619702', 'wikidata': 'https://www.wikidata.org/wiki/Q7783038', 'display_name': 'Thermal copper pillar bump', 'level': 5, 'score': 0.46149194}, {'id': 'https://openalex.org/C24326235', 'wikidata': 'https://www.wikidata.org/wiki/Q126095', 'display_name': 'Electronic engineering', 'level': 1, 'score': 0.44605473}, {'id': 'https://openalex.org/C78519656', 'wikidata': 'https://www.wikidata.org/wiki/Q101333', 'display_name': 'Mechanical engineering', 'level': 1, 'score': 0.36261427}, {'id': 'https://openalex.org/C41008148', 'wikidata': 'https://www.wikidata.org/wiki/Q21198', 'display_name': 'Computer science', 'level': 0, 'score': 0.28180867}, {'id': 'https://openalex.org/C159985019', 'wikidata': 'https://www.wikidata.org/wiki/Q181790', 'display_name': 'Composite material', 'level': 1, 'score': 0.24271536}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.13957563}, {'id': 'https://openalex.org/C76155785', 'wikidata': 'https://www.wikidata.org/wiki/Q418', 'display_name': 'Telecommunications', 'level': 1, 'score': 0.0752013}, {'id': 'https://openalex.org/C2779227376', 'wikidata': 'https://www.wikidata.org/wiki/Q6505497', 'display_name': 'Layer (electronics)', 'level': 2, 'score': 0.07170814}, {'id': 'https://openalex.org/C163258240', 'wikidata': 'https://www.wikidata.org/wiki/Q25342', 'display_name': 'Power (physics)', 'level': 2, 'score': 0.0}, {'id': 'https://openalex.org/C68928338', 'wikidata': 'https://www.wikidata.org/wiki/Q131790', 'display_name': 'Adhesive', 'level': 3, 'score': 0.0}, {'id': 'https://openalex.org/C121332964', 'wikidata': 'https://www.wikidata.org/wiki/Q413', 'display_name': 'Physics', 'level': 0, 'score': 0.0}, {'id': 'https://openalex.org/C62520636', 'wikidata': 'https://www.wikidata.org/wiki/Q944', 'display_name': 'Quantum mechanics', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C111919701', 'wikidata': 'https://www.wikidata.org/wiki/Q9135', 'display_name': 'Operating system', 'level': 1, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'http://en.cnki.com.cn/Article_en/CJFDTOTAL-DYFZ200801007.htm', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S2764657968', 'display_name': 'Electronics & Packaging', 'issn_l': None, 'issn': None, 'is_oa': False, 'is_in_doaj': False, 'is_core': False, 'host_organization': None, 'host_organization_name': None, 'host_organization_lineage': [], 'host_organization_lineage_names': [], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 0, 'referenced_works': [], 'related_works': ['https://openalex.org/W3022436127', 'https://openalex.org/W2915158639', 'https://openalex.org/W2532422067', 'https://openalex.org/W2350473494', 'https://openalex.org/W2334355513', 'https://openalex.org/W2261056475', 'https://openalex.org/W2173462186', 'https://openalex.org/W2156644550', 'https://openalex.org/W2142862326', 'https://openalex.org/W2121176172', 'https://openalex.org/W2115932404', 'https://openalex.org/W2110262627', 'https://openalex.org/W2096436089', 'https://openalex.org/W2081647824', 'https://openalex.org/W1994869789', 'https://openalex.org/W1952321676', 'https://openalex.org/W1912614904', 'https://openalex.org/W1661522448', 'https://openalex.org/W1647569764', 'https://openalex.org/W1605927324'], 'abstract_inverted_index': {'In': [0], 'order': [1, 51], 'to': [2, 17, 52, 59], 'enhance': [3], 'the': [4, 19, 24, 30, 40, 44, 61], 'reliability': [5], 'of': [6, 26, 43], 'a': [7], 'flip': [8, 62], 'chip': [9, 32, 63], 'on': [10, 39], 'organic': [11, 34], 'board': [12], 'package,underfill': [13], 'is': [14], 'usually': [15], 'used': [16], 'redistribute': [18], 'thermomechanical': [20], 'stress': [21], 'created': [22], 'by': [23], 'coefficient': [25], 'thermal': [27], 'expasion(CTE)mismach': [28], 'between': [29], 'silicon': [31], 'and': [33, 47], 'substrate.However,the': [35], 'conventional': [36], 'underfill': [37, 45, 64], 'relies': [38], 'capilary': [41], 'flow': [42], 'resin': [46], 'has': [48], 'many': [49], 'disadvantages.In': [50], 'overcome': [53], 'these': [54], 'disadvantages,many': [55], 'variations': [56], 'have': [57], 'invented': [58], 'improve': [60], 'process.': [65]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2350159546', 'counts_by_year': [], 'updated_date': '2024-12-11T17:17:15.370004', 'created_date': '2016-06-24'}