Publication Information

{'id': 'https://openalex.org/W2543820493', 'doi': 'https://doi.org/10.1109/icm.2000.884794', 'title': 'Trends in packaging and high density interconnection', 'display_name': 'Trends in packaging and high density interconnection', 'publication_year': 2000, 'publication_date': '2000-01-01', 'ids': {'openalex': 'https://openalex.org/W2543820493', 'doi': 'https://doi.org/10.1109/icm.2000.884794', 'mag': '2543820493'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/icm.2000.884794', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'proceedings-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5051712390', 'display_name': 'Eric Beyne', 'orcid': 'https://orcid.org/0000-0002-3096-050X'}, 'institutions': [{'id': 'https://openalex.org/I4210114974', 'display_name': 'IMEC', 'ror': 'https://ror.org/02kcbn207', 'country_code': 'BE', 'type': 'nonprofit', 'lineage': ['https://openalex.org/I4210114974']}], 'countries': ['BE'], 'is_corresponding': False, 'raw_author_name': 'E. Beyne', 'raw_affiliation_strings': ['IMEC, Leuven, Belgium'], 'affiliations': [{'raw_affiliation_string': 'IMEC, Leuven, Belgium', 'institution_ids': ['https://openalex.org/I4210114974']}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5108232384', 'display_name': 'R. Mertens', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I4210114974', 'display_name': 'IMEC', 'ror': 'https://ror.org/02kcbn207', 'country_code': 'BE', 'type': 'nonprofit', 'lineage': ['https://openalex.org/I4210114974']}], 'countries': ['BE'], 'is_corresponding': False, 'raw_author_name': 'R. Mertens', 'raw_affiliation_strings': ['IMEC, Leuven, Belgium'], 'affiliations': [{'raw_affiliation_string': 'IMEC, Leuven, Belgium', 'institution_ids': ['https://openalex.org/I4210114974']}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 1, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 0.0, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 2, 'citation_normalized_percentile': {'value': 0.460742, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 65, 'max': 69}, 'biblio': {'volume': None, 'issue': None, 'first_page': '11', 'last_page': '15'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.9979, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.9979, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.993, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11429', 'display_name': 'Semiconductor Lasers and Optical Devices', 'score': 0.9662, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/microelectronics', 'display_name': 'Microelectronics', 'score': 0.9447471}, {'id': 'https://openalex.org/keywords/electronic-packaging', 'display_name': 'Electronic Packaging', 'score': 0.6129689}, {'id': 'https://openalex.org/keywords/integrated-circuit-packaging', 'display_name': 'Integrated circuit packaging', 'score': 0.566665}, {'id': 'https://openalex.org/keywords/packaging-engineering', 'display_name': 'Packaging engineering', 'score': 0.4462185}], 'concepts': [{'id': 'https://openalex.org/C187937830', 'wikidata': 'https://www.wikidata.org/wiki/Q175403', 'display_name': 'Microelectronics', 'level': 2, 'score': 0.9447471}, {'id': 'https://openalex.org/C123745756', 'wikidata': 'https://www.wikidata.org/wiki/Q1665949', 'display_name': 'Interconnection', 'level': 2, 'score': 0.8651848}, {'id': 'https://openalex.org/C69567186', 'wikidata': 'https://www.wikidata.org/wiki/Q5358403', 'display_name': 'Electronic packaging', 'level': 2, 'score': 0.6129689}, {'id': 'https://openalex.org/C186260285', 'wikidata': 'https://www.wikidata.org/wiki/Q759494', 'display_name': 'Integrated circuit packaging', 'level': 3, 'score': 0.566665}, {'id': 'https://openalex.org/C193149544', 'wikidata': 'https://www.wikidata.org/wiki/Q7122904', 'display_name': 'Packaging engineering', 'level': 2, 'score': 0.4462185}, {'id': 'https://openalex.org/C41008148', 'wikidata': 'https://www.wikidata.org/wiki/Q21198', 'display_name': 'Computer science', 'level': 0, 'score': 0.4347226}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.28669572}, {'id': 'https://openalex.org/C119599485', 'wikidata': 'https://www.wikidata.org/wiki/Q43035', 'display_name': 'Electrical engineering', 'level': 1, 'score': 0.27841294}, {'id': 'https://openalex.org/C76155785', 'wikidata': 'https://www.wikidata.org/wiki/Q418', 'display_name': 'Telecommunications', 'level': 1, 'score': 0.23592779}, {'id': 'https://openalex.org/C530198007', 'wikidata': 'https://www.wikidata.org/wiki/Q80831', 'display_name': 'Integrated circuit', 'level': 2, 'score': 0.23134908}, {'id': 'https://openalex.org/C78519656', 'wikidata': 'https://www.wikidata.org/wiki/Q101333', 'display_name': 'Mechanical engineering', 'level': 1, 'score': 0.106945425}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/icm.2000.884794', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [{'score': 0.42, 'id': 'https://metadata.un.org/sdg/7', 'display_name': 'Affordable and clean energy'}], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 0, 'referenced_works': [], 'related_works': ['https://openalex.org/W4234117135', 'https://openalex.org/W4213307373', 'https://openalex.org/W3162917068', 'https://openalex.org/W2543820493', 'https://openalex.org/W2362325225', 'https://openalex.org/W2357903062', 'https://openalex.org/W2099438907', 'https://openalex.org/W2070619027', 'https://openalex.org/W1938201706', 'https://openalex.org/W1556285067'], 'abstract_inverted_index': {'In': [0], 'this': [1], 'paper,': [2], 'some': [3], 'of': [4, 25, 28], 'the': [5, 23, 26, 32], 'main': [6], 'trends': [7], 'in': [8], 'packaging': [9], 'and': [10], 'interconnection': [11], 'technology': [12, 30], 'for': [13, 34], 'microelectronic': [14, 29], 'devices': [15], 'are': [16], 'reviewed.': [17], 'Particular': [18], 'attention': [19], 'is': [20], 'given': [21], 'to': [22], 'impact': [24], 'evolution': [27], 'on': [31], 'requirements': [33], 'electronic': [35], 'packaging.': [36]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2543820493', 'counts_by_year': [], 'updated_date': '2024-12-08T03:00:19.632924', 'created_date': '2016-11-04'}