Publication Information

{'id': 'https://openalex.org/W2155179766', 'doi': 'https://doi.org/10.1109/isapm.1999.757321', 'title': 'Flip chip packaging', 'display_name': 'Flip chip packaging', 'publication_year': 2003, 'publication_date': '2003-01-20', 'ids': {'openalex': 'https://openalex.org/W2155179766', 'doi': 'https://doi.org/10.1109/isapm.1999.757321', 'mag': '2155179766'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/isapm.1999.757321', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'proceedings-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5059219182', 'display_name': 'Ralf Werner', 'orcid': None}, 'institutions': [], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'R.G. Werner', 'raw_affiliation_strings': ['SEMATECH, Austin, TX, USA'], 'affiliations': [{'raw_affiliation_string': 'SEMATECH, Austin, TX, USA', 'institution_ids': []}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5111567515', 'display_name': 'D. R. Frear', 'orcid': None}, 'institutions': [], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'D.R. Frear', 'raw_affiliation_strings': ['SEMATECH, Austin, TX, USA'], 'affiliations': [{'raw_affiliation_string': 'SEMATECH, Austin, TX, USA', 'institution_ids': []}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5038306890', 'display_name': 'Joseph K. DeRosa', 'orcid': None}, 'institutions': [], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'J. DeRosa', 'raw_affiliation_strings': ['SEMATECH, Austin, TX, USA'], 'affiliations': [{'raw_affiliation_string': 'SEMATECH, Austin, TX, USA', 'institution_ids': []}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5048266046', 'display_name': 'E. Sorongon', 'orcid': None}, 'institutions': [], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'E. Sorongon', 'raw_affiliation_strings': ['SEMATECH, Austin, TX, USA'], 'affiliations': [{'raw_affiliation_string': 'SEMATECH, Austin, TX, USA', 'institution_ids': []}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 0, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 0.37, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 6, 'citation_normalized_percentile': {'value': 0.724904, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 76, 'max': 77}, 'biblio': {'volume': None, 'issue': None, 'first_page': '246', 'last_page': '251'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.9991, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.9991, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.999, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11301', 'display_name': 'Advanced Surface Polishing Techniques', 'score': 0.998, 'subfield': {'id': 'https://openalex.org/subfields/2204', 'display_name': 'Biomedical Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/ball-grid-array', 'display_name': 'Ball grid array', 'score': 0.9107611}, {'id': 'https://openalex.org/keywords/integrated-circuit-packaging', 'display_name': 'Integrated circuit packaging', 'score': 0.7478676}, {'id': 'https://openalex.org/keywords/package-on-package', 'display_name': 'Package on package', 'score': 0.7250262}, {'id': 'https://openalex.org/keywords/chip-scale-package', 'display_name': 'Chip-scale package', 'score': 0.64595675}, {'id': 'https://openalex.org/keywords/electronic-packaging', 'display_name': 'Electronic Packaging', 'score': 0.62845594}, {'id': 'https://openalex.org/keywords/wire-bonding', 'display_name': 'Wire bonding', 'score': 0.47496983}, {'id': 'https://openalex.org/keywords/packaging-engineering', 'display_name': 'Packaging engineering', 'score': 0.42396474}], 'concepts': [{'id': 'https://openalex.org/C79072407', 'wikidata': 'https://www.wikidata.org/wiki/Q432439', 'display_name': 'Flip chip', 'level': 4, 'score': 0.94584787}, {'id': 'https://openalex.org/C94709252', 'wikidata': 'https://www.wikidata.org/wiki/Q570628', 'display_name': 'Ball grid array', 'level': 3, 'score': 0.9107611}, {'id': 'https://openalex.org/C186260285', 'wikidata': 'https://www.wikidata.org/wiki/Q759494', 'display_name': 'Integrated circuit packaging', 'level': 3, 'score': 0.7478676}, {'id': 'https://openalex.org/C184788189', 'wikidata': 'https://www.wikidata.org/wiki/Q130652', 'display_name': 'Package on package', 'level': 4, 'score': 0.7250262}, {'id': 'https://openalex.org/C123745756', 'wikidata': 'https://www.wikidata.org/wiki/Q1665949', 'display_name': 'Interconnection', 'level': 2, 'score': 0.7177613}, {'id': 'https://openalex.org/C126233035', 'wikidata': 'https://www.wikidata.org/wiki/Q5101572', 'display_name': 'Chip-scale package', 'level': 3, 'score': 0.64595675}, {'id': 'https://openalex.org/C125619702', 'wikidata': 'https://www.wikidata.org/wiki/Q7783038', 'display_name': 'Thermal copper pillar bump', 'level': 5, 'score': 0.63209367}, {'id': 'https://openalex.org/C69567186', 'wikidata': 'https://www.wikidata.org/wiki/Q5358403', 'display_name': 'Electronic packaging', 'level': 2, 'score': 0.62845594}, {'id': 'https://openalex.org/C43214815', 'wikidata': 'https://www.wikidata.org/wiki/Q7310987', 'display_name': 'Reliability (semiconductor)', 'level': 3, 'score': 0.6108532}, {'id': 'https://openalex.org/C165005293', 'wikidata': 'https://www.wikidata.org/wiki/Q1074500', 'display_name': 'Chip', 'level': 2, 'score': 0.605566}, {'id': 'https://openalex.org/C162877825', 'wikidata': 'https://www.wikidata.org/wiki/Q2121809', 'display_name': 'Quad Flat No-leads package', 'level': 4, 'score': 0.49654657}, {'id': 'https://openalex.org/C140269135', 'wikidata': 'https://www.wikidata.org/wiki/Q750783', 'display_name': 'Wire bonding', 'level': 3, 'score': 0.47496983}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.4442231}, {'id': 'https://openalex.org/C50296614', 'wikidata': 'https://www.wikidata.org/wiki/Q211387', 'display_name': 'Soldering', 'level': 2, 'score': 0.43518853}, {'id': 'https://openalex.org/C193149544', 'wikidata': 'https://www.wikidata.org/wiki/Q7122904', 'display_name': 'Packaging engineering', 'level': 2, 'score': 0.42396474}, {'id': 'https://openalex.org/C41008148', 'wikidata': 'https://www.wikidata.org/wiki/Q21198', 'display_name': 'Computer science', 'level': 0, 'score': 0.3907982}, {'id': 'https://openalex.org/C24326235', 'wikidata': 'https://www.wikidata.org/wiki/Q126095', 'display_name': 'Electronic engineering', 'level': 1, 'score': 0.37290478}, {'id': 'https://openalex.org/C49040817', 'wikidata': 'https://www.wikidata.org/wiki/Q193091', 'display_name': 'Optoelectronics', 'level': 1, 'score': 0.20132405}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.19581354}, {'id': 'https://openalex.org/C78519656', 'wikidata': 'https://www.wikidata.org/wiki/Q101333', 'display_name': 'Mechanical engineering', 'level': 1, 'score': 0.17539597}, {'id': 'https://openalex.org/C76155785', 'wikidata': 'https://www.wikidata.org/wiki/Q418', 'display_name': 'Telecommunications', 'level': 1, 'score': 0.09790185}, {'id': 'https://openalex.org/C171250308', 'wikidata': 'https://www.wikidata.org/wiki/Q11468', 'display_name': 'Nanotechnology', 'level': 1, 'score': 0.09148073}, {'id': 'https://openalex.org/C165013422', 'wikidata': 'https://www.wikidata.org/wiki/Q4388382', 'display_name': 'Wafer dicing', 'level': 3, 'score': 0.055412233}, {'id': 'https://openalex.org/C68928338', 'wikidata': 'https://www.wikidata.org/wiki/Q131790', 'display_name': 'Adhesive', 'level': 3, 'score': 0.0}, {'id': 'https://openalex.org/C159985019', 'wikidata': 'https://www.wikidata.org/wiki/Q181790', 'display_name': 'Composite material', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C163258240', 'wikidata': 'https://www.wikidata.org/wiki/Q25342', 'display_name': 'Power (physics)', 'level': 2, 'score': 0.0}, {'id': 'https://openalex.org/C2779227376', 'wikidata': 'https://www.wikidata.org/wiki/Q6505497', 'display_name': 'Layer (electronics)', 'level': 2, 'score': 0.0}, {'id': 'https://openalex.org/C62520636', 'wikidata': 'https://www.wikidata.org/wiki/Q944', 'display_name': 'Quantum mechanics', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C121332964', 'wikidata': 'https://www.wikidata.org/wiki/Q413', 'display_name': 'Physics', 'level': 0, 'score': 0.0}, {'id': 'https://openalex.org/C160671074', 'wikidata': 'https://www.wikidata.org/wiki/Q267131', 'display_name': 'Wafer', 'level': 2, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/isapm.1999.757321', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 3, 'referenced_works': ['https://openalex.org/W2027228089', 'https://openalex.org/W2095284351', 'https://openalex.org/W2114416422'], 'related_works': ['https://openalex.org/W618367153', 'https://openalex.org/W2393245046', 'https://openalex.org/W2147337561', 'https://openalex.org/W2118477970', 'https://openalex.org/W2053654711', 'https://openalex.org/W2005904427', 'https://openalex.org/W1997600377', 'https://openalex.org/W1908051044', 'https://openalex.org/W1848535707', 'https://openalex.org/W1496205214'], 'abstract_inverted_index': {'Some': [0], 'of': [1, 12, 41, 46, 79, 85, 142], 'the': [2, 13, 21, 39, 59, 63, 77, 80, 97, 111, 116, 143], 'needs': [3], 'for': [4, 67], 'improved': [5], 'performance': [6], 'can': [7], 'be': [8], 'met': [9], 'with': [10, 33, 115], 'versions': [11], 'packaging': [14, 55], 'solutions': [15, 26], 'that': [16, 90], 'have': [17, 27], 'been': [18], 'developed': [19], 'over': [20, 101], 'last': [22], '5-10': [23], 'years.': [24], 'These': [25], 'typically': [28], 'focused': [29], 'on': [30], 'peripheral': [31, 53], 'packages': [32], 'wire': [34], 'bond': [35], 'chip-to-package': [36], 'interconnects.': [37], 'As': [38], 'number': [40], 'leads': [42], 'increases,': [43], 'this': [44], 'type': [45], 'package': [47, 66, 136], 'becomes': [48], 'problematical.': [49], 'An': [50], 'alternative': [51], 'to': [52, 57, 93], 'interconnect': [54], 'is': [56, 99], 'access': [58], 'unused': [60], 'area': [61, 71, 74, 120, 133], 'under': [62], 'chip': [64, 81, 98, 103, 148], 'and': [65, 126], 'interconnects': [68, 87, 106], 'in': [69], 'an': [70, 83], 'array.': [72], 'In': [73], 'array': [75, 84, 121, 134], 'packaging,': [76, 122], 'surface': [78], 'has': [82], 'solder': [86], '(solder': [88], 'bumps)': [89], 'are': [91, 107, 129], 'joined': [92], 'a': [94], 'substrate': [95], 'when': [96], 'flipped': [100], '(flip': [102], 'packaging).': [104], 'The': [105], 'then': [108], 'redistributed': [109], 'through': [110], 'BGA': [112], 'substrate.': [113], 'Even': [114], 'advantages': [117], 'created': [118], 'by': [119], 'processing,': [123], 'performance,': [124], 'reliability,': [125], 'cost': [127], 'requirements': [128], 'challenging': [130], 'currently': [131], 'available': [132], 'electronic': [135, 149], 'design.': [137], 'This': [138], 'paper': [139], 'addresses': [140], 'some': [141], 'critical': [144], 'challenges': [145], 'facing': [146], 'flip': [147], 'packaging.': [150]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2155179766', 'counts_by_year': [{'year': 2019, 'cited_by_count': 1}, {'year': 2014, 'cited_by_count': 1}, {'year': 2013, 'cited_by_count': 1}, {'year': 2012, 'cited_by_count': 1}], 'updated_date': '2024-12-12T05:24:20.920578', 'created_date': '2016-06-24'}