Title: Interconnect Resistance Characteristics of Several Flip-Chip Bumping and Assembly Techniques
Abstract:Abstract Several flip-chip interconnection methods were compared by measuring interconnect resistance before and after exposure to environments including pre-conditioning, 85°C/85% RH exposure, 150°C ...Abstract Several flip-chip interconnection methods were compared by measuring interconnect resistance before and after exposure to environments including pre-conditioning, 85°C/85% RH exposure, 150°C storage, and 0–100°C temperature cycling. The goal was to determine an acceptable low-cost, reliable method for bumping and assembling chips to flexible or rigid substrates using flip-chip assembly techniques. Alternative flip-chip bumping methods are compared to a traditional wafer solder bumping method. Flip-chip interconnection methods evaluated included high lead content solder, silver filled conductive adhesive, and gold stud bumps. Under bump metallurgies evaluated included bare aluminum, evaporated Cr/Cr–Cu/Cu, and electroless nickel plating.Read More
Publication Year: 1997
Publication Date: 1997-01-01
Language: en
Type: book-chapter
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Cited By Count: 1
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