Publication Information

{'id': 'https://openalex.org/W2013965227', 'doi': 'https://doi.org/10.1109/ectc.2013.6575780', 'title': 'Single chip plated Ni/Pd over ALCAP bond pads for flip chip applications and prototyping', 'display_name': 'Single chip plated Ni/Pd over ALCAP bond pads for flip chip applications and prototyping', 'publication_year': 2013, 'publication_date': '2013-05-01', 'ids': {'openalex': 'https://openalex.org/W2013965227', 'doi': 'https://doi.org/10.1109/ectc.2013.6575780', 'mag': '2013965227'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/ectc.2013.6575780', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'proceedings-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5103098488', 'display_name': 'B.J. Lewis', 'orcid': 'https://orcid.org/0000-0002-5991-0063'}, 'institutions': [], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'Brian J. Lewis', 'raw_affiliation_strings': ['Adv. Assembly Technol., Engent, Inc. - Enabling Next Generation Technol., Norcross, GA, USA'], 'affiliations': [{'raw_affiliation_string': 'Adv. Assembly Technol., Engent, Inc. - Enabling Next Generation Technol., Norcross, GA, USA', 'institution_ids': []}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5110771641', 'display_name': 'Daniel F. Baldwin', 'orcid': None}, 'institutions': [], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'Daniel F. Baldwin', 'raw_affiliation_strings': ['Adv. Assembly Technol., Engent, Inc. - Enabling Next Generation Technol., Norcross, GA, USA'], 'affiliations': [{'raw_affiliation_string': 'Adv. Assembly Technol., Engent, Inc. - Enabling Next Generation Technol., Norcross, GA, USA', 'institution_ids': []}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5019833004', 'display_name': 'Paul N. Houston', 'orcid': None}, 'institutions': [], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'Paul N. Houston', 'raw_affiliation_strings': ['Adv. Assembly Technol., Engent, Inc. - Enabling Next Generation Technol., Norcross, GA, USA'], 'affiliations': [{'raw_affiliation_string': 'Adv. Assembly Technol., Engent, Inc. - Enabling Next Generation Technol., Norcross, GA, USA', 'institution_ids': []}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5103199018', 'display_name': 'Fei Xie', 'orcid': 'https://orcid.org/0000-0001-9345-8317'}, 'institutions': [], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'Fei Xie', 'raw_affiliation_strings': ['Adv. Assembly Technol., Engent, Inc. - Enabling Next Generation Technol., Norcross, GA, USA'], 'affiliations': [{'raw_affiliation_string': 'Adv. Assembly Technol., Engent, Inc. - Enabling Next Generation Technol., Norcross, GA, USA', 'institution_ids': []}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5082138944', 'display_name': 'Le hang La', 'orcid': None}, 'institutions': [], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'Le Hang La', 'raw_affiliation_strings': ['Adv. Assembly Technol., Engent, Inc. - Enabling Next Generation Technol., Norcross, GA, USA'], 'affiliations': [{'raw_affiliation_string': 'Adv. Assembly Technol., Engent, Inc. - Enabling Next Generation Technol., Norcross, GA, USA', 'institution_ids': []}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 0, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 0.0, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 0, 'citation_normalized_percentile': {'value': 0.0, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 0, 'max': 65}, 'biblio': {'volume': None, 'issue': None, 'first_page': '1564', 'last_page': '1568'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.9999, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.9999, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.9994, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11661', 'display_name': 'Copper Interconnects and Reliability', 'score': 0.9799, 'subfield': {'id': 'https://openalex.org/subfields/2504', 'display_name': 'Electronic, Optical and Magnetic Materials'}, 'field': {'id': 'https://openalex.org/fields/25', 'display_name': 'Materials Science'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/bumping', 'display_name': 'Bumping', 'score': 0.9751911}, {'id': 'https://openalex.org/keywords/plating', 'display_name': 'Plating (geology)', 'score': 0.7005758}, {'id': 'https://openalex.org/keywords/wire-bonding', 'display_name': 'Wire bonding', 'score': 0.6228452}, {'id': 'https://openalex.org/keywords/chip-scale-package', 'display_name': 'Chip-scale package', 'score': 0.55017054}, {'id': 'https://openalex.org/keywords/integrated-circuit-packaging', 'display_name': 'Integrated circuit packaging', 'score': 0.493636}, {'id': 'https://openalex.org/keywords/wafer-level-packaging', 'display_name': 'Wafer-level packaging', 'score': 0.453779}, {'id': 'https://openalex.org/keywords/wafer-bonding', 'display_name': 'Wafer Bonding', 'score': 0.42075858}], 'concepts': [{'id': 'https://openalex.org/C2776512755', 'wikidata': 'https://www.wikidata.org/wiki/Q632543', 'display_name': 'Bumping', 'level': 2, 'score': 0.9751911}, {'id': 'https://openalex.org/C79072407', 'wikidata': 'https://www.wikidata.org/wiki/Q432439', 'display_name': 'Flip chip', 'level': 4, 'score': 0.8044425}, {'id': 'https://openalex.org/C2776985018', 'wikidata': 'https://www.wikidata.org/wiki/Q7202314', 'display_name': 'Plating (geology)', 'level': 2, 'score': 0.7005758}, {'id': 'https://openalex.org/C50296614', 'wikidata': 'https://www.wikidata.org/wiki/Q211387', 'display_name': 'Soldering', 'level': 2, 'score': 0.65761036}, {'id': 'https://openalex.org/C140269135', 'wikidata': 'https://www.wikidata.org/wiki/Q750783', 'display_name': 'Wire bonding', 'level': 3, 'score': 0.6228452}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.5812441}, {'id': 'https://openalex.org/C111106434', 'wikidata': 'https://www.wikidata.org/wiki/Q1072430', 'display_name': 'Die (integrated circuit)', 'level': 2, 'score': 0.5563461}, {'id': 'https://openalex.org/C126233035', 'wikidata': 'https://www.wikidata.org/wiki/Q5101572', 'display_name': 'Chip-scale package', 'level': 3, 'score': 0.55017054}, {'id': 'https://openalex.org/C186260285', 'wikidata': 'https://www.wikidata.org/wiki/Q759494', 'display_name': 'Integrated circuit packaging', 'level': 3, 'score': 0.493636}, {'id': 'https://openalex.org/C57528182', 'wikidata': 'https://www.wikidata.org/wiki/Q1271842', 'display_name': 'Miniaturization', 'level': 2, 'score': 0.48984453}, {'id': 'https://openalex.org/C165005293', 'wikidata': 'https://www.wikidata.org/wiki/Q1074500', 'display_name': 'Chip', 'level': 2, 'score': 0.46285975}, {'id': 'https://openalex.org/C51807945', 'wikidata': 'https://www.wikidata.org/wiki/Q3503392', 'display_name': 'Electroplating', 'level': 3, 'score': 0.45966256}, {'id': 'https://openalex.org/C160671074', 'wikidata': 'https://www.wikidata.org/wiki/Q267131', 'display_name': 'Wafer', 'level': 2, 'score': 0.45379272}, {'id': 'https://openalex.org/C2780288131', 'wikidata': 'https://www.wikidata.org/wiki/Q4017648', 'display_name': 'Wafer-level packaging', 'level': 3, 'score': 0.453779}, {'id': 'https://openalex.org/C2779133538', 'wikidata': 'https://www.wikidata.org/wiki/Q677010', 'display_name': 'Wafer bonding', 'level': 3, 'score': 0.42075858}, {'id': 'https://openalex.org/C123745756', 'wikidata': 'https://www.wikidata.org/wiki/Q1665949', 'display_name': 'Interconnection', 'level': 2, 'score': 0.41763398}, {'id': 'https://openalex.org/C78519656', 'wikidata': 'https://www.wikidata.org/wiki/Q101333', 'display_name': 'Mechanical engineering', 'level': 1, 'score': 0.29897267}, {'id': 'https://openalex.org/C530198007', 'wikidata': 'https://www.wikidata.org/wiki/Q80831', 'display_name': 'Integrated circuit', 'level': 2, 'score': 0.25660855}, {'id': 'https://openalex.org/C191897082', 'wikidata': 'https://www.wikidata.org/wiki/Q11467', 'display_name': 'Metallurgy', 'level': 1, 'score': 0.2380541}, {'id': 'https://openalex.org/C41008148', 'wikidata': 'https://www.wikidata.org/wiki/Q21198', 'display_name': 'Computer science', 'level': 0, 'score': 0.23517719}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.20866466}, {'id': 'https://openalex.org/C119599485', 'wikidata': 'https://www.wikidata.org/wiki/Q43035', 'display_name': 'Electrical engineering', 'level': 1, 'score': 0.20229295}, {'id': 'https://openalex.org/C49040817', 'wikidata': 'https://www.wikidata.org/wiki/Q193091', 'display_name': 'Optoelectronics', 'level': 1, 'score': 0.18703711}, {'id': 'https://openalex.org/C159985019', 'wikidata': 'https://www.wikidata.org/wiki/Q181790', 'display_name': 'Composite material', 'level': 1, 'score': 0.16091523}, {'id': 'https://openalex.org/C171250308', 'wikidata': 'https://www.wikidata.org/wiki/Q11468', 'display_name': 'Nanotechnology', 'level': 1, 'score': 0.14213651}, {'id': 'https://openalex.org/C2779227376', 'wikidata': 'https://www.wikidata.org/wiki/Q6505497', 'display_name': 'Layer (electronics)', 'level': 2, 'score': 0.13242432}, {'id': 'https://openalex.org/C76155785', 'wikidata': 'https://www.wikidata.org/wiki/Q418', 'display_name': 'Telecommunications', 'level': 1, 'score': 0.0679051}, {'id': 'https://openalex.org/C68928338', 'wikidata': 'https://www.wikidata.org/wiki/Q131790', 'display_name': 'Adhesive', 'level': 3, 'score': 0.0}, {'id': 'https://openalex.org/C8058405', 'wikidata': 'https://www.wikidata.org/wiki/Q46255', 'display_name': 'Geophysics', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C127313418', 'wikidata': 'https://www.wikidata.org/wiki/Q1069', 'display_name': 'Geology', 'level': 0, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/ectc.2013.6575780', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [{'display_name': 'Industry, innovation and infrastructure', 'id': 'https://metadata.un.org/sdg/9', 'score': 0.51}], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 0, 'referenced_works': [], 'related_works': ['https://openalex.org/W3146287251', 'https://openalex.org/W2744342524', 'https://openalex.org/W2514629641', 'https://openalex.org/W2393005754', 'https://openalex.org/W2256021398', 'https://openalex.org/W2127431783', 'https://openalex.org/W2032914670', 'https://openalex.org/W2018462139', 'https://openalex.org/W2006736367', 'https://openalex.org/W1636976145'], 'abstract_inverted_index': {'Commonly,': [0], 'during': [1], 'the': [2, 12, 18, 37, 54, 81, 103, 127, 135, 168, 176, 201, 205, 254, 294, 309], 'process': [3, 128, 177, 207, 249], 'development': [4], 'cycle': [5], 'for': [6, 17, 39, 147, 217, 250, 263, 286, 331], 'new': [7], 'products,': [8], 'limitations': [9, 60], 'exist': [10], 'on': [11], 'materials': [13], 'that': [14, 80, 213, 320, 334, 355], 'are': [15, 24, 47, 84, 109, 144, 246, 335], 'available': [16, 26, 52, 65], 'prototype': [19], 'work.': [20], 'Most': [21], 'SMT': [22], 'devices': [23, 46], 'readily': [25], 'in': [27, 74, 96, 164, 195, 204, 342], 'different': [28], 'formats': [29], 'and': [30, 87, 102, 178, 234, 273], 'solder': [31, 226, 244, 289, 346, 369], 'alloys': [32], 'to': [33, 49, 117, 120, 134, 158, 174, 192, 339, 364], 'satisfy': [34], 'most': [35], 'of': [36, 105, 129, 180, 183, 266, 269, 288, 308, 312], 'needs': [38], 'passive': [40], 'components,': [41], 'however,': [42], 'many': [43], 'times,': [44], 'IC': [45, 57], 'limited': [48], 'what': [50], 'is': [51, 100, 112, 139, 258, 280], 'from': [53, 62], 'fab': [55], 'or': [56, 79, 98, 238], 'brokers.': [58], 'These': [59], 'range': [61], 'die': [63, 185, 328, 333], 'only': [64], 'with': [66, 186, 293], 'aluminum,': [67], 'wirebond': [68], 'ready': [69], 'I/O': [70, 136], 'metallization,': [71], 'pad': [72, 212], 'layouts': [73], 'fine': [75], 'pitch': [76], 'perimeter': [77], 'patterns': [78], 'silicon': [82], 'wafers': [83], 'already': [85], 'sawn': [86], 'presented': [88], 'as': [89, 225, 302, 304], 'singulated': [90, 160, 184, 255], 'die.': [91, 123, 373], 'For': [92], 'applications': [93], 'where': [94], 'advancement': [95], 'performance': [97], 'miniaturization': [99], 'needed,': [101], 'benefits': [104], 'flip': [106, 218, 256, 291, 347, 371], 'chip': [107, 161, 219, 348, 372], 'technology': [108], 'attractive,': [110], 'it': [111, 215], 'not': [113], 'a': [114, 283, 305, 343, 365], 'trivial': [115], 'task': [116], 'be': [118, 193, 300, 318, 340, 353], 'able': [119], 'use': [121], 'these': [122, 125, 332, 356], 'In': [124], 'cases,': [126], 'adding': [130, 243], 'solderable': [131], 'plating': [132, 150, 165, 206, 231, 235, 297, 323], 'technologies': [133, 143], 'bond': [137, 188, 211], 'pads': [138], 'very': [140, 153], 'favorable.': [141], 'The': [142, 190, 261], 'currently': [145], 'run': [146], 'wafer': [148, 367], 'lever': [149], 'baths,': [151], 'but': [152], 'little': [154], 'has': [155, 171], 'been': [156, 172], 'done': [157], 'evaluate': [159, 175], 'plating.': [162], 'Work': [163], 'Ni/Pd': [166, 230, 322], 'onto': [167, 208, 324], 'ALCAP': [169, 326], 'structure': [170], 'performed': [173], 'feasibility': [179], 'processing': [181], 'groups': [182], 'aluminum': [187, 210], 'pads.': [189], 'work': [191], 'detailed': [194, 301, 306], 'this': [196, 229, 313], 'paper': [197], 'will': [198, 299, 317, 351], 'go': [199], 'through': [200], 'chemistries': [202], 'used': [203, 341], 'an': [209], 'makes': [214], 'suitable': [216], 'processes.': [220], 'Several': [221], 'bumping': [222, 227, 253, 270], 'structures,': [223, 271], 'such': [224], 'over': [228, 236], 'stack': [232], 'up': [233], 'gold': [237], 'copper': [239], 'stud': [240], 'bumps': [241], 'before': [242, 272], 'bumps,': [245], 'evaluated.': [247], 'A': [248], 'low': [251], 'cost': [252], 'chips': [257], 'also': [259, 352], 'detailed.': [260, 281], 'data': [262], 'shear': [264], 'testing': [265], '10': [267], 'variations': [268], 'after': [274], '500': [275], 'liquid': [276], 'thermal': [277], 'shock': [278], 'cycles,': [279], 'Finally,': [282], 'comprehensive': [284], 'study': [285], 'assembly': [287, 314], 'bumped': [290, 370], 'chips,': [292], 'various': [295], 'selective': [296, 321], 'processes,': [298], 'well': [303], 'analysis': [307], 'TC': [310], 'reliability': [311, 360], 'approach.': [315], 'It': [316, 350], 'shown': [319, 354], 'singulated,': [325], 'bare': [327], 'can': [329], 'allow,': [330], 'typically': [336], 'wire': [337], 'bonded,': [338], 'practical': [344], 'approach,': [345], 'process.': [349], 'processes': [357], 'provide': [358], 'reasonable': [359], 'results': [361], 'when': [362], 'compared': [363], 'mainstream,': [366], 'processed,': [368]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2013965227', 'counts_by_year': [], 'updated_date': '2024-12-14T03:47:04.593484', 'created_date': '2016-06-24'}