Publication Information

{'id': 'https://openalex.org/W2111404633', 'doi': 'https://doi.org/10.1109/eptc.2003.1271538', 'title': 'A bump transfer method for flip chip assembly', 'display_name': 'A bump transfer method for flip chip assembly', 'publication_year': 2004, 'publication_date': '2004-04-23', 'ids': {'openalex': 'https://openalex.org/W2111404633', 'doi': 'https://doi.org/10.1109/eptc.2003.1271538', 'mag': '2111404633'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/eptc.2003.1271538', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'proceedings-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5038070272', 'display_name': 'J. Zhang', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I32062511', 'display_name': 'Heriot-Watt University', 'ror': 'https://ror.org/04mghma93', 'country_code': 'GB', 'type': 'education', 'lineage': ['https://openalex.org/I32062511']}], 'countries': ['GB'], 'is_corresponding': False, 'raw_author_name': 'J. Zhang', 'raw_affiliation_strings': ['Dept. of Electr., Electron., & Comput. Eng., Heriot-Watt Univ., Edinburgh, UK'], 'affiliations': [{'raw_affiliation_string': 'Dept. of Electr., Electron., & Comput. Eng., Heriot-Watt Univ., Edinburgh, UK', 'institution_ids': ['https://openalex.org/I32062511']}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5048439891', 'display_name': 'C.H. Wang', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I32062511', 'display_name': 'Heriot-Watt University', 'ror': 'https://ror.org/04mghma93', 'country_code': 'GB', 'type': 'education', 'lineage': ['https://openalex.org/I32062511']}], 'countries': ['GB'], 'is_corresponding': False, 'raw_author_name': 'C.H. Wang', 'raw_affiliation_strings': ['Dept. of Electr., Electron., & Comput. Eng., Heriot-Watt Univ., Edinburgh, UK'], 'affiliations': [{'raw_affiliation_string': 'Dept. of Electr., Electron., & Comput. Eng., Heriot-Watt Univ., Edinburgh, UK', 'institution_ids': ['https://openalex.org/I32062511']}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 1, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 0.0, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 0, 'citation_normalized_percentile': {'value': 0.0, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 0, 'max': 61}, 'biblio': {'volume': None, 'issue': None, 'first_page': '321', 'last_page': '323'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.9997, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.9997, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.9997, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11799', 'display_name': 'Adhesion, Friction, and Surface Interactions', 'score': 0.9968, 'subfield': {'id': 'https://openalex.org/subfields/2211', 'display_name': 'Mechanics of Materials'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/bumping', 'display_name': 'Bumping', 'score': 0.92818415}, {'id': 'https://openalex.org/keywords/wafer-bonding', 'display_name': 'Wafer Bonding', 'score': 0.6472558}, {'id': 'https://openalex.org/keywords/thermocompression-bonding', 'display_name': 'Thermocompression bonding', 'score': 0.58076054}, {'id': 'https://openalex.org/keywords/wire-bonding', 'display_name': 'Wire bonding', 'score': 0.531368}, {'id': 'https://openalex.org/keywords/wafer-level-packaging', 'display_name': 'Wafer-level packaging', 'score': 0.44611105}, {'id': 'https://openalex.org/keywords/chip-scale-package', 'display_name': 'Chip-scale package', 'score': 0.4385189}], 'concepts': [{'id': 'https://openalex.org/C2776512755', 'wikidata': 'https://www.wikidata.org/wiki/Q632543', 'display_name': 'Bumping', 'level': 2, 'score': 0.92818415}, {'id': 'https://openalex.org/C79072407', 'wikidata': 'https://www.wikidata.org/wiki/Q432439', 'display_name': 'Flip chip', 'level': 4, 'score': 0.89451885}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.80482614}, {'id': 'https://openalex.org/C125619702', 'wikidata': 'https://www.wikidata.org/wiki/Q7783038', 'display_name': 'Thermal copper pillar bump', 'level': 5, 'score': 0.692034}, {'id': 'https://openalex.org/C160671074', 'wikidata': 'https://www.wikidata.org/wiki/Q267131', 'display_name': 'Wafer', 'level': 2, 'score': 0.6601396}, {'id': 'https://openalex.org/C2779133538', 'wikidata': 'https://www.wikidata.org/wiki/Q677010', 'display_name': 'Wafer bonding', 'level': 3, 'score': 0.6472558}, {'id': 'https://openalex.org/C201845621', 'wikidata': 'https://www.wikidata.org/wiki/Q1111341', 'display_name': 'Thermocompression bonding', 'level': 3, 'score': 0.58076054}, {'id': 'https://openalex.org/C140269135', 'wikidata': 'https://www.wikidata.org/wiki/Q750783', 'display_name': 'Wire bonding', 'level': 3, 'score': 0.531368}, {'id': 'https://openalex.org/C2780965675', 'wikidata': 'https://www.wikidata.org/wiki/Q145958', 'display_name': 'Polyimide', 'level': 3, 'score': 0.4870165}, {'id': 'https://openalex.org/C49040817', 'wikidata': 'https://www.wikidata.org/wiki/Q193091', 'display_name': 'Optoelectronics', 'level': 1, 'score': 0.4845392}, {'id': 'https://openalex.org/C504270822', 'wikidata': 'https://www.wikidata.org/wiki/Q744', 'display_name': 'Nickel', 'level': 2, 'score': 0.47566026}, {'id': 'https://openalex.org/C165005293', 'wikidata': 'https://www.wikidata.org/wiki/Q1074500', 'display_name': 'Chip', 'level': 2, 'score': 0.47049117}, {'id': 'https://openalex.org/C2780288131', 'wikidata': 'https://www.wikidata.org/wiki/Q4017648', 'display_name': 'Wafer-level packaging', 'level': 3, 'score': 0.44611105}, {'id': 'https://openalex.org/C126233035', 'wikidata': 'https://www.wikidata.org/wiki/Q5101572', 'display_name': 'Chip-scale package', 'level': 3, 'score': 0.4385189}, {'id': 'https://openalex.org/C544778455', 'wikidata': 'https://www.wikidata.org/wiki/Q753', 'display_name': 'Copper', 'level': 2, 'score': 0.43695801}, {'id': 'https://openalex.org/C111106434', 'wikidata': 'https://www.wikidata.org/wiki/Q1072430', 'display_name': 'Die (integrated circuit)', 'level': 2, 'score': 0.41769636}, {'id': 'https://openalex.org/C2779227376', 'wikidata': 'https://www.wikidata.org/wiki/Q6505497', 'display_name': 'Layer (electronics)', 'level': 2, 'score': 0.3822473}, {'id': 'https://openalex.org/C159985019', 'wikidata': 'https://www.wikidata.org/wiki/Q181790', 'display_name': 'Composite material', 'level': 1, 'score': 0.30724514}, {'id': 'https://openalex.org/C171250308', 'wikidata': 'https://www.wikidata.org/wiki/Q11468', 'display_name': 'Nanotechnology', 'level': 1, 'score': 0.25190157}, {'id': 'https://openalex.org/C68928338', 'wikidata': 'https://www.wikidata.org/wiki/Q131790', 'display_name': 'Adhesive', 'level': 3, 'score': 0.22542995}, {'id': 'https://openalex.org/C191897082', 'wikidata': 'https://www.wikidata.org/wiki/Q11467', 'display_name': 'Metallurgy', 'level': 1, 'score': 0.22388059}, {'id': 'https://openalex.org/C119599485', 'wikidata': 'https://www.wikidata.org/wiki/Q43035', 'display_name': 'Electrical engineering', 'level': 1, 'score': 0.14756945}, {'id': 'https://openalex.org/C78519656', 'wikidata': 'https://www.wikidata.org/wiki/Q101333', 'display_name': 'Mechanical engineering', 'level': 1, 'score': 0.08627385}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/eptc.2003.1271538', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 6, 'referenced_works': ['https://openalex.org/W1981664203', 'https://openalex.org/W2115070882', 'https://openalex.org/W2125812821', 'https://openalex.org/W2132768588', 'https://openalex.org/W2182363315', 'https://openalex.org/W4285719527'], 'related_works': ['https://openalex.org/W3146287251', 'https://openalex.org/W2744342524', 'https://openalex.org/W2550547144', 'https://openalex.org/W2393005754', 'https://openalex.org/W2256021398', 'https://openalex.org/W2127431783', 'https://openalex.org/W2045281161', 'https://openalex.org/W2006736367', 'https://openalex.org/W1636976145', 'https://openalex.org/W1480920754'], 'abstract_inverted_index': {'In': [0, 22], 'this': [1, 23], 'paper': [2], 'we': [3], 'describe': [4], 'the': [5, 48, 88, 93], 'development': [6], 'of': [7, 90, 102], 'a': [8, 18, 39], 'new': [9], 'chip/wafer': [10], 'bumping': [11], 'technique': [12], 'for': [13, 51], 'flip': [14, 52], 'chip': [15, 53], 'assembly': [16], 'using': [17, 95], 'bump': [19], 'transfer': [20, 101], 'approach.': [21], 'method,': [24], 'high': [25], 'melting': [26], 'temperature': [27], 'bumps': [28, 35, 56, 61, 91, 106], 'such': [29], 'as': [30], 'copper,': [31], 'nickel': [32, 60, 82], 'and': [33, 44, 57, 59, 83, 100], 'gold': [34, 63, 84], 'are': [36], 'fabricated': [37, 68], 'on': [38, 69, 75], 'low': [40], 'cost,': [41], 'flexible': [42], 'carrier': [43], 'then': [45], 'transferred': [46], 'onto': [47], 'target': [49], 'chip/wafer/board': [50], 'assembly.': [54], 'Gold': [55], 'copper': [58], 'with': [62, 80], 'bonding': [64, 89, 99], 'layer': [65], 'have': [66], 'been': [67, 108], 'polyimide': [70], 'substrates.': [71], 'The': [72], 'aluminum': [73], 'pads': [74], 'test': [76], 'chips': [77, 94], 'were': [78], 're-metallised': [79], 'electroless': [81], 'layers': [85], 'to': [86, 92, 104], 'facilitate': [87], 'thermocompression': [96], 'bonding.': [97], 'Parallel': [98], 'up': [103], '40': [105], 'has': [107], 'achieved.': [109]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2111404633', 'counts_by_year': [], 'updated_date': '2024-12-10T12:46:09.738503', 'created_date': '2016-06-24'}