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{'id': 'https://openalex.org/W2092516244', 'doi': 'https://doi.org/10.1016/s0026-2714(98)00161-9', 'title': 'Interconnect resistance characteristics of several flip-chip bumping and assembly techniques', 'display_name': 'Interconnect resistance characteristics of several flip-chip bumping and assembly techniques', 'publication_year': 1999, 'publication_date': '1999-01-01', 'ids': {'openalex': 'https://openalex.org/W2092516244', 'doi': 'https://doi.org/10.1016/s0026-2714(98)00161-9', 'mag': '2092516244'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1016/s0026-2714(98)00161-9', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S133646729', 'display_name': 'Microelectronics Reliability', 'issn_l': '0026-2714', 'issn': ['0026-2714', '1872-941X'], 'is_oa': False, 'is_in_doaj': False, 'is_core': True, 'host_organization': 'https://openalex.org/P4310320990', 'host_organization_name': 'Elsevier BV', 'host_organization_lineage': ['https://openalex.org/P4310320990'], 'host_organization_lineage_names': ['Elsevier BV'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'journal-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5067200646', 'display_name': 'Earl Nicewarner', 'orcid': None}, 'institutions': [], 'countries': ['US'], 'is_corresponding': True, 'raw_author_name': 'Earl Nicewarner', 'raw_affiliation_strings': ['Orbital Sciences Corporation, 20301 Century Blvd, Germantown, MD 20874, USA'], 'affiliations': [{'raw_affiliation_string': 'Orbital Sciences Corporation, 20301 Century Blvd, Germantown, MD 20874, USA', 'institution_ids': []}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 0, 'corresponding_author_ids': ['https://openalex.org/A5067200646'], 'corresponding_institution_ids': [], 'apc_list': {'value': 2190, 'currency': 'USD', 'value_usd': 2190, 'provenance': 'doaj'}, 'apc_paid': None, 'fwci': 1.903, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 16, 'citation_normalized_percentile': {'value': 0.770675, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 82, 'max': 83}, 'biblio': {'volume': '39', 'issue': '1', 'first_page': '113', 'last_page': '121'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.9998, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.9998, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.997, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T14117', 'display_name': 'Integrated Circuits and Semiconductor Failure Analysis', 'score': 0.9892, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/bumping', 'display_name': 'Bumping', 'score': 0.9976057}, {'id': 'https://openalex.org/keywords/plating', 'display_name': 'Plating (geology)', 'score': 0.5461858}, {'id': 'https://openalex.org/keywords/chip-scale-package', 'display_name': 'Chip-scale package', 'score': 0.51301044}], 'concepts': [{'id': 'https://openalex.org/C2776512755', 'wikidata': 'https://www.wikidata.org/wiki/Q632543', 'display_name': 'Bumping', 'level': 2, 'score': 0.9976057}, {'id': 'https://openalex.org/C79072407', 'wikidata': 'https://www.wikidata.org/wiki/Q432439', 'display_name': 'Flip chip', 'level': 4, 'score': 0.97244644}, {'id': 'https://openalex.org/C123745756', 'wikidata': 'https://www.wikidata.org/wiki/Q1665949', 'display_name': 'Interconnection', 'level': 2, 'score': 0.8487357}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.7388487}, {'id': 'https://openalex.org/C50296614', 'wikidata': 'https://www.wikidata.org/wiki/Q211387', 'display_name': 'Soldering', 'level': 2, 'score': 0.63291454}, {'id': 'https://openalex.org/C165005293', 'wikidata': 'https://www.wikidata.org/wiki/Q1074500', 'display_name': 'Chip', 'level': 2, 'score': 0.5545254}, {'id': 'https://openalex.org/C2776985018', 'wikidata': 'https://www.wikidata.org/wiki/Q7202314', 'display_name': 'Plating (geology)', 'level': 2, 'score': 0.5461858}, {'id': 'https://openalex.org/C126233035', 'wikidata': 'https://www.wikidata.org/wiki/Q5101572', 'display_name': 'Chip-scale package', 'level': 3, 'score': 0.51301044}, {'id': 'https://openalex.org/C125619702', 'wikidata': 'https://www.wikidata.org/wiki/Q7783038', 'display_name': 'Thermal copper pillar bump', 'level': 5, 'score': 0.48262557}, {'id': 'https://openalex.org/C160671074', 'wikidata': 'https://www.wikidata.org/wiki/Q267131', 'display_name': 'Wafer', 'level': 2, 'score': 0.48187837}, {'id': 'https://openalex.org/C49040817', 'wikidata': 'https://www.wikidata.org/wiki/Q193091', 'display_name': 'Optoelectronics', 'level': 1, 'score': 0.4260072}, {'id': 'https://openalex.org/C24326235', 'wikidata': 'https://www.wikidata.org/wiki/Q126095', 'display_name': 'Electronic engineering', 'level': 1, 'score': 0.3586746}, {'id': 'https://openalex.org/C191897082', 'wikidata': 'https://www.wikidata.org/wiki/Q11467', 'display_name': 'Metallurgy', 'level': 1, 'score': 0.34379232}, {'id': 'https://openalex.org/C68928338', 'wikidata': 'https://www.wikidata.org/wiki/Q131790', 'display_name': 'Adhesive', 'level': 3, 'score': 0.3170293}, {'id': 'https://openalex.org/C159985019', 'wikidata': 'https://www.wikidata.org/wiki/Q181790', 'display_name': 'Composite material', 'level': 1, 'score': 0.21842721}, {'id': 'https://openalex.org/C119599485', 'wikidata': 'https://www.wikidata.org/wiki/Q43035', 'display_name': 'Electrical engineering', 'level': 1, 'score': 0.21603239}, {'id': 'https://openalex.org/C78519656', 'wikidata': 'https://www.wikidata.org/wiki/Q101333', 'display_name': 'Mechanical engineering', 'level': 1, 'score': 0.1928904}, {'id': 'https://openalex.org/C41008148', 'wikidata': 'https://www.wikidata.org/wiki/Q21198', 'display_name': 'Computer science', 'level': 0, 'score': 0.17045715}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.14726654}, {'id': 'https://openalex.org/C31258907', 'wikidata': 'https://www.wikidata.org/wiki/Q1301371', 'display_name': 'Computer network', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C2779227376', 'wikidata': 'https://www.wikidata.org/wiki/Q6505497', 'display_name': 'Layer (electronics)', 'level': 2, 'score': 0.0}, {'id': 'https://openalex.org/C8058405', 'wikidata': 'https://www.wikidata.org/wiki/Q46255', 'display_name': 'Geophysics', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C127313418', 'wikidata': 'https://www.wikidata.org/wiki/Q1069', 'display_name': 'Geology', 'level': 0, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1016/s0026-2714(98)00161-9', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S133646729', 'display_name': 'Microelectronics Reliability', 'issn_l': '0026-2714', 'issn': ['0026-2714', '1872-941X'], 'is_oa': False, 'is_in_doaj': False, 'is_core': True, 'host_organization': 'https://openalex.org/P4310320990', 'host_organization_name': 'Elsevier BV', 'host_organization_lineage': ['https://openalex.org/P4310320990'], 'host_organization_lineage_names': ['Elsevier BV'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 6, 'referenced_works': ['https://openalex.org/W1899246935', 'https://openalex.org/W2132399697', 'https://openalex.org/W2159051987', 'https://openalex.org/W2164471226', 'https://openalex.org/W3017271591', 'https://openalex.org/W975081153'], 'related_works': ['https://openalex.org/W58730736', 'https://openalex.org/W3118537264', 'https://openalex.org/W2995133171', 'https://openalex.org/W2971221497', 'https://openalex.org/W2936080818', 'https://openalex.org/W2390800471', 'https://openalex.org/W2148265096', 'https://openalex.org/W2115758801', 'https://openalex.org/W1991382265', 'https://openalex.org/W1640103339'], 'abstract_inverted_index': None, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2092516244', 'counts_by_year': [{'year': 2019, 'cited_by_count': 1}, {'year': 2015, 'cited_by_count': 1}], 'updated_date': '2024-12-16T13:58:29.875143', 'created_date': '2016-06-24'}