Solder bumping methods for flip chip packaging

Name: Work Video:
Duration: 3 min 30 s
Description: A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of these techniques, based on work at MCNC and Unitive Electronics Inc., are provided.
G.A. Rinne
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