Title: Solder Cavity Problems of BGA under Mixing Assembly
Abstract: Elaborate solder cavity problems of BGA under mixing assembly in practice.Introduce the common soldering methods for BGA under mixing assembly and analyze their advantages and disadvantages.Represent the inspection standards of BGA solder cavity.Analyze the reason of lead-free BGA solder cavity through comparing solder joint of lead BGA and lead-free BGA.Put forward the measures to prevent BGA solder cavity.
Publication Year: 2012
Publication Date: 2012-01-01
Language: en
Type: article
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