Title: Void-free and Lead-free Soldering of BGA With Vacuum Reflow Soldering
Abstract: Voids are usually formed in the solder joints after the soldering of BGA.Because of higher soldering temperature,serious oxidation and the special characters of lead-free solder,voids are formed easily for the lead-free soldering of BGA.BGA voids in the solder joints not only influence the electrical and thermal function,but also influence the mechanical robustness.They also influence greatly the long life reliability of BGA.Analyze the mechanism of void formation,and introduces the void-free and lead-free soldering of BGA with vacuum reflow soldering technology.Vacuum reflow soldering technology is a valid technology for the void-free and lead-free soldering of BGA.
Publication Year: 2008
Publication Date: 2008-01-01
Language: en
Type: article
Access and Citation
AI Researcher Chatbot
Get quick answers to your questions about the article from our AI researcher chatbot