Get quick answers to your questions about the article from our AI researcher chatbot
{'id': 'https://openalex.org/W2313417573', 'doi': 'https://doi.org/10.5104/jiep.8.44', 'title': 'Soldering Properties and Interfacial Microstructure of BGA Solder Joints with Sn-Ag-Bi-In Solder', 'display_name': 'Soldering Properties and Interfacial Microstructure of BGA Solder Joints with Sn-Ag-Bi-In Solder', 'publication_year': 2005, 'publication_date': '2005-01-01', 'ids': {'openalex': 'https://openalex.org/W2313417573', 'doi': 'https://doi.org/10.5104/jiep.8.44', 'mag': '2313417573'}, 'language': 'en', 'primary_location': {'is_oa': True, 'landing_page_url': 'https://doi.org/10.5104/jiep.8.44', 'pdf_url': 'https://www.jstage.jst.go.jp/article/jiep1998/8/1/8_1_44/_pdf', 'source': {'id': 'https://openalex.org/S66058762', 'display_name': 'Journal of The Japan Institute of Electronics Packaging', 'issn_l': '1343-9677', 'issn': ['1343-9677', '1884-121X'], 'is_oa': False, 'is_in_doaj': False, 'is_core': False, 'host_organization': 'https://openalex.org/P4324113819', 'host_organization_name': 'Japan Institute of Electronics Packaging', 'host_organization_lineage': ['https://openalex.org/P4324113819'], 'host_organization_lineage_names': ['Japan Institute of Electronics Packaging'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': 'publishedVersion', 'is_accepted': True, 'is_published': True}, 'type': 'article', 'type_crossref': 'journal-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': True, 'oa_status': 'bronze', 'oa_url': 'https://www.jstage.jst.go.jp/article/jiep1998/8/1/8_1_44/_pdf', 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5002871325', 'display_name': 'Atsushi YAMAGUCHI', 'orcid': 'https://orcid.org/0000-0002-8749-5215'}, 'institutions': [{'id': 'https://openalex.org/I1283155146', 'display_name': 'Panasonic (Japan)', 'ror': 'https://ror.org/011tm7n37', 'country_code': 'JP', 'type': 'company', 'lineage': ['https://openalex.org/I1283155146']}], 'countries': ['JP'], 'is_corresponding': False, 'raw_author_name': 'Atsushi YAMAGUCHI', 'raw_affiliation_strings': ['Matsushita Electric Industrial Co., Ltd.'], 'affiliations': [{'raw_affiliation_string': 'Matsushita Electric Industrial Co., Ltd.', 'institution_ids': ['https://openalex.org/I1283155146']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5045159325', 'display_name': 'Yuhei Yamashita', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I1283155146', 'display_name': 'Panasonic (Japan)', 'ror': 'https://ror.org/011tm7n37', 'country_code': 'JP', 'type': 'company', 'lineage': ['https://openalex.org/I1283155146']}], 'countries': ['JP'], 'is_corresponding': False, 'raw_author_name': 'Yuhei YAMASHITA', 'raw_affiliation_strings': ['Matsushita Electric Industrial Co., Ltd.'], 'affiliations': [{'raw_affiliation_string': 'Matsushita Electric Industrial Co., Ltd.', 'institution_ids': ['https://openalex.org/I1283155146']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5065413050', 'display_name': 'Akio Furusawa', 'orcid': 'https://orcid.org/0000-0002-1283-7452'}, 'institutions': [{'id': 'https://openalex.org/I1283155146', 'display_name': 'Panasonic (Japan)', 'ror': 'https://ror.org/011tm7n37', 'country_code': 'JP', 'type': 'company', 'lineage': ['https://openalex.org/I1283155146']}], 'countries': ['JP'], 'is_corresponding': False, 'raw_author_name': 'Akio FURUSAWA', 'raw_affiliation_strings': ['Matsushita Electric Industrial Co., Ltd.'], 'affiliations': [{'raw_affiliation_string': 'Matsushita Electric Industrial Co., Ltd.', 'institution_ids': ['https://openalex.org/I1283155146']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5040543494', 'display_name': 'Kazuto Nishida', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I1283155146', 'display_name': 'Panasonic (Japan)', 'ror': 'https://ror.org/011tm7n37', 'country_code': 'JP', 'type': 'company', 'lineage': ['https://openalex.org/I1283155146']}], 'countries': ['JP'], 'is_corresponding': False, 'raw_author_name': 'Kazuto NISHIDA', 'raw_affiliation_strings': ['Matsushita Electric Industrial Co., Ltd.'], 'affiliations': [{'raw_affiliation_string': 'Matsushita Electric Industrial Co., Ltd.', 'institution_ids': ['https://openalex.org/I1283155146']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5038620474', 'display_name': 'Takashi Hojo', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I98285908', 'display_name': 'Osaka University', 'ror': 'https://ror.org/035t8zc32', 'country_code': 'JP', 'type': 'education', 'lineage': ['https://openalex.org/I98285908']}], 'countries': ['JP'], 'is_corresponding': False, 'raw_author_name': 'Takashi HOJO', 'raw_affiliation_strings': ['Graduate School of Engineering, Osaka University'], 'affiliations': [{'raw_affiliation_string': 'Graduate School of Engineering, Osaka University', 'institution_ids': ['https://openalex.org/I98285908']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5070780675', 'display_name': 'Yosuke Sogo', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I98285908', 'display_name': 'Osaka University', 'ror': 'https://ror.org/035t8zc32', 'country_code': 'JP', 'type': 'education', 'lineage': ['https://openalex.org/I98285908']}], 'countries': ['JP'], 'is_corresponding': False, 'raw_author_name': 'Yosuke SOGO', 'raw_affiliation_strings': ['Graduate School of Engineering, Osaka University'], 'affiliations': [{'raw_affiliation_string': 'Graduate School of Engineering, Osaka University', 'institution_ids': ['https://openalex.org/I98285908']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5044437744', 'display_name': 'Ayako Miwa', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I98285908', 'display_name': 'Osaka University', 'ror': 'https://ror.org/035t8zc32', 'country_code': 'JP', 'type': 'education', 'lineage': ['https://openalex.org/I98285908']}], 'countries': ['JP'], 'is_corresponding': False, 'raw_author_name': 'Ayako MIWA', 'raw_affiliation_strings': ['Graduate School of Engineering, Osaka University'], 'affiliations': [{'raw_affiliation_string': 'Graduate School of Engineering, Osaka University', 'institution_ids': ['https://openalex.org/I98285908']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5006112603', 'display_name': 'Akio Hirose', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I98285908', 'display_name': 'Osaka University', 'ror': 'https://ror.org/035t8zc32', 'country_code': 'JP', 'type': 'education', 'lineage': ['https://openalex.org/I98285908']}], 'countries': ['JP'], 'is_corresponding': False, 'raw_author_name': 'Akio HIROSE', 'raw_affiliation_strings': ['Graduate School of Engineering, Osaka University'], 'affiliations': [{'raw_affiliation_string': 'Graduate School of Engineering, Osaka University', 'institution_ids': ['https://openalex.org/I98285908']}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5008960021', 'display_name': 'Kojiro F. Kobayashi', 'orcid': 'https://orcid.org/0000-0001-6356-1671'}, 'institutions': [{'id': 'https://openalex.org/I98285908', 'display_name': 'Osaka University', 'ror': 'https://ror.org/035t8zc32', 'country_code': 'JP', 'type': 'education', 'lineage': ['https://openalex.org/I98285908']}], 'countries': ['JP'], 'is_corresponding': False, 'raw_author_name': 'Kojiro F. KOBAYASHI', 'raw_affiliation_strings': ['Graduate School of Engineering, Osaka University'], 'affiliations': [{'raw_affiliation_string': 'Graduate School of Engineering, Osaka University', 'institution_ids': ['https://openalex.org/I98285908']}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 2, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 0.0, 'has_fulltext': False, 'cited_by_count': 0, 'citation_normalized_percentile': {'value': 0.0, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 0, 'max': 61}, 'biblio': {'volume': '8', 'issue': '1', 'first_page': '44', 'last_page': '51'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T10460', 'display_name': 'Advances in Lead-free Soldering for Microelectronics', 'score': 0.9964, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T10460', 'display_name': 'Advances in Lead-free Soldering for Microelectronics', 'score': 0.9964, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11527', 'display_name': 'Three-Dimensional Integrated Circuits', 'score': 0.9654, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/ball-grid-array', 'display_name': 'Ball grid array', 'score': 0.951646}, {'id': 'https://openalex.org/keywords/lead-free-solders', 'display_name': 'Lead-free Solders', 'score': 0.514048}, {'id': 'https://openalex.org/keywords/reflow-soldering', 'display_name': 'Reflow soldering', 'score': 0.45583937}, {'id': 'https://openalex.org/keywords/dip-soldering', 'display_name': 'Dip soldering', 'score': 0.44136095}], 'concepts': [{'id': 'https://openalex.org/C50296614', 'wikidata': 'https://www.wikidata.org/wiki/Q211387', 'display_name': 'Soldering', 'level': 2, 'score': 0.96444833}, {'id': 'https://openalex.org/C94709252', 'wikidata': 'https://www.wikidata.org/wiki/Q570628', 'display_name': 'Ball grid array', 'level': 3, 'score': 0.951646}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.7893669}, {'id': 'https://openalex.org/C87976508', 'wikidata': 'https://www.wikidata.org/wiki/Q1498213', 'display_name': 'Microstructure', 'level': 2, 'score': 0.7439983}, {'id': 'https://openalex.org/C191897082', 'wikidata': 'https://www.wikidata.org/wiki/Q11467', 'display_name': 'Metallurgy', 'level': 1, 'score': 0.5741439}, {'id': 'https://openalex.org/C2778413121', 'wikidata': 'https://www.wikidata.org/wiki/Q2136790', 'display_name': 'Reflow soldering', 'level': 3, 'score': 0.45583937}, {'id': 'https://openalex.org/C156893995', 'wikidata': 'https://www.wikidata.org/wiki/Q5279680', 'display_name': 'Dip soldering', 'level': 4, 'score': 0.44136095}, {'id': 'https://openalex.org/C159985019', 'wikidata': 'https://www.wikidata.org/wiki/Q181790', 'display_name': 'Composite material', 'level': 1, 'score': 0.43499282}, {'id': 'https://openalex.org/C97850793', 'wikidata': 'https://www.wikidata.org/wiki/Q1622830', 'display_name': 'Wave soldering', 'level': 3, 'score': 0.41332358}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': True, 'landing_page_url': 'https://doi.org/10.5104/jiep.8.44', 'pdf_url': 'https://www.jstage.jst.go.jp/article/jiep1998/8/1/8_1_44/_pdf', 'source': {'id': 'https://openalex.org/S66058762', 'display_name': 'Journal of The Japan Institute of Electronics Packaging', 'issn_l': '1343-9677', 'issn': ['1343-9677', '1884-121X'], 'is_oa': False, 'is_in_doaj': False, 'is_core': False, 'host_organization': 'https://openalex.org/P4324113819', 'host_organization_name': 'Japan Institute of Electronics Packaging', 'host_organization_lineage': ['https://openalex.org/P4324113819'], 'host_organization_lineage_names': ['Japan Institute of Electronics Packaging'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': 'publishedVersion', 'is_accepted': True, 'is_published': True}], 'best_oa_location': {'is_oa': True, 'landing_page_url': 'https://doi.org/10.5104/jiep.8.44', 'pdf_url': 'https://www.jstage.jst.go.jp/article/jiep1998/8/1/8_1_44/_pdf', 'source': {'id': 'https://openalex.org/S66058762', 'display_name': 'Journal of The Japan Institute of Electronics Packaging', 'issn_l': '1343-9677', 'issn': ['1343-9677', '1884-121X'], 'is_oa': False, 'is_in_doaj': False, 'is_core': False, 'host_organization': 'https://openalex.org/P4324113819', 'host_organization_name': 'Japan Institute of Electronics Packaging', 'host_organization_lineage': ['https://openalex.org/P4324113819'], 'host_organization_lineage_names': ['Japan Institute of Electronics Packaging'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': 'publishedVersion', 'is_accepted': True, 'is_published': True}, 'sustainable_development_goals': [], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 0, 'referenced_works': [], 'related_works': ['https://openalex.org/W2500373933', 'https://openalex.org/W2384982389', 'https://openalex.org/W2381577737', 'https://openalex.org/W2378851622', 'https://openalex.org/W2361190668', 'https://openalex.org/W2353288894', 'https://openalex.org/W2079719989', 'https://openalex.org/W2068324376', 'https://openalex.org/W2014148595', 'https://openalex.org/W1541766859'], 'abstract_inverted_index': {'Sn-Ag-Cuはんだよりも融点が低いSn-Ag-Bi-InはんだのBGA接合部の継手特性にっいて,': [0], 'Sn-Zn-Biはんだの継手特性と比較し,': [1], 'その接合部の界面組織と機械的特性の関係について調べ,': [2], 'その適正リフロープロファイルについて検討した。その結果,': [3], 'BGA対応Sn-3Ag-0.5Cuボールを,': [4, 10], 'Cu/Ni/Au基板電極に実装する場合,': [5], 'Sn-8Zn-3Biはんだは,': [6], '503K以上で実装すると高強度を示し,': [7], 'Sn-3.5Ag-0.5Bi-8Inはんだではより低い493Kで高強度を示し,': [8], '低温で実装する鉛フリーはんだとしてSn-Ag-Bi-In系はんだが有利であることがわかった。また,': [9], 'Cu/Ni/Au基板電極にSn-3.5Ag-0.5Bi-8Inはんだを用いて実装する場合,': [11], '483~493Kで実装すると層状のNi-Sn層が得られ,': [12], '503K以上で実装すると塊状の': [13], '(Cu,': [14], 'Ni)': [15], '6Sn5相を不均一に形成し,': [16], '低い継手強度を示した。このことからBGA対応Sn-3Ag-0.5CuボールをCu/Ni/Au基板電極にSn-3.5Ag-0.5Bi-8Inはんだを用いて実装する場合の適正リフロープロファイルは,': [17], 'リフローピーク温度範囲が483~493Kで実装する必要があり,': [18], 'リフローピーク温度が493Kを超える場合でも冷却速度を2K/s程度と遅くすることで継手強度の低下を防ぐことができることを示した。': [19]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2313417573', 'counts_by_year': [], 'updated_date': '2024-09-14T18:07:31.390128', 'created_date': '2016-06-24'}