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{'id': 'https://openalex.org/W2256082516', 'doi': None, 'title': 'Design of Geometry Rule-Based Expert System for IC Layout Compaction', 'display_name': 'Design of Geometry Rule-Based Expert System for IC Layout Compaction', 'publication_year': 1991, 'publication_date': '1991-01-01', 'ids': {'openalex': 'https://openalex.org/W2256082516', 'mag': '2256082516'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'http://www.dbpia.co.kr/Article/NODE00392497', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S4306419911', 'display_name': 'International Conference on VLSI and CAD', 'issn_l': None, 'issn': None, 'is_oa': False, 'is_in_doaj': False, 'is_core': False, 'host_organization': None, 'host_organization_name': None, 'host_organization_lineage': [], 'host_organization_lineage_names': [], 'type': 'conference'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'proceedings-article', 'indexed_in': [], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5050521938', 'display_name': 'Jae Hwang Lee', 'orcid': None}, 'institutions': [], 'countries': [], 'is_corresponding': False, 'raw_author_name': 'Jae Hwang Lee', 'raw_affiliation_strings': [], 'affiliations': []}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5020076332', 'display_name': 'Chu Shik Jhon', 'orcid': None}, 'institutions': [], 'countries': [], 'is_corresponding': False, 'raw_author_name': 'Chu Shik Jhon', 'raw_affiliation_strings': [], 'affiliations': []}], 'countries_distinct_count': 0, 'institutions_distinct_count': 0, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 0.0, 'has_fulltext': False, 'cited_by_count': 0, 'citation_normalized_percentile': {'value': 0.0, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 0, 'max': 53}, 'biblio': {'volume': '2', 'issue': None, 'first_page': '17', 'last_page': '20'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T11159', 'display_name': 'Design for Manufacture and Assembly in Manufacturing', 'score': 0.998, 'subfield': {'id': 'https://openalex.org/subfields/2209', 'display_name': 'Industrial and Manufacturing Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T11159', 'display_name': 'Design for Manufacture and Assembly in Manufacturing', 'score': 0.998, 'subfield': {'id': 'https://openalex.org/subfields/2209', 'display_name': 'Industrial and Manufacturing Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11245', 'display_name': 'Isogeometric Analysis in Computational Engineering', 'score': 0.9854, 'subfield': {'id': 'https://openalex.org/subfields/2206', 'display_name': 'Computational Mechanics'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11301', 'display_name': 'Chemical Mechanical Polishing in Microelectronics Manufacturing', 'score': 0.9808, 'subfield': {'id': 'https://openalex.org/subfields/2204', 'display_name': 'Biomedical Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/shape-optimization', 'display_name': 'Shape Optimization', 'score': 0.562618}, {'id': 'https://openalex.org/keywords/fixture-design', 'display_name': 'Fixture Design', 'score': 0.541552}, {'id': 'https://openalex.org/keywords/product-cost-estimation', 'display_name': 'Product Cost Estimation', 'score': 0.506523}, {'id': 'https://openalex.org/keywords/nanometric-cutting', 'display_name': 'Nanometric Cutting', 'score': 0.505972}, {'id': 'https://openalex.org/keywords/design-for-manufacture', 'display_name': 'Design for Manufacture', 'score': 0.500638}], 'concepts': [{'id': 'https://openalex.org/C41008148', 'wikidata': 'https://www.wikidata.org/wiki/Q21198', 'display_name': 'Computer science', 'level': 0, 'score': 0.5346267}, {'id': 'https://openalex.org/C2524010', 'wikidata': 'https://www.wikidata.org/wiki/Q8087', 'display_name': 'Geometry', 'level': 1, 'score': 0.49806952}, {'id': 'https://openalex.org/C196715460', 'wikidata': 'https://www.wikidata.org/wiki/Q1414356', 'display_name': 'Compaction', 'level': 2, 'score': 0.49431562}, {'id': 'https://openalex.org/C199639397', 'wikidata': 'https://www.wikidata.org/wiki/Q1788588', 'display_name': 'Engineering drawing', 'level': 1, 'score': 0.39625707}, {'id': 'https://openalex.org/C127313418', 'wikidata': 'https://www.wikidata.org/wiki/Q1069', 'display_name': 'Geology', 'level': 0, 'score': 0.2673243}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.25638753}, {'id': 'https://openalex.org/C33923547', 'wikidata': 'https://www.wikidata.org/wiki/Q395', 'display_name': 'Mathematics', 'level': 0, 'score': 0.18526158}, {'id': 'https://openalex.org/C187320778', 'wikidata': 'https://www.wikidata.org/wiki/Q1349130', 'display_name': 'Geotechnical engineering', 'level': 1, 'score': 0.14007908}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'http://www.dbpia.co.kr/Article/NODE00392497', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S4306419911', 'display_name': 'International Conference on VLSI and CAD', 'issn_l': None, 'issn': None, 'is_oa': False, 'is_in_doaj': False, 'is_core': False, 'host_organization': None, 'host_organization_name': None, 'host_organization_lineage': [], 'host_organization_lineage_names': [], 'type': 'conference'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 0, 'referenced_works': [], 'related_works': ['https://openalex.org/W2271116296', 'https://openalex.org/W2267545961', 'https://openalex.org/W2264992301', 'https://openalex.org/W2261157693', 'https://openalex.org/W2257535085', 'https://openalex.org/W2242671881', 'https://openalex.org/W2237353330', 'https://openalex.org/W2224926665', 'https://openalex.org/W2210834791', 'https://openalex.org/W2204290387', 'https://openalex.org/W2203595539', 'https://openalex.org/W2201737584', 'https://openalex.org/W2199569907', 'https://openalex.org/W2197864408', 'https://openalex.org/W2196939801', 'https://openalex.org/W1940557835', 'https://openalex.org/W1910532406', 'https://openalex.org/W1899348246', 'https://openalex.org/W1897578320', 'https://openalex.org/W1572063519'], 'abstract_inverted_index': None, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2256082516', 'counts_by_year': [], 'updated_date': '2024-08-21T12:01:51.640769', 'created_date': '2016-06-24'}