Publication Information

{'id': 'https://openalex.org/W2102415489', 'doi': 'https://doi.org/10.1109/isapm.2000.869234', 'title': 'Materials and process technology: materials [flip chip assembly]', 'display_name': 'Materials and process technology: materials [flip chip assembly]', 'publication_year': 2000, 'publication_date': '2000-01-01', 'ids': {'openalex': 'https://openalex.org/W2102415489', 'doi': 'https://doi.org/10.1109/isapm.2000.869234', 'mag': '2102415489'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/isapm.2000.869234', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'proceedings-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5044963103', 'display_name': 'R.H. Estes', 'orcid': None}, 'institutions': [], 'countries': ['US'], 'is_corresponding': True, 'raw_author_name': 'R.H. Estes', 'raw_affiliation_strings': ['Polymer Flip Chip Corp., USA'], 'affiliations': [{'raw_affiliation_string': 'Polymer Flip Chip Corp., USA', 'institution_ids': []}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 0, 'corresponding_author_ids': ['https://openalex.org/A5044963103'], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 0.0, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 1, 'citation_normalized_percentile': {'value': 0.460742, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 58, 'max': 65}, 'biblio': {'volume': None, 'issue': None, 'first_page': '1', 'last_page': '6'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.7456, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.7456, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.6659, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T12238', 'display_name': 'Green IT and Sustainability', 'score': 0.6469, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/bumping', 'display_name': 'Bumping', 'score': 0.9800347}, {'id': 'https://openalex.org/keywords/chip-scale-package', 'display_name': 'Chip-scale package', 'score': 0.5065776}, {'id': 'https://openalex.org/keywords/wire-bonding', 'display_name': 'Wire bonding', 'score': 0.46038082}], 'concepts': [{'id': 'https://openalex.org/C79072407', 'wikidata': 'https://www.wikidata.org/wiki/Q432439', 'display_name': 'Flip chip', 'level': 4, 'score': 0.9801694}, {'id': 'https://openalex.org/C2776512755', 'wikidata': 'https://www.wikidata.org/wiki/Q632543', 'display_name': 'Bumping', 'level': 2, 'score': 0.9800347}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.72548795}, {'id': 'https://openalex.org/C165005293', 'wikidata': 'https://www.wikidata.org/wiki/Q1074500', 'display_name': 'Chip', 'level': 2, 'score': 0.53136444}, {'id': 'https://openalex.org/C43214815', 'wikidata': 'https://www.wikidata.org/wiki/Q7310987', 'display_name': 'Reliability (semiconductor)', 'level': 3, 'score': 0.51863855}, {'id': 'https://openalex.org/C125619702', 'wikidata': 'https://www.wikidata.org/wiki/Q7783038', 'display_name': 'Thermal copper pillar bump', 'level': 5, 'score': 0.51679194}, {'id': 'https://openalex.org/C126233035', 'wikidata': 'https://www.wikidata.org/wiki/Q5101572', 'display_name': 'Chip-scale package', 'level': 3, 'score': 0.5065776}, {'id': 'https://openalex.org/C98045186', 'wikidata': 'https://www.wikidata.org/wiki/Q205663', 'display_name': 'Process (computing)', 'level': 2, 'score': 0.48573047}, {'id': 'https://openalex.org/C140269135', 'wikidata': 'https://www.wikidata.org/wiki/Q750783', 'display_name': 'Wire bonding', 'level': 3, 'score': 0.46038082}, {'id': 'https://openalex.org/C49040817', 'wikidata': 'https://www.wikidata.org/wiki/Q193091', 'display_name': 'Optoelectronics', 'level': 1, 'score': 0.3102985}, {'id': 'https://openalex.org/C171250308', 'wikidata': 'https://www.wikidata.org/wiki/Q11468', 'display_name': 'Nanotechnology', 'level': 1, 'score': 0.28766873}, {'id': 'https://openalex.org/C41008148', 'wikidata': 'https://www.wikidata.org/wiki/Q21198', 'display_name': 'Computer science', 'level': 0, 'score': 0.23422188}, {'id': 'https://openalex.org/C78519656', 'wikidata': 'https://www.wikidata.org/wiki/Q101333', 'display_name': 'Mechanical engineering', 'level': 1, 'score': 0.23203897}, {'id': 'https://openalex.org/C68928338', 'wikidata': 'https://www.wikidata.org/wiki/Q131790', 'display_name': 'Adhesive', 'level': 3, 'score': 0.13760555}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.09874779}, {'id': 'https://openalex.org/C2779227376', 'wikidata': 'https://www.wikidata.org/wiki/Q6505497', 'display_name': 'Layer (electronics)', 'level': 2, 'score': 0.07739788}, {'id': 'https://openalex.org/C76155785', 'wikidata': 'https://www.wikidata.org/wiki/Q418', 'display_name': 'Telecommunications', 'level': 1, 'score': 0.059066504}, {'id': 'https://openalex.org/C163258240', 'wikidata': 'https://www.wikidata.org/wiki/Q25342', 'display_name': 'Power (physics)', 'level': 2, 'score': 0.0}, {'id': 'https://openalex.org/C121332964', 'wikidata': 'https://www.wikidata.org/wiki/Q413', 'display_name': 'Physics', 'level': 0, 'score': 0.0}, {'id': 'https://openalex.org/C62520636', 'wikidata': 'https://www.wikidata.org/wiki/Q944', 'display_name': 'Quantum mechanics', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C160671074', 'wikidata': 'https://www.wikidata.org/wiki/Q267131', 'display_name': 'Wafer', 'level': 2, 'score': 0.0}, {'id': 'https://openalex.org/C111919701', 'wikidata': 'https://www.wikidata.org/wiki/Q9135', 'display_name': 'Operating system', 'level': 1, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/isapm.2000.869234', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [{'display_name': 'Industry, innovation and infrastructure', 'id': 'https://metadata.un.org/sdg/9', 'score': 0.51}], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 0, 'referenced_works': [], 'related_works': ['https://openalex.org/W58730736', 'https://openalex.org/W3118537264', 'https://openalex.org/W2995133171', 'https://openalex.org/W2971221497', 'https://openalex.org/W2936080818', 'https://openalex.org/W2390800471', 'https://openalex.org/W2148265096', 'https://openalex.org/W2115758801', 'https://openalex.org/W1991382265', 'https://openalex.org/W1640103339'], 'abstract_inverted_index': {'A': [0], 'new': [1, 84, 94], 'assembly': [2, 7, 70, 85], 'process': [3, 86], 'for': [4, 14, 46, 72], 'flip': [5, 27, 57, 76], 'chip': [6, 28, 58, 77], 'has': [8], 'been': [9], 'demonstrated': [10], 'to': [11, 38], 'be': [12, 39, 101], 'feasible': [13], 'manufacturing.': [15], 'The': [16, 60], 'use': [17], 'of': [18, 25, 55, 96], 'heated': [19], 'thermodes': [20], 'on': [21], 'the': [22, 26, 31, 44, 53, 56, 67], 'bonding': [23], 'heads': [24], 'bonder': [29], 'allows': [30], 'underfill': [32, 47], 'encapsulant,': [33], 'whether': [34], 'film': [35], 'or': [36], 'paste,': [37], 'rapidly': [40], 'cured.': [41], 'This': [42, 83], 'eliminates': [43], 'need': [45], 'after': [48], 'bump': [49], 'attach': [50, 78], 'and': [51, 62], 'improves': [52], 'reliability': [54], 'assembly.': [59], 'NCF': [61], 'NCP': [63], 'processes': [64], 'also': [65], 'offer': [66], 'industry': [68], 'an': [69], 'method': [71], 'achieving': [73], 'high': [74], 'throughput': [75], 'at': [79], 'lower': [80], 'manufacturing': [81], 'costs.': [82], 'couples': [87], 'electrically': [88], 'conductive': [89], 'polymer': [90], 'bumps': [91], 'with': [92], 'a': [93], 'generation': [95], 'polymeric': [97], 'encapsulants': [98], 'that': [99], 'can': [100], 'applied': [102], 'before': [103], 'bumping.': [104]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2102415489', 'counts_by_year': [], 'updated_date': '2025-01-04T05:55:46.607888', 'created_date': '2016-06-24'}