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{'id': 'https://openalex.org/W2003228892', 'doi': 'https://doi.org/10.1016/j.mee.2007.04.119', 'title': 'The evolution of multi-level air gap integration towards 32 nm node interconnects', 'display_name': 'The evolution of multi-level air gap integration towards 32 nm node interconnects', 'publication_year': 2007, 'publication_date': '2007-05-31', 'ids': {'openalex': 'https://openalex.org/W2003228892', 'doi': 'https://doi.org/10.1016/j.mee.2007.04.119', 'mag': '2003228892'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1016/j.mee.2007.04.119', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S158028765', 'display_name': 'Microelectronic Engineering', 'issn_l': '0167-9317', 'issn': ['0167-9317', '1873-5568'], 'is_oa': False, 'is_in_doaj': False, 'is_indexed_in_scopus': True, 'is_core': True, 'host_organization': 'https://openalex.org/P4310320990', 'host_organization_name': 'Elsevier BV', 'host_organization_lineage': ['https://openalex.org/P4310320990'], 'host_organization_lineage_names': ['Elsevier BV'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'journal-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5044280749', 'display_name': 'R. Daamen', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I4210134434', 'display_name': 'NXP (Belgium)', 'ror': 'https://ror.org/031v4g827', 'country_code': 'BE', 'type': 'company', 'lineage': ['https://openalex.org/I109147379', 'https://openalex.org/I4210134434']}], 'countries': ['BE'], 'is_corresponding': False, 'raw_author_name': 'R. Daamen', 'raw_affiliation_strings': ['NXP Semiconductors - Research, Kapeldreef 75, B-3001, Leuven, Belgium'], 'affiliations': [{'raw_affiliation_string': 'NXP Semiconductors - Research, Kapeldreef 75, B-3001, Leuven, Belgium', 'institution_ids': ['https://openalex.org/I4210134434']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5016617031', 'display_name': 'P.H.L. Bancken', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I4210134434', 'display_name': 'NXP (Belgium)', 'ror': 'https://ror.org/031v4g827', 'country_code': 'BE', 'type': 'company', 'lineage': ['https://openalex.org/I109147379', 'https://openalex.org/I4210134434']}], 'countries': ['BE'], 'is_corresponding': False, 'raw_author_name': 'P.H.L. Bancken', 'raw_affiliation_strings': ['NXP Semiconductors - Research, Kapeldreef 75, B-3001, Leuven, Belgium'], 'affiliations': [{'raw_affiliation_string': 'NXP Semiconductors - Research, Kapeldreef 75, B-3001, Leuven, Belgium', 'institution_ids': ['https://openalex.org/I4210134434']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5100686335', 'display_name': 'Việt Hùng Nguyễn', 'orcid': 'https://orcid.org/0000-0001-6729-3520'}, 'institutions': [{'id': 'https://openalex.org/I4210134434', 'display_name': 'NXP (Belgium)', 'ror': 'https://ror.org/031v4g827', 'country_code': 'BE', 'type': 'company', 'lineage': ['https://openalex.org/I109147379', 'https://openalex.org/I4210134434']}], 'countries': ['BE'], 'is_corresponding': False, 'raw_author_name': 'V.H. Nguyen', 'raw_affiliation_strings': ['NXP Semiconductors - Research, Kapeldreef 75, B-3001, Leuven, Belgium'], 'affiliations': [{'raw_affiliation_string': 'NXP Semiconductors - Research, Kapeldreef 75, B-3001, Leuven, Belgium', 'institution_ids': ['https://openalex.org/I4210134434']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5036936503', 'display_name': 'A. Humbert', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I4210134434', 'display_name': 'NXP (Belgium)', 'ror': 'https://ror.org/031v4g827', 'country_code': 'BE', 'type': 'company', 'lineage': ['https://openalex.org/I109147379', 'https://openalex.org/I4210134434']}], 'countries': ['BE'], 'is_corresponding': False, 'raw_author_name': 'A. Humbert', 'raw_affiliation_strings': ['NXP Semiconductors - Research, Kapeldreef 75, B-3001, Leuven, Belgium'], 'affiliations': [{'raw_affiliation_string': 'NXP Semiconductors - Research, Kapeldreef 75, B-3001, Leuven, Belgium', 'institution_ids': ['https://openalex.org/I4210134434']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5084223036', 'display_name': 'G.J.A.M. Verheijden', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I4210134434', 'display_name': 'NXP (Belgium)', 'ror': 'https://ror.org/031v4g827', 'country_code': 'BE', 'type': 'company', 'lineage': ['https://openalex.org/I109147379', 'https://openalex.org/I4210134434']}], 'countries': ['BE'], 'is_corresponding': False, 'raw_author_name': 'G.J.A.M. Verheijden', 'raw_affiliation_strings': ['NXP Semiconductors - Research, Kapeldreef 75, B-3001, Leuven, Belgium'], 'affiliations': [{'raw_affiliation_string': 'NXP Semiconductors - Research, Kapeldreef 75, B-3001, Leuven, Belgium', 'institution_ids': ['https://openalex.org/I4210134434']}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5031787536', 'display_name': 'R.J.O.M. Hoofman', 'orcid': 'https://orcid.org/0000-0001-8740-104X'}, 'institutions': [{'id': 'https://openalex.org/I4210134434', 'display_name': 'NXP (Belgium)', 'ror': 'https://ror.org/031v4g827', 'country_code': 'BE', 'type': 'company', 'lineage': ['https://openalex.org/I109147379', 'https://openalex.org/I4210134434']}], 'countries': ['BE'], 'is_corresponding': False, 'raw_author_name': 'R.J.O.M. Hoofman', 'raw_affiliation_strings': ['NXP Semiconductors - Research, Kapeldreef 75, B-3001, Leuven, Belgium'], 'affiliations': [{'raw_affiliation_string': 'NXP Semiconductors - Research, Kapeldreef 75, B-3001, Leuven, Belgium', 'institution_ids': ['https://openalex.org/I4210134434']}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 1, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': {'value': 2750, 'currency': 'USD', 'value_usd': 2750, 'provenance': 'doaj'}, 'apc_paid': None, 'fwci': 2.113, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 22, 'citation_normalized_percentile': {'value': 0.604726, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 88, 'max': 89}, 'biblio': {'volume': '84', 'issue': '9-10', 'first_page': '2177', 'last_page': '2183'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T11661', 'display_name': 'Copper Interconnects and Reliability', 'score': 1.0, 'subfield': {'id': 'https://openalex.org/subfields/2504', 'display_name': 'Electronic, Optical and Magnetic Materials'}, 'field': {'id': 'https://openalex.org/fields/25', 'display_name': 'Materials Science'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T11661', 'display_name': 'Copper Interconnects and Reliability', 'score': 1.0, 'subfield': {'id': 'https://openalex.org/subfields/2504', 'display_name': 'Electronic, Optical and Magnetic Materials'}, 'field': {'id': 'https://openalex.org/fields/25', 'display_name': 'Materials Science'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T10472', 'display_name': 'Semiconductor materials and devices', 'score': 0.9991, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.9955, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/air-gap', 'display_name': 'Air gap (plumbing)', 'score': 0.7015871}, {'id': 'https://openalex.org/keywords/low-k-dielectric', 'display_name': 'Low-k dielectric', 'score': 0.51429623}, {'id': 'https://openalex.org/keywords/copper-interconnect', 'display_name': 'Copper interconnect', 'score': 0.4974487}], 'concepts': [{'id': 'https://openalex.org/C62064638', 'wikidata': 'https://www.wikidata.org/wiki/Q553878', 'display_name': 'Design for manufacturability', 'level': 2, 'score': 0.8069533}, {'id': 'https://openalex.org/C123745756', 'wikidata': 'https://www.wikidata.org/wiki/Q1665949', 'display_name': 'Interconnection', 'level': 2, 'score': 0.7635425}, {'id': 'https://openalex.org/C50587689', 'wikidata': 'https://www.wikidata.org/wiki/Q4698328', 'display_name': 'Air gap (plumbing)', 'level': 2, 'score': 0.7015871}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.64315814}, {'id': 'https://openalex.org/C54725748', 'wikidata': 'https://www.wikidata.org/wiki/Q7247277', 'display_name': 'Process integration', 'level': 2, 'score': 0.62320536}, {'id': 'https://openalex.org/C62611344', 'wikidata': 'https://www.wikidata.org/wiki/Q1062658', 'display_name': 'Node (physics)', 'level': 2, 'score': 0.5909749}, {'id': 'https://openalex.org/C133386390', 'wikidata': 'https://www.wikidata.org/wiki/Q184996', 'display_name': 'Dielectric', 'level': 2, 'score': 0.54803765}, {'id': 'https://openalex.org/C49040817', 'wikidata': 'https://www.wikidata.org/wiki/Q193091', 'display_name': 'Optoelectronics', 'level': 1, 'score': 0.5228879}, {'id': 'https://openalex.org/C43214815', 'wikidata': 'https://www.wikidata.org/wiki/Q7310987', 'display_name': 'Reliability (semiconductor)', 'level': 3, 'score': 0.51772636}, {'id': 'https://openalex.org/C2779866884', 'wikidata': 'https://www.wikidata.org/wiki/Q1872538', 'display_name': 'Low-k dielectric', 'level': 3, 'score': 0.51429623}, {'id': 'https://openalex.org/C544778455', 'wikidata': 'https://www.wikidata.org/wiki/Q753', 'display_name': 'Copper', 'level': 2, 'score': 0.4974816}, {'id': 'https://openalex.org/C116372231', 'wikidata': 'https://www.wikidata.org/wiki/Q605757', 'display_name': 'Copper interconnect', 'level': 3, 'score': 0.4974487}, {'id': 'https://openalex.org/C61696701', 'wikidata': 'https://www.wikidata.org/wiki/Q770766', 'display_name': 'Engineering physics', 'level': 1, 'score': 0.44855437}, {'id': 'https://openalex.org/C24326235', 'wikidata': 'https://www.wikidata.org/wiki/Q126095', 'display_name': 'Electronic engineering', 'level': 1, 'score': 0.42048758}, {'id': 'https://openalex.org/C41008148', 'wikidata': 'https://www.wikidata.org/wiki/Q21198', 'display_name': 'Computer science', 'level': 0, 'score': 0.3719726}, {'id': 'https://openalex.org/C119599485', 'wikidata': 'https://www.wikidata.org/wiki/Q43035', 'display_name': 'Electrical engineering', 'level': 1, 'score': 0.28156242}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.20053044}, {'id': 'https://openalex.org/C121332964', 'wikidata': 'https://www.wikidata.org/wiki/Q413', 'display_name': 'Physics', 'level': 0, 'score': 0.15462911}, {'id': 'https://openalex.org/C159985019', 'wikidata': 'https://www.wikidata.org/wiki/Q181790', 'display_name': 'Composite material', 'level': 1, 'score': 0.14201674}, {'id': 'https://openalex.org/C21880701', 'wikidata': 'https://www.wikidata.org/wiki/Q2144042', 'display_name': 'Process engineering', 'level': 1, 'score': 0.11991075}, {'id': 'https://openalex.org/C24890656', 'wikidata': 'https://www.wikidata.org/wiki/Q82811', 'display_name': 'Acoustics', 'level': 1, 'score': 0.114029676}, {'id': 'https://openalex.org/C76155785', 'wikidata': 'https://www.wikidata.org/wiki/Q418', 'display_name': 'Telecommunications', 'level': 1, 'score': 0.10349411}, {'id': 'https://openalex.org/C191897082', 'wikidata': 'https://www.wikidata.org/wiki/Q11467', 'display_name': 'Metallurgy', 'level': 1, 'score': 0.0947642}, {'id': 'https://openalex.org/C163258240', 'wikidata': 'https://www.wikidata.org/wiki/Q25342', 'display_name': 'Power (physics)', 'level': 2, 'score': 0.0}, {'id': 'https://openalex.org/C62520636', 'wikidata': 'https://www.wikidata.org/wiki/Q944', 'display_name': 'Quantum mechanics', 'level': 1, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1016/j.mee.2007.04.119', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S158028765', 'display_name': 'Microelectronic Engineering', 'issn_l': '0167-9317', 'issn': ['0167-9317', '1873-5568'], 'is_oa': False, 'is_in_doaj': False, 'is_indexed_in_scopus': True, 'is_core': True, 'host_organization': 'https://openalex.org/P4310320990', 'host_organization_name': 'Elsevier BV', 'host_organization_lineage': ['https://openalex.org/P4310320990'], 'host_organization_lineage_names': ['Elsevier BV'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [{'score': 0.4, 'id': 'https://metadata.un.org/sdg/7', 'display_name': 'Affordable and clean energy'}], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 3, 'referenced_works': ['https://openalex.org/W2024036348', 'https://openalex.org/W2149292790', 'https://openalex.org/W2171281113'], 'related_works': ['https://openalex.org/W2543676755', 'https://openalex.org/W2145301764', 'https://openalex.org/W2137772176', 'https://openalex.org/W2098831203', 'https://openalex.org/W2066080476', 'https://openalex.org/W1998121247', 'https://openalex.org/W1914726055', 'https://openalex.org/W1908492041', 'https://openalex.org/W1656329879', 'https://openalex.org/W1621083431'], 'abstract_inverted_index': None, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2003228892', 'counts_by_year': [{'year': 2019, 'cited_by_count': 1}, {'year': 2018, 'cited_by_count': 2}, {'year': 2015, 'cited_by_count': 1}, {'year': 2013, 'cited_by_count': 2}], 'updated_date': '2025-01-17T16:31:24.087877', 'created_date': '2016-06-24'}