Publication Information

{'id': 'https://openalex.org/W1997947180', 'doi': 'https://doi.org/10.1117/12.2085306', 'title': 'The comparison of various strategies of setting up an OPC repair flow with respect to process window constraints', 'display_name': 'The comparison of various strategies of setting up an OPC repair flow with respect to process window constraints', 'publication_year': 2015, 'publication_date': '2015-03-18', 'ids': {'openalex': 'https://openalex.org/W1997947180', 'doi': 'https://doi.org/10.1117/12.2085306', 'mag': '1997947180'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1117/12.2085306', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S183492911', 'display_name': 'Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE', 'issn_l': '0277-786X', 'issn': ['0277-786X', '1996-756X'], 'is_oa': False, 'is_in_doaj': False, 'is_core': True, 'host_organization': 'https://openalex.org/P4310315543', 'host_organization_name': 'SPIE', 'host_organization_lineage': ['https://openalex.org/P4310315543'], 'host_organization_lineage_names': ['SPIE'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'proceedings-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5057382554', 'display_name': 'Yaojun Du', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I1311218312', 'display_name': 'Semiconductor Manufacturing International (Italy)', 'ror': 'https://ror.org/03bxq3a59', 'country_code': 'IT', 'type': 'company', 'lineage': ['https://openalex.org/I1311218312', 'https://openalex.org/I4210142504']}], 'countries': ['IT'], 'is_corresponding': False, 'raw_author_name': 'Yaojun Du', 'raw_affiliation_strings': ['[Semiconductor Manufacturing International Corporation, China]'], 'affiliations': [{'raw_affiliation_string': '[Semiconductor Manufacturing International Corporation, China]', 'institution_ids': ['https://openalex.org/I1311218312']}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5031625902', 'display_name': 'Yang Qing', 'orcid': 'https://orcid.org/0000-0002-5451-7553'}, 'institutions': [{'id': 'https://openalex.org/I1311218312', 'display_name': 'Semiconductor Manufacturing International (Italy)', 'ror': 'https://ror.org/03bxq3a59', 'country_code': 'IT', 'type': 'company', 'lineage': ['https://openalex.org/I1311218312', 'https://openalex.org/I4210142504']}], 'countries': ['IT'], 'is_corresponding': False, 'raw_author_name': 'Qing Yang', 'raw_affiliation_strings': ['[Semiconductor Manufacturing International Corporation, China]'], 'affiliations': [{'raw_affiliation_string': '[Semiconductor Manufacturing International Corporation, China]', 'institution_ids': ['https://openalex.org/I1311218312']}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 1, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 0.421, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 3, 'citation_normalized_percentile': {'value': 0.588955, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 76, 'max': 79}, 'biblio': {'volume': '9426', 'issue': None, 'first_page': '94261W', 'last_page': '94261W'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T11338', 'display_name': 'Advancements in Photolithography Techniques', 'score': 1.0, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T11338', 'display_name': 'Advancements in Photolithography Techniques', 'score': 1.0, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T14117', 'display_name': 'Integrated Circuits and Semiconductor Failure Analysis', 'score': 0.9971, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11301', 'display_name': 'Advanced Surface Polishing Techniques', 'score': 0.9971, 'subfield': {'id': 'https://openalex.org/subfields/2204', 'display_name': 'Biomedical Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/optical-proximity-correction', 'display_name': 'Optical proximity correction', 'score': 0.88187885}, {'id': 'https://openalex.org/keywords/process-window', 'display_name': 'Process window', 'score': 0.8658023}, {'id': 'https://openalex.org/keywords/retargeting', 'display_name': 'Retargeting', 'score': 0.7309646}], 'concepts': [{'id': 'https://openalex.org/C78371743', 'wikidata': 'https://www.wikidata.org/wiki/Q1672829', 'display_name': 'Optical proximity correction', 'level': 3, 'score': 0.88187885}, {'id': 'https://openalex.org/C2777441419', 'wikidata': 'https://www.wikidata.org/wiki/Q16969460', 'display_name': 'Process window', 'level': 3, 'score': 0.8658023}, {'id': 'https://openalex.org/C2780575108', 'wikidata': 'https://www.wikidata.org/wiki/Q7316652', 'display_name': 'Retargeting', 'level': 2, 'score': 0.7309646}, {'id': 'https://openalex.org/C98045186', 'wikidata': 'https://www.wikidata.org/wiki/Q205663', 'display_name': 'Process (computing)', 'level': 2, 'score': 0.64951193}, {'id': 'https://openalex.org/C41008148', 'wikidata': 'https://www.wikidata.org/wiki/Q21198', 'display_name': 'Computer science', 'level': 0, 'score': 0.5876954}, {'id': 'https://openalex.org/C62611344', 'wikidata': 'https://www.wikidata.org/wiki/Q1062658', 'display_name': 'Node (physics)', 'level': 2, 'score': 0.57658875}, {'id': 'https://openalex.org/C204223013', 'wikidata': 'https://www.wikidata.org/wiki/Q133036', 'display_name': 'Lithography', 'level': 2, 'score': 0.5457085}, {'id': 'https://openalex.org/C160671074', 'wikidata': 'https://www.wikidata.org/wiki/Q267131', 'display_name': 'Wafer', 'level': 2, 'score': 0.5082995}, {'id': 'https://openalex.org/C2776036281', 'wikidata': 'https://www.wikidata.org/wiki/Q48769818', 'display_name': 'Constraint (computer-aided design)', 'level': 2, 'score': 0.46621567}, {'id': 'https://openalex.org/C165005293', 'wikidata': 'https://www.wikidata.org/wiki/Q1074500', 'display_name': 'Chip', 'level': 2, 'score': 0.4354014}, {'id': 'https://openalex.org/C38349280', 'wikidata': 'https://www.wikidata.org/wiki/Q1434290', 'display_name': 'Flow (mathematics)', 'level': 2, 'score': 0.41751593}, {'id': 'https://openalex.org/C11413529', 'wikidata': 'https://www.wikidata.org/wiki/Q8366', 'display_name': 'Algorithm', 'level': 1, 'score': 0.36136037}, {'id': 'https://openalex.org/C199639397', 'wikidata': 'https://www.wikidata.org/wiki/Q1788588', 'display_name': 'Engineering drawing', 'level': 1, 'score': 0.32309806}, {'id': 'https://openalex.org/C78519656', 'wikidata': 'https://www.wikidata.org/wiki/Q101333', 'display_name': 'Mechanical engineering', 'level': 1, 'score': 0.19509262}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.18072149}, {'id': 'https://openalex.org/C154945302', 'wikidata': 'https://www.wikidata.org/wiki/Q11660', 'display_name': 'Artificial intelligence', 'level': 1, 'score': 0.15038353}, {'id': 'https://openalex.org/C33923547', 'wikidata': 'https://www.wikidata.org/wiki/Q395', 'display_name': 'Mathematics', 'level': 0, 'score': 0.12757593}, {'id': 'https://openalex.org/C119599485', 'wikidata': 'https://www.wikidata.org/wiki/Q43035', 'display_name': 'Electrical engineering', 'level': 1, 'score': 0.11408156}, {'id': 'https://openalex.org/C121332964', 'wikidata': 'https://www.wikidata.org/wiki/Q413', 'display_name': 'Physics', 'level': 0, 'score': 0.108056396}, {'id': 'https://openalex.org/C111919701', 'wikidata': 'https://www.wikidata.org/wiki/Q9135', 'display_name': 'Operating system', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C76155785', 'wikidata': 'https://www.wikidata.org/wiki/Q418', 'display_name': 'Telecommunications', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C120665830', 'wikidata': 'https://www.wikidata.org/wiki/Q14620', 'display_name': 'Optics', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C2524010', 'wikidata': 'https://www.wikidata.org/wiki/Q8087', 'display_name': 'Geometry', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C66938386', 'wikidata': 'https://www.wikidata.org/wiki/Q633538', 'display_name': 'Structural engineering', 'level': 1, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1117/12.2085306', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S183492911', 'display_name': 'Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE', 'issn_l': '0277-786X', 'issn': ['0277-786X', '1996-756X'], 'is_oa': False, 'is_in_doaj': False, 'is_core': True, 'host_organization': 'https://openalex.org/P4310315543', 'host_organization_name': 'SPIE', 'host_organization_lineage': ['https://openalex.org/P4310315543'], 'host_organization_lineage_names': ['SPIE'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [{'id': 'https://metadata.un.org/sdg/9', 'display_name': 'Industry, innovation and infrastructure', 'score': 0.53}], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 3, 'referenced_works': ['https://openalex.org/W1514655958', 'https://openalex.org/W1973706142', 'https://openalex.org/W2030803035'], 'related_works': ['https://openalex.org/W4306406015', 'https://openalex.org/W3143665566', 'https://openalex.org/W3013798548', 'https://openalex.org/W2138070010', 'https://openalex.org/W2119081900', 'https://openalex.org/W2064613305', 'https://openalex.org/W2050847819', 'https://openalex.org/W2013214626', 'https://openalex.org/W1987855151', 'https://openalex.org/W1976544989'], 'abstract_inverted_index': {'The': [0], 'optical': [1], 'proximity': [2], 'correction': [3], '(OPC)': [4], 'designs': [5], 'a': [6, 35, 42, 73, 188, 220, 225], 'biased': [7], 'mask': [8], 'so': [9], 'as': [10], 'to': [11, 96, 107, 140, 152, 163, 200, 218], 'ensure': [12], 'the': [13, 22, 28, 53, 87, 115, 120, 172, 177, 182, 192, 202, 207], 'after-development-inspection': [14], '(ADI)': [15], 'contours': [16, 51, 61], 'could': [17, 137], 'be': [18, 126, 138], 'on': [19, 38, 65, 86, 110, 191, 224], 'target.': [20], 'Meanwhile,': [21], 'lithographic': [23], 'manufacture': [24], 'process': [25, 101], 'is': [26, 91], 'approaching': [27], 'sub': [29], '28': [30], 'nm': [31], 'technology': [32], 'node,': [33], 'imposing': [34], 'tremendous': [36], 'challenge': [37], 'OPC': [39, 44, 82], 'engineers.': [40], 'Even': [41], 'well-tuned': [43], 'recipe': [45], 'can': [46, 78, 170], 'render': [47], 'many': [48], 'off-target': [49, 60], 'simulated': [50], 'for': [52, 167, 206], 'most': [54, 203], 'up-to-date': [55], 'chip': [56], 'designs;': [57], 'and': [58, 100, 123, 130, 144, 209], 'these': [59, 81, 196], 'indicate': [62], 'highly': [63, 221], 'possible': [64], 'wafer': [66, 111], 'weak': [67, 83, 112], 'points.': [68, 113], 'We': [69, 186], 'have': [70, 160], 'recently': [71], 'developed': [72], 'high-performance': [74], 'repair': [75, 223], 'flow': [76], 'that': [77, 93], 'automatically': [79], 'correct': [80], 'points': [84], 'based': [85], 'retargeting': [88], 'procedure.': [89], 'It': [90], 'expected': [92], 'one': [94, 169], 'has': [95], 'take': [97], 'both': [98, 142], 'nominal': [99, 121, 143, 173, 208], 'window': [102], '(PW)': [103], 'conditions': [104], 'into': [105], 'account': [106], 'avoid': [108], 'potential': [109], 'For': [114], 'contact': [116, 226], 'holes,': [117], 'we': [118], 'require': [119], 'CD': [122, 125, 146, 179], 'PW': [124, 145, 178, 183, 210], 'at': [127], 'least': [128], '<i>CD</i><sub>nom</sub>': [129], '<i>CD</i><sub>pw</sub>,': [131], 'respectively.': [132], 'In': [133, 155], 'some': [134], 'cases,': [135], 'it': [136], 'difficult': [139], 'satisfy': [141], 'constraints': [147], 'which': [148], 'may': [149, 215], 'pose': [150], 'conflicts': [151], 'each': [153], 'other.': [154], 'this': [156], 'work,': [157], 'various': [158, 193], 'strategies': [159], 'been': [161], 'used': [162], 'accommodate': [164], 'such': [165], 'conflicts;': [166], 'instance,': [168], 'release': [171], 'constraint': [174], 'or': [175], 'replace': [176], 'constrain': [180], 'by': [181], 'area': [184], 'constrain.': [185], 'perform': [187, 219], 'systematic': [189], 'study': [190], 'specifications': [194, 214], 'of': [195], 'constraints,': [197], 'in': [198], 'order': [199], 'select': [201], 'optimal': [204], 'setup': [205], 'constraints.': [211], 'These': [212], 'optimized': [213], 'allow': [216], 'us': [217], 'efficient': [222], 'layer.': [227]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W1997947180', 'counts_by_year': [{'year': 2017, 'cited_by_count': 1}, {'year': 2016, 'cited_by_count': 1}, {'year': 2015, 'cited_by_count': 1}], 'updated_date': '2024-12-17T02:49:43.749847', 'created_date': '2016-06-24'}