Title: Thermal resistance of thermal conductive adhesive anchored carbon nanotubes interface material
Abstract: Due to their high intrinsic axial thermal conductivity, carbon nanotube (CNT) arrays have generated much interest as next generation thermal interface materials. A significant barrier in their future use is CNT-substrate thermal boundary resistance. For this reason much research has been done in examining improved array adhesion methods. This paper models the thermal resistance of a novel interface structure which shows promise in achieving low thermal resistance and high mechanical compliance. Through the use of a thermal conductive adhesive attachment, overall thermal resistances below 1 mm2 KW−1 can potentially be achieved using a vertically aligned CNT array, which will enable development of future high performance electronic packages.
Publication Year: 2015
Publication Date: 2015-10-01
Language: en
Type: article
Indexed In: ['crossref']
Access and Citation
Cited By Count: 24
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