Title: A Study of Thermal Interface Materials with Different Thermal Conductivity for HFCBGA Package
Abstract: As the chip integration level increases and the chip power consumption density increases, reducing the internal thermal resistance of package becomes the main consideration of thermal design. Currently, the widely used HFCBGA is a thermally enhanced FCBGA mounting a metal heat spreader on the back of the chip through thermal interface materials(TIM), which is applied with various high-heat-conducting filler. Selecting a highly thermally conductive TIM is already a key thermal performance index to reduce thermal resistance of junction to case. Through these series of studies, We found that one TIM material is an effective method to solve the heat dissipation problem and have also been qualification.
Publication Year: 2021
Publication Date: 2021-03-14
Language: en
Type: article
Indexed In: ['crossref']
Access and Citation
AI Researcher Chatbot
Get quick answers to your questions about the article from our AI researcher chatbot