Title: Next Generation Solder Jetted Wafer Bumping for Very Fine Pitch FlipChip Technology Applications and Beyond
Abstract: The following paper presents an overview of solder jetting technology relative to flipchip wafer bumping. Jetting techniques, parameters and effects are discussed as well as bump formation, and process application solutions for the future demand of flipchip interconnect wafer bumping technology.
Publication Year: 1999
Publication Date: 1999-01-01
Language: en
Type: article
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Cited By Count: 6
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