Title: Development History of the Double-sided Cooling Power Module Considering Electronic, Thermal and Mechanical Characteristics of Silicon Power Semiconductor Chips
Abstract:Since smaller thermal-resistance design is indispensable for automotive IGBT modules, the double-sided cooling power module and stacked cooler have been developed. However, it has not known that the F...Since smaller thermal-resistance design is indispensable for automotive IGBT modules, the double-sided cooling power module and stacked cooler have been developed. However, it has not known that the FS-IGBT played an extremely important role in exquisite combination of. Therefore, we have reviewed the bottlenecks from the viewpoint of the power semiconductor chips in the power module, named as “Power-Card”, followed by the basic functions the chips should have. Further, we have recognized that the paradigm shift from “Power semiconductor device first” to “Power module first” has strongly pushed forward realization.Read More
Publication Year: 2020
Publication Date: 2020-02-29
Language: en
Type: article
Indexed In: ['crossref']
Access and Citation
Cited By Count: 2
AI Researcher Chatbot
Get quick answers to your questions about the article from our AI researcher chatbot