Title: Dielectric Planarization using Mn2O3 Slurry
Abstract: We have developed an MQO~ slurry for dielectric planarization for the first time. Our Mn2O3 slurry has 4 times the removal rate of conventional slurry. The removal rate for this slurry remains constant for between 1 wt% and 10 wt% solid concentration. Pad-conditioning-free polish was successfully realized. We demonstrated that this slurry is
Publication Year: 1997
Publication Date: 1997-06-01
Language: en
Type: article
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