Title: Selective recovery of Copper from waste mobile phone printed circuit boards using Sulphuric acid leaching
Abstract: In the present study, the leaching of Cu(II) from the waste mobile phone printed circuit board (WM-PCB) was investigated using concentrated sulphuric acid solution. Cu(II)) uptake efficiency was determined at varying pH (pH 2.0 – pH 8.0), temperatures (40 oC-80 oC) and treatment time (15 - 90 min). It was observed that the copper uptake increased with increasing temperature and acid concentration. The highest Cu(II) uptake was found to be 190 mg/g at pH 6.0 and 80°C within 60 min. Results indicate that sulphuric acid has the potential to recover the heavy metals from WM-PCB.
Publication Year: 2018
Publication Date: 2018-01-01
Language: en
Type: article
Indexed In: ['crossref']
Access and Citation
Cited By Count: 16
AI Researcher Chatbot
Get quick answers to your questions about the article from our AI researcher chatbot