Publication Information

{'id': 'https://openalex.org/W2791985906', 'doi': 'https://doi.org/10.1016/j.addma.2018.02.008', 'title': 'Effect of size, morphology, and synthesis method on the thermal and sintering properties of copper nanoparticles for use in microscale additive manufacturing processes', 'display_name': 'Effect of size, morphology, and synthesis method on the thermal and sintering properties of copper nanoparticles for use in microscale additive manufacturing processes', 'publication_year': 2018, 'publication_date': '2018-03-02', 'ids': {'openalex': 'https://openalex.org/W2791985906', 'doi': 'https://doi.org/10.1016/j.addma.2018.02.008', 'mag': '2791985906'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1016/j.addma.2018.02.008', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S2764842179', 'display_name': 'Additive manufacturing', 'issn_l': '2214-7810', 'issn': ['2214-7810', '2214-8604'], 'is_oa': False, 'is_in_doaj': False, 'is_core': True, 'host_organization': 'https://openalex.org/P4310320990', 'host_organization_name': 'Elsevier BV', 'host_organization_lineage': ['https://openalex.org/P4310320990'], 'host_organization_lineage_names': ['Elsevier BV'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'journal-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5001934189', 'display_name': 'Nilabh K. Roy', 'orcid': 'https://orcid.org/0000-0001-6553-2874'}, 'institutions': [{'id': 'https://openalex.org/I86519309', 'display_name': 'The University of Texas at Austin', 'ror': 'https://ror.org/00hj54h04', 'country_code': 'US', 'type': 'education', 'lineage': ['https://openalex.org/I86519309']}], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'Nilabh K. Roy', 'raw_affiliation_strings': ['Department of Mechanical Engineering, The University of Texas at Austin, Austin, TX, 78712, USA'], 'affiliations': [{'raw_affiliation_string': 'Department of Mechanical Engineering, The University of Texas at Austin, Austin, TX, 78712, USA', 'institution_ids': ['https://openalex.org/I86519309']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5042470906', 'display_name': 'Chee S. Foong', 'orcid': 'https://orcid.org/0000-0002-4307-2333'}, 'institutions': [], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'Chee S. Foong', 'raw_affiliation_strings': ['NXP Semiconductors Austin, TX, 78735, USA'], 'affiliations': [{'raw_affiliation_string': 'NXP Semiconductors Austin, TX, 78735, USA', 'institution_ids': []}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5052106224', 'display_name': 'Michael Cullinan', 'orcid': 'https://orcid.org/0000-0001-8256-7921'}, 'institutions': [{'id': 'https://openalex.org/I86519309', 'display_name': 'The University of Texas at Austin', 'ror': 'https://ror.org/00hj54h04', 'country_code': 'US', 'type': 'education', 'lineage': ['https://openalex.org/I86519309']}], 'countries': ['US'], 'is_corresponding': True, 'raw_author_name': 'Michael A. Cullinan', 'raw_affiliation_strings': ['Department of Mechanical Engineering, The University of Texas at Austin, Austin, TX, 78712, USA'], 'affiliations': [{'raw_affiliation_string': 'Department of Mechanical Engineering, The University of Texas at Austin, Austin, TX, 78712, USA', 'institution_ids': ['https://openalex.org/I86519309']}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 1, 'corresponding_author_ids': ['https://openalex.org/A5052106224'], 'corresponding_institution_ids': ['https://openalex.org/I86519309'], 'apc_list': {'value': 3350, 'currency': 'USD', 'value_usd': 3350, 'provenance': 'doaj'}, 'apc_paid': None, 'fwci': 2.237, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 40, 'citation_normalized_percentile': {'value': 0.999885, 'is_in_top_1_percent': True, 'is_in_top_10_percent': True}, 'cited_by_percentile_year': {'min': 95, 'max': 96}, 'biblio': {'volume': '21', 'issue': None, 'first_page': '17', 'last_page': '29'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T10783', 'display_name': 'Additive Manufacturing and 3D Printing Technologies', 'score': 0.9997, 'subfield': {'id': 'https://openalex.org/subfields/2203', 'display_name': 'Automotive Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T10783', 'display_name': 'Additive Manufacturing and 3D Printing Technologies', 'score': 0.9997, 'subfield': {'id': 'https://openalex.org/subfields/2203', 'display_name': 'Automotive Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11523', 'display_name': 'Nanomaterials and Printing Technologies', 'score': 0.9992, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T12080', 'display_name': 'Injection Molding Process and Properties', 'score': 0.9943, 'subfield': {'id': 'https://openalex.org/subfields/2210', 'display_name': 'Mechanical Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/microscale-chemistry', 'display_name': 'Microscale chemistry', 'score': 0.58994937}, {'id': 'https://openalex.org/keywords/microelectronics', 'display_name': 'Microelectronics', 'score': 0.4213258}], 'concepts': [{'id': 'https://openalex.org/C2777581544', 'wikidata': 'https://www.wikidata.org/wiki/Q844613', 'display_name': 'Sintering', 'level': 2, 'score': 0.952398}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.9137237}, {'id': 'https://openalex.org/C544778455', 'wikidata': 'https://www.wikidata.org/wiki/Q753', 'display_name': 'Copper', 'level': 2, 'score': 0.6365967}, {'id': 'https://openalex.org/C155672457', 'wikidata': 'https://www.wikidata.org/wiki/Q61231', 'display_name': 'Nanoparticle', 'level': 2, 'score': 0.6344066}, {'id': 'https://openalex.org/C179428855', 'wikidata': 'https://www.wikidata.org/wiki/Q1069216', 'display_name': 'Microscale chemistry', 'level': 2, 'score': 0.58994937}, {'id': 'https://openalex.org/C191897082', 'wikidata': 'https://www.wikidata.org/wiki/Q11467', 'display_name': 'Metallurgy', 'level': 1, 'score': 0.50519377}, {'id': 'https://openalex.org/C42360764', 'wikidata': 'https://www.wikidata.org/wiki/Q83588', 'display_name': 'Chemical engineering', 'level': 1, 'score': 0.49744466}, {'id': 'https://openalex.org/C187937830', 'wikidata': 'https://www.wikidata.org/wiki/Q175403', 'display_name': 'Microelectronics', 'level': 2, 'score': 0.4213258}, {'id': 'https://openalex.org/C171250308', 'wikidata': 'https://www.wikidata.org/wiki/Q11468', 'display_name': 'Nanotechnology', 'level': 1, 'score': 0.30801463}, {'id': 'https://openalex.org/C145420912', 'wikidata': 'https://www.wikidata.org/wiki/Q853077', 'display_name': 'Mathematics education', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C33923547', 'wikidata': 'https://www.wikidata.org/wiki/Q395', 'display_name': 'Mathematics', 'level': 0, 'score': 0.0}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1016/j.addma.2018.02.008', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S2764842179', 'display_name': 'Additive manufacturing', 'issn_l': '2214-7810', 'issn': ['2214-7810', '2214-8604'], 'is_oa': False, 'is_in_doaj': False, 'is_core': True, 'host_organization': 'https://openalex.org/P4310320990', 'host_organization_name': 'Elsevier BV', 'host_organization_lineage': ['https://openalex.org/P4310320990'], 'host_organization_lineage_names': ['Elsevier BV'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 46, 'referenced_works': ['https://openalex.org/W1634155355', 'https://openalex.org/W1971358984', 'https://openalex.org/W1974761646', 'https://openalex.org/W1976691526', 'https://openalex.org/W1978879292', 'https://openalex.org/W1981400853', 'https://openalex.org/W1982295247', 'https://openalex.org/W1985878185', 'https://openalex.org/W1991031733', 'https://openalex.org/W1993630876', 'https://openalex.org/W2006158269', 'https://openalex.org/W2014536837', 'https://openalex.org/W2016098933', 'https://openalex.org/W2018810456', 'https://openalex.org/W2039255981', 'https://openalex.org/W2044336958', 'https://openalex.org/W2044753715', 'https://openalex.org/W2045496055', 'https://openalex.org/W2057627631', 'https://openalex.org/W2059553194', 'https://openalex.org/W2063205629', 'https://openalex.org/W2070496096', 'https://openalex.org/W2075322704', 'https://openalex.org/W2075904030', 'https://openalex.org/W2078000276', 'https://openalex.org/W2083883127', 'https://openalex.org/W2089807342', 'https://openalex.org/W2097519580', 'https://openalex.org/W2117151781', 'https://openalex.org/W2127774825', 'https://openalex.org/W2138603029', 'https://openalex.org/W2142439650', 'https://openalex.org/W2145413915', 'https://openalex.org/W2152225738', 'https://openalex.org/W2155411109', 'https://openalex.org/W2184918214', 'https://openalex.org/W2288452701', 'https://openalex.org/W2484747667', 'https://openalex.org/W2524801328', 'https://openalex.org/W3105427634', 'https://openalex.org/W3140674912', 'https://openalex.org/W3192278336', 'https://openalex.org/W3209714317', 'https://openalex.org/W3210589474', 'https://openalex.org/W3211900342', 'https://openalex.org/W4231588140'], 'related_works': ['https://openalex.org/W4286285965', 'https://openalex.org/W2808411755', 'https://openalex.org/W2465699412', 'https://openalex.org/W2381864073', 'https://openalex.org/W2378045033', 'https://openalex.org/W2344770014', 'https://openalex.org/W2184236617', 'https://openalex.org/W2092867183', 'https://openalex.org/W1979808816', 'https://openalex.org/W1565353949'], 'abstract_inverted_index': None, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2791985906', 'counts_by_year': [{'year': 2024, 'cited_by_count': 8}, {'year': 2023, 'cited_by_count': 8}, {'year': 2022, 'cited_by_count': 8}, {'year': 2021, 'cited_by_count': 4}, {'year': 2020, 'cited_by_count': 5}, {'year': 2019, 'cited_by_count': 4}, {'year': 2018, 'cited_by_count': 3}], 'updated_date': '2024-12-16T05:01:30.742170', 'created_date': '2018-03-29'}