Title: Building pixel detector modules in multi chip module deposited technology
Abstract: The MCM-D technique has been used to build hybrid pixel detector modules and single chip assemblies with optimized sensor geometry. Results of test measurements in both a laboratory and a test beam environment are given.
Publication Year: 2005
Publication Date: 2005-08-10
Language: en
Type: article
Indexed In: ['crossref']
Access and Citation
Cited By Count: 3
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