Title: ANALYSIS OF ELECTRONIC PACKAGE COOLING IN AN AIRCRAFT USING CFD
Abstract: A problem of interest of the aeronautical industry is the positioning of electronic equipments in racks and the associated ventilation system project to guarantee the equipment operational conditions. The relevance of the proper operation of electronic equipments increases considerably when high economical costs, performance reduction and safety are involved. The appropriate operational conditions of the electronic components happen when the working temperature of the equipment installed in the rack is inside a safety project temperature band. Therefore, the analysis and modelling of heat transfer processes for aircraft rack design becomes mandatory. This paper presents a parametric study considering volumetric and superficial heat generation in electronic equipment within racks in an aircraft. Simulations were performed using the commercial CFD Fluent code and results were compared to experimental data. Simulation results considering volumetric heat generation show higher temperatures of the electronic equipment, with lower velocities in the racks, than those with superficial heat generation.
Publication Year: 2005
Publication Date: 2005-01-01
Language: en
Type: article
Access and Citation
Cited By Count: 1
AI Researcher Chatbot
Get quick answers to your questions about the article from our AI researcher chatbot