Title: A 3-D wafer level hermetical packaging for MEMS
Abstract: In this paper, a 3D wafer-level hermetical packaging solution for micro-electromechanical-system (MEMS) is presented. The MEMS wafer is sandwiched between a top glass wafer and a bottom Si substrate wafer. With the assistance of a gold intermediate layer, the bottom Si wafer is hermetically sealed to the MEMS wafer with 3D electric feed-through connecting the metal pads on MEMS wafer with solder balls or bonding pads on bottom wafer for flip chip process. The bond strength is higher than 5 MPa.
Publication Year: 2004
Publication Date: 2004-01-01
Language: en
Type: article
Indexed In: ['crossref']
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Cited By Count: 1
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