Title: Application of Optical Methods in Microelectronics Packaging
Abstract: Thermo-mechanical analysis is very important in the design and manufacturing of microelectronics package. The main concerns in packaging reliability include temperature distributions, thermally induced deformations and interfacial adhesion at the critical interfaces of the microelectronics packages. Experimental mechanics plays an important role in packaging thermo-mechanical analysis and reliability assessment. With their inherent parallel processing capability, the optical methods used in experimental mechanics can offer in-situ and whole-field displacement measurement with various sensitivities and resolutions for the microelectronics packaging applications. In this paper, discussions are given on applications of advanced optical techniques for the thermo-mechanical analysis of microelectronics packages. Examples are used to demonstrate the real world applications of these optical methods in the development and qualification of advanced packages.
Publication Year: 2007
Publication Date: 2007-01-01
Language: en
Type: article
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Cited By Count: 1
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