Title: Corrosion behavior of electroless nickel-copper-phosphorus deposit in sulfuric acid solution
Abstract: To improve the corrosion resistance of electroless Ni-P coating, Ni-Cu-P coatings were prepared by adding different mass concentrations of anhydrous copper sulfate to a bath comprising NiSO4 ·6H2O 25 g/L, NaH2PO2·H2O 25 g/L, C6H5O7Na3 ·2H2O 12 g/L, and CH3 COONa 20 g/L. The corrosion resistance of Ni-Cu-P and Ni-P coatings in 5wt% H2SO4 solution was studied by immersion, potentiodynamic polarization, and electrochemical impedance spectroscopy (EIS). The surface morphologies of coatings were observed by SEM. The results showed that the Ni-Cu-P coatings have smaller crystal grains and a more compact structure than the Ni-P coating, and present better corrosion resistance in H2SO4 solution. The Ni-Cu-P coating prepared with 0.50 g/L Cu2SO4 in bath features the smallest grain size, the best compactness, and the largest film resistance and charge transfer resistance, which are 4 times and 32 times that of the Ni-P coating, respectively.
Publication Year: 2012
Publication Date: 2012-01-01
Language: en
Type: article
Access and Citation
AI Researcher Chatbot
Get quick answers to your questions about the article from our AI researcher chatbot