Title: Experimental Study and Numerical Simulation ona novel Heat Pipe radiator for Electronic Element
Abstract: With the continuous development of power electronics,thermal managements of high-density and asymmetric power distributions have been becoming strategically important.Heat pipes for efficient heat transfer components,has been widely used in electronics cooling technology research.In this paper,a new plate type heat pipe for the numerical simulation and experimental research.According to electronic devices operating conditions,the establishment of a radiator performance test systems,a series of experimental research and numerical simulation of heat sink has been made.Results show that the flat heat pipe can effectively improve the thermal performance CPU chip,the chip heat generation in the post-160W for its best working condition.Finally,the thermal analysis of flat heat pipe base has been optimized.By changing the conductivity and to expand the size of analog chips,it can further improve the cooling effect of heat sink,receive some valuable conclusions.All the above achievements help to promote the study of heat sinks,as well as it can be used to design and optimizing of heat sinks.
Publication Year: 2010
Publication Date: 2010-01-01
Language: en
Type: article
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