Title: THE REVIEW AND PROSPECT OF COPPER-MATRIX COMPOSITES FOR ELECTRONIC PACKAGING
Abstract: The characteristics,present status,application prospect and existing problems of copper-matrix composites for electronic packaging is described.And the developing trends of the copper-matrix composites are forecasted in this paper.
Publication Year: 2006
Publication Date: 2006-01-01
Language: en
Type: article
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Cited By Count: 1
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