Title: The Preparation and Curing Kinetics of the Silicon-Containing Epoxy Resin
Abstract: Silicon-containing epoxy resin(CNE-Si) was synthesized from diphenylsiandiol(DPSD) and ortho-cresol novolac epoxy resin with SnCl2 as catalyst.The chemical structure of CNE-Si prepared was characterized by FT-IR,1H-NMR.The thermal stability was analyzed by TGA.The results show that the-Si-group enhanced the thermal stability of the epoxy resin.The curing kinetics of the system is studied by isothermal DSC.The kinetic parameters of the curing reaction including the activation energy and reaction order are calculated using Kissinger and Ozawa method,which offer basic date for the application of CNE-Si.
Publication Year: 2009
Publication Date: 2009-01-01
Language: en
Type: article
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