Title: Reliability analysis of BGA solder joint based on thermal cycling and drop testing
Abstract: Reliability of ball grid array(BGA) solder joint was studied in comprehensive action of dropping and thermal cycle tests. The board-level drop lifetimes of electronic products, failure mechanism and failure mode, the connection between fracture behaving and Kirkendall voids were studied in different thermal cycles. Results show that the reliability of lead solder joints is higher than lead-free solder joints, BGA with low elastic modulus and PCB manufacturing materials tolerance heat but intolerance drop impact. Ways to improve the reliability of electronic products are proposed.
Publication Year: 2014
Publication Date: 2014-01-01
Language: en
Type: article
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