Title: Study on detection of defects of solder joint
Abstract: This paper deals with the detection of defects at BGA solder joints in PC boards by using X-ray imaging.Discusses the flow of detecting defects based on the X-ray imaging and describe an approach to automatic inspection of BGA solder joint defects by using seed filling and contour extracting.Experimental results reveal that the proposed method shows practical usefulness in BGA solder joint inspection.
Publication Year: 2008
Publication Date: 2008-01-01
Language: en
Type: article
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Cited By Count: 1
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