Title: Optimal Design for Improving Thermo-Mechanical Fatigue Reliability of Solder Joint of PBGA Component Based on Robust Design
Abstract: Based on robust design and Finite Element Method,the thenno-mechanical fatigue reliability of PBGA(Plastic Ball Grid Array)solder joint subject to an accelerated thermal cycling test condition is studied.Including PCB size,substrate thick- ness,chip coefficient of thermal expansion(CTE),and solder joint CTE et al.,8 different control factors are considered for a robust design towards enhancement of the thermal fatigue resistance of solder joint by using a L_(18)(2~1×3~7)mixed-level orthogonal array. From the result,importance of these factors on the thermo-mechanical reliability of PBGA solder joint is ranked.The best parameter combinations is A1B2C3D1E2F1G3H1,which the substrate CTE,solder joint CTE,the thickness of substrate,die CTE are the most important.The optimal design,after further confirmative experiments,decreases the maximum equivalent strain by 66% and increas- es S/N by 22.4% compared to the original design.
Publication Year: 2007
Publication Date: 2007-01-01
Language: en
Type: article
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Cited By Count: 3
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