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{'id': 'https://openalex.org/W2354918082', 'doi': None, 'title': 'Application of Electroplating Technology to Solder Bumping Formation', 'display_name': 'Application of Electroplating Technology to Solder Bumping Formation', 'publication_year': 2006, 'publication_date': '2006-01-01', 'ids': {'openalex': 'https://openalex.org/W2354918082', 'mag': '2354918082'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://en.cnki.com.cn/Article_en/CJFDTOTAL-MINI200604019.htm', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S98831239', 'display_name': 'Microelectronics Journal', 'issn_l': '1879-2391', 'issn': ['1879-2391'], 'is_oa': False, 'is_in_doaj': False, 'is_core': True, 'host_organization': 'https://openalex.org/P4310320990', 'host_organization_name': 'Elsevier BV', 'host_organization_lineage': ['https://openalex.org/P4310320990'], 'host_organization_lineage_names': ['Elsevier BV'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'journal-article', 'indexed_in': [], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5023551274', 'display_name': 'Lian Dong', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I2800372957', 'display_name': 'China Electronics Technology Group Corporation', 'ror': 'https://ror.org/0098hst83', 'country_code': 'CN', 'type': 'company', 'lineage': ['https://openalex.org/I2800372957']}], 'countries': ['CN'], 'is_corresponding': True, 'raw_author_name': 'Lian Dong', 'raw_affiliation_strings': ['Sichuan Institute of Solid-State Circuits,China Electronics Technology Group Corp'], 'affiliations': [{'raw_affiliation_string': 'Sichuan Institute of Solid-State Circuits,China Electronics Technology Group Corp', 'institution_ids': ['https://openalex.org/I2800372957']}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 1, 'corresponding_author_ids': ['https://openalex.org/A5023551274'], 'corresponding_institution_ids': ['https://openalex.org/I2800372957'], 'apc_list': {'value': 2370, 'currency': 'USD', 'value_usd': 2370, 'provenance': 'doaj'}, 'apc_paid': None, 'fwci': 0.0, 'has_fulltext': False, 'cited_by_count': 0, 'citation_normalized_percentile': {'value': 0.0, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 0, 'max': 61}, 'biblio': {'volume': None, 'issue': None, 'first_page': None, 'last_page': None}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.9455, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.9455, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/bumping', 'display_name': 'Bumping', 'score': 0.98603123}, {'id': 'https://openalex.org/keywords/ball-grid-array', 'display_name': 'Ball grid array', 'score': 0.93707204}, {'id': 'https://openalex.org/keywords/microelectronics', 'display_name': 'Microelectronics', 'score': 0.8756714}, {'id': 'https://openalex.org/keywords/chip-scale-package', 'display_name': 'Chip-scale package', 'score': 0.79641324}, {'id': 'https://openalex.org/keywords/integrated-circuit-packaging', 'display_name': 'Integrated circuit packaging', 'score': 0.4201156}], 'concepts': [{'id': 'https://openalex.org/C2776512755', 'wikidata': 'https://www.wikidata.org/wiki/Q632543', 'display_name': 'Bumping', 'level': 2, 'score': 0.98603123}, {'id': 'https://openalex.org/C94709252', 'wikidata': 'https://www.wikidata.org/wiki/Q570628', 'display_name': 'Ball grid array', 'level': 3, 'score': 0.93707204}, {'id': 'https://openalex.org/C51807945', 'wikidata': 'https://www.wikidata.org/wiki/Q3503392', 'display_name': 'Electroplating', 'level': 3, 'score': 0.9028307}, {'id': 'https://openalex.org/C187937830', 'wikidata': 'https://www.wikidata.org/wiki/Q175403', 'display_name': 'Microelectronics', 'level': 2, 'score': 0.8756714}, {'id': 'https://openalex.org/C79072407', 'wikidata': 'https://www.wikidata.org/wiki/Q432439', 'display_name': 'Flip chip', 'level': 4, 'score': 0.81529737}, {'id': 'https://openalex.org/C126233035', 'wikidata': 'https://www.wikidata.org/wiki/Q5101572', 'display_name': 'Chip-scale package', 'level': 3, 'score': 0.79641324}, {'id': 'https://openalex.org/C50296614', 'wikidata': 'https://www.wikidata.org/wiki/Q211387', 'display_name': 'Soldering', 'level': 2, 'score': 0.6993988}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.6508167}, {'id': 'https://openalex.org/C160671074', 'wikidata': 'https://www.wikidata.org/wiki/Q267131', 'display_name': 'Wafer', 'level': 2, 'score': 0.61469537}, {'id': 'https://openalex.org/C191897082', 'wikidata': 'https://www.wikidata.org/wiki/Q11467', 'display_name': 'Metallurgy', 'level': 1, 'score': 0.5208807}, {'id': 'https://openalex.org/C165005293', 'wikidata': 'https://www.wikidata.org/wiki/Q1074500', 'display_name': 'Chip', 'level': 2, 'score': 0.48524404}, {'id': 'https://openalex.org/C186260285', 'wikidata': 'https://www.wikidata.org/wiki/Q759494', 'display_name': 'Integrated circuit packaging', 'level': 3, 'score': 0.4201156}, {'id': 'https://openalex.org/C78519656', 'wikidata': 'https://www.wikidata.org/wiki/Q101333', 'display_name': 'Mechanical engineering', 'level': 1, 'score': 0.33113456}, {'id': 'https://openalex.org/C24326235', 'wikidata': 'https://www.wikidata.org/wiki/Q126095', 'display_name': 'Electronic engineering', 'level': 1, 'score': 0.3255662}, {'id': 'https://openalex.org/C49040817', 'wikidata': 'https://www.wikidata.org/wiki/Q193091', 'display_name': 'Optoelectronics', 'level': 1, 'score': 0.29938057}, {'id': 'https://openalex.org/C119599485', 'wikidata': 'https://www.wikidata.org/wiki/Q43035', 'display_name': 'Electrical engineering', 'level': 1, 'score': 0.2568032}, {'id': 'https://openalex.org/C171250308', 'wikidata': 'https://www.wikidata.org/wiki/Q11468', 'display_name': 'Nanotechnology', 'level': 1, 'score': 0.25472474}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.23556831}, {'id': 'https://openalex.org/C530198007', 'wikidata': 'https://www.wikidata.org/wiki/Q80831', 'display_name': 'Integrated circuit', 'level': 2, 'score': 0.21797282}, {'id': 'https://openalex.org/C68928338', 'wikidata': 'https://www.wikidata.org/wiki/Q131790', 'display_name': 'Adhesive', 'level': 3, 'score': 0.0}, {'id': 'https://openalex.org/C2779227376', 'wikidata': 'https://www.wikidata.org/wiki/Q6505497', 'display_name': 'Layer (electronics)', 'level': 2, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://en.cnki.com.cn/Article_en/CJFDTOTAL-MINI200604019.htm', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S98831239', 'display_name': 'Microelectronics Journal', 'issn_l': '1879-2391', 'issn': ['1879-2391'], 'is_oa': False, 'is_in_doaj': False, 'is_core': True, 'host_organization': 'https://openalex.org/P4310320990', 'host_organization_name': 'Elsevier BV', 'host_organization_lineage': ['https://openalex.org/P4310320990'], 'host_organization_lineage_names': ['Elsevier BV'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 0, 'referenced_works': [], 'related_works': ['https://openalex.org/W626181998', 'https://openalex.org/W3171383363', 'https://openalex.org/W3146287251', 'https://openalex.org/W2893150562', 'https://openalex.org/W2567144896', 'https://openalex.org/W2545736644', 'https://openalex.org/W2541636827', 'https://openalex.org/W2358757968', 'https://openalex.org/W2323426689', 'https://openalex.org/W2157625025', 'https://openalex.org/W2131751209', 'https://openalex.org/W2127431783', 'https://openalex.org/W2120016150', 'https://openalex.org/W2115758801', 'https://openalex.org/W2081379475', 'https://openalex.org/W2079176082', 'https://openalex.org/W2060126518', 'https://openalex.org/W2032914670', 'https://openalex.org/W2008725204', 'https://openalex.org/W1980826090'], 'abstract_inverted_index': None, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2354918082', 'counts_by_year': [], 'updated_date': '2024-12-09T01:59:16.859490', 'created_date': '2016-06-24'}