Title: A study of coupling of moisture diffusion and heat conduction
Abstract:Abstract A model of coupling of moisture diffusion and heat conduction in solids is proposed. The distribution of temperature and moisture in materials with constant diffusivity and with temperature‐d...Abstract A model of coupling of moisture diffusion and heat conduction in solids is proposed. The distribution of temperature and moisture in materials with constant diffusivity and with temperature‐dependent diffusivity under transient conditions is investigated. It is found that the coupling effect becomes significant as the ratio of the conductivity and diffusivity approaches to 1. In the case of constant boundary temperature, the diffusivity may be considered as constant. If the boundary temperature varies with time, the diffusivity must be considered as temperature‐dependent.Read More
Publication Year: 1982
Publication Date: 1982-06-01
Language: en
Type: article
Indexed In: ['crossref']
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