Publication Information

{'id': 'https://openalex.org/W2157255030', 'doi': 'https://doi.org/10.1145/1231996.1232004', 'title': 'Pattern sensitive placement for manufacturability', 'display_name': 'Pattern sensitive placement for manufacturability', 'publication_year': 2007, 'publication_date': '2007-03-18', 'ids': {'openalex': 'https://openalex.org/W2157255030', 'doi': 'https://doi.org/10.1145/1231996.1232004', 'mag': '2157255030'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1145/1231996.1232004', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'proceedings-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5114375267', 'display_name': 'Shiyan Hu', 'orcid': 'https://orcid.org/0000-0001-5029-1588'}, 'institutions': [{'id': 'https://openalex.org/I91045830', 'display_name': 'Texas A&M University', 'ror': 'https://ror.org/01f5ytq51', 'country_code': 'US', 'type': 'education', 'lineage': ['https://openalex.org/I91045830']}], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'Shiyan Hu', 'raw_affiliation_strings': ['Texas A&M University, College Station, TX'], 'affiliations': [{'raw_affiliation_string': 'Texas A&M University, College Station, TX', 'institution_ids': ['https://openalex.org/I91045830']}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5103246390', 'display_name': 'Jiang Hu', 'orcid': 'https://orcid.org/0000-0003-1157-7799'}, 'institutions': [{'id': 'https://openalex.org/I91045830', 'display_name': 'Texas A&M University', 'ror': 'https://ror.org/01f5ytq51', 'country_code': 'US', 'type': 'education', 'lineage': ['https://openalex.org/I91045830']}], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'Jiang Hu', 'raw_affiliation_strings': ['Texas A&M University, College Station, TX'], 'affiliations': [{'raw_affiliation_string': 'Texas A&M University, College Station, TX', 'institution_ids': ['https://openalex.org/I91045830']}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 1, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 7.406, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 27, 'citation_normalized_percentile': {'value': 0.899941, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 90, 'max': 91}, 'biblio': {'volume': None, 'issue': None, 'first_page': '27', 'last_page': '34'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T11338', 'display_name': 'Advancements in Photolithography Techniques', 'score': 1.0, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T11338', 'display_name': 'Advancements in Photolithography Techniques', 'score': 1.0, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T12111', 'display_name': 'Industrial Vision Systems and Defect Detection', 'score': 0.9978, 'subfield': {'id': 'https://openalex.org/subfields/2209', 'display_name': 'Industrial and Manufacturing Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T12224', 'display_name': 'Nanofabrication and Lithography Techniques', 'score': 0.9924, 'subfield': {'id': 'https://openalex.org/subfields/2204', 'display_name': 'Biomedical Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/robustness', 'display_name': 'Robustness', 'score': 0.585531}, {'id': 'https://openalex.org/keywords/blanking', 'display_name': 'Blanking', 'score': 0.4509449}, {'id': 'https://openalex.org/keywords/integrated-circuit-layout', 'display_name': 'Integrated circuit layout', 'score': 0.42653456}, {'id': 'https://openalex.org/keywords/computational-lithography', 'display_name': 'Computational lithography', 'score': 0.41205782}], 'concepts': [{'id': 'https://openalex.org/C62064638', 'wikidata': 'https://www.wikidata.org/wiki/Q553878', 'display_name': 'Design for manufacturability', 'level': 2, 'score': 0.9733993}, {'id': 'https://openalex.org/C204223013', 'wikidata': 'https://www.wikidata.org/wiki/Q133036', 'display_name': 'Lithography', 'level': 2, 'score': 0.8656111}, {'id': 'https://openalex.org/C14580979', 'wikidata': 'https://www.wikidata.org/wiki/Q876049', 'display_name': 'Very-large-scale integration', 'level': 2, 'score': 0.6604558}, {'id': 'https://openalex.org/C63479239', 'wikidata': 'https://www.wikidata.org/wiki/Q7353546', 'display_name': 'Robustness (evolution)', 'level': 3, 'score': 0.585531}, {'id': 'https://openalex.org/C105487726', 'wikidata': 'https://www.wikidata.org/wiki/Q622938', 'display_name': 'Photolithography', 'level': 2, 'score': 0.56845045}, {'id': 'https://openalex.org/C41008148', 'wikidata': 'https://www.wikidata.org/wiki/Q21198', 'display_name': 'Computer science', 'level': 0, 'score': 0.563103}, {'id': 'https://openalex.org/C136085584', 'wikidata': 'https://www.wikidata.org/wiki/Q910289', 'display_name': 'Overlay', 'level': 2, 'score': 0.5365823}, {'id': 'https://openalex.org/C160671074', 'wikidata': 'https://www.wikidata.org/wiki/Q267131', 'display_name': 'Wafer', 'level': 2, 'score': 0.47807145}, {'id': 'https://openalex.org/C108710744', 'wikidata': 'https://www.wikidata.org/wiki/Q4134329', 'display_name': 'Blanking', 'level': 2, 'score': 0.4509449}, {'id': 'https://openalex.org/C98045186', 'wikidata': 'https://www.wikidata.org/wiki/Q205663', 'display_name': 'Process (computing)', 'level': 2, 'score': 0.42807043}, {'id': 'https://openalex.org/C2765594', 'wikidata': 'https://www.wikidata.org/wiki/Q2624187', 'display_name': 'Integrated circuit layout', 'level': 3, 'score': 0.42653456}, {'id': 'https://openalex.org/C24326235', 'wikidata': 'https://www.wikidata.org/wiki/Q126095', 'display_name': 'Electronic engineering', 'level': 1, 'score': 0.4186665}, {'id': 'https://openalex.org/C182873914', 'wikidata': 'https://www.wikidata.org/wiki/Q5157329', 'display_name': 'Computational lithography', 'level': 5, 'score': 0.41205782}, {'id': 'https://openalex.org/C177409738', 'wikidata': 'https://www.wikidata.org/wiki/Q1917460', 'display_name': 'Multiple patterning', 'level': 4, 'score': 0.40039077}, {'id': 'https://openalex.org/C530198007', 'wikidata': 'https://www.wikidata.org/wiki/Q80831', 'display_name': 'Integrated circuit', 'level': 2, 'score': 0.31826204}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.26182148}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.24011189}, {'id': 'https://openalex.org/C53524968', 'wikidata': 'https://www.wikidata.org/wiki/Q7315582', 'display_name': 'Resist', 'level': 3, 'score': 0.23124698}, {'id': 'https://openalex.org/C171250308', 'wikidata': 'https://www.wikidata.org/wiki/Q11468', 'display_name': 'Nanotechnology', 'level': 1, 'score': 0.1809096}, {'id': 'https://openalex.org/C49040817', 'wikidata': 'https://www.wikidata.org/wiki/Q193091', 'display_name': 'Optoelectronics', 'level': 1, 'score': 0.12724176}, {'id': 'https://openalex.org/C149635348', 'wikidata': 'https://www.wikidata.org/wiki/Q193040', 'display_name': 'Embedded system', 'level': 1, 'score': 0.114919454}, {'id': 'https://openalex.org/C119599485', 'wikidata': 'https://www.wikidata.org/wiki/Q43035', 'display_name': 'Electrical engineering', 'level': 1, 'score': 0.113734156}, {'id': 'https://openalex.org/C76155785', 'wikidata': 'https://www.wikidata.org/wiki/Q418', 'display_name': 'Telecommunications', 'level': 1, 'score': 0.0716494}, {'id': 'https://openalex.org/C55493867', 'wikidata': 'https://www.wikidata.org/wiki/Q7094', 'display_name': 'Biochemistry', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C185592680', 'wikidata': 'https://www.wikidata.org/wiki/Q2329', 'display_name': 'Chemistry', 'level': 0, 'score': 0.0}, {'id': 'https://openalex.org/C199360897', 'wikidata': 'https://www.wikidata.org/wiki/Q9143', 'display_name': 'Programming language', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C2779227376', 'wikidata': 'https://www.wikidata.org/wiki/Q6505497', 'display_name': 'Layer (electronics)', 'level': 2, 'score': 0.0}, {'id': 'https://openalex.org/C104317684', 'wikidata': 'https://www.wikidata.org/wiki/Q7187', 'display_name': 'Gene', 'level': 2, 'score': 0.0}, {'id': 'https://openalex.org/C111919701', 'wikidata': 'https://www.wikidata.org/wiki/Q9135', 'display_name': 'Operating system', 'level': 1, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1145/1231996.1232004', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 15, 'referenced_works': ['https://openalex.org/W1594489858', 'https://openalex.org/W2022187398', 'https://openalex.org/W2097749440', 'https://openalex.org/W2100344939', 'https://openalex.org/W2108961335', 'https://openalex.org/W2115092649', 'https://openalex.org/W2134849712', 'https://openalex.org/W2148115459', 'https://openalex.org/W2151983530', 'https://openalex.org/W2163961680', 'https://openalex.org/W2175238470', 'https://openalex.org/W2752885492', 'https://openalex.org/W3145128584', 'https://openalex.org/W4285719527', 'https://openalex.org/W73629738'], 'related_works': ['https://openalex.org/W2621496481', 'https://openalex.org/W2606576291', 'https://openalex.org/W2575916813', 'https://openalex.org/W2403265952', 'https://openalex.org/W2147584640', 'https://openalex.org/W2115795789', 'https://openalex.org/W2028711229', 'https://openalex.org/W1993189065', 'https://openalex.org/W1991236041', 'https://openalex.org/W1520032252'], 'abstract_inverted_index': {'When': [0], 'VLSI': [1, 63], 'technology': [2], 'scales': [3], 'toward': [4], '45nm,': [5], 'the': [6, 36, 59, 67, 86, 94], 'lithography': [7, 74, 97], 'wavelength': [8], 'stays': [9], 'at': [10], '193nm.': [11], 'This': [12], 'large': [13], 'gap': [14], 'results': [15], 'in': [16, 20], 'strong': [17], 'refractive': [18], 'effects': [19], 'lithography.': [21], 'Consequently,': [22], 'it': [23, 81], 'is': [24, 38], 'a': [25], 'huge': [26], 'challenge': [27], 'to': [28, 41, 84], 'reliably': [29], 'print': [30], 'layout': [31, 78, 90], 'features': [32], 'on': [33, 77], 'wafers': [34], 'and': [35, 71], 'printing': [37], 'more': [39], 'susceptible': [40], 'lithographic': [42], 'process': [43, 98], 'variations.': [44], 'Although': [45], 'resolution': [46], 'enhancement': [47], 'techniques': [48], 'can': [49, 99], 'mitigate': [50], 'this': [51], 'manufacturability': [52, 87], 'problem,': [53], 'their': [54], 'capabilities': [55], 'are': [56], 'overstretched': [57], 'by': [58], 'continuous': [60], 'shrinking': [61], 'of': [62, 73, 96], 'feature': [64], 'size.': [65], 'On': [66], 'other': [68], 'hand,the': [69], 'quality': [70], 'robustness': [72], 'directly': [75], 'depend': [76], 'patterns.': [79], 'Therefore,': [80], 'becomes': [82], 'imperative': [83], 'consider': [85], 'issue': [88], 'during': [89], 'design': [91], 'such': [92], 'that': [93], 'burden': [95], 'be': [100], 'alleviated.': [101]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2157255030', 'counts_by_year': [{'year': 2022, 'cited_by_count': 1}, {'year': 2016, 'cited_by_count': 1}, {'year': 2014, 'cited_by_count': 2}, {'year': 2013, 'cited_by_count': 1}, {'year': 2012, 'cited_by_count': 2}], 'updated_date': '2025-01-13T05:04:23.662002', 'created_date': '2016-06-24'}