Title: High‐Density Soft‐Matter Electronics with Micron‐Scale Line Width
Abstract: Advanced MaterialsVolume 26, Issue 30 p. 5211-5216 Communication High-Density Soft-Matter Electronics with Micron-Scale Line Width B. Arda Gozen, B. Arda Gozen Carnegie Mellon University, Mechanical Engineering Department, 5000 Forbes Avenue, Scaife Hall, Pittsburgh, PA, 15213 USASearch for more papers by this authorArya Tabatabai, Arya Tabatabai Carnegie Mellon University, Mechanical Engineering Department, 5000 Forbes Avenue, Scaife Hall, Pittsburgh, PA, 15213 USASearch for more papers by this authorO. Burak Ozdoganlar, Corresponding Author O. Burak Ozdoganlar Carnegie Mellon University, Mechanical Engineering Department, 5000 Forbes Avenue, Scaife Hall, Pittsburgh, PA, 15213 USAE-mail: [email protected], [email protected]Search for more papers by this authorCarmel Majidi, Corresponding Author Carmel Majidi Carnegie Mellon University, Mechanical Engineering Department, 5000 Forbes Avenue, Scaife Hall, Pittsburgh, PA, 15213 USAE-mail: [email protected], [email protected]Search for more papers by this author B. Arda Gozen, B. Arda Gozen Carnegie Mellon University, Mechanical Engineering Department, 5000 Forbes Avenue, Scaife Hall, Pittsburgh, PA, 15213 USASearch for more papers by this authorArya Tabatabai, Arya Tabatabai Carnegie Mellon University, Mechanical Engineering Department, 5000 Forbes Avenue, Scaife Hall, Pittsburgh, PA, 15213 USASearch for more papers by this authorO. Burak Ozdoganlar, Corresponding Author O. Burak Ozdoganlar Carnegie Mellon University, Mechanical Engineering Department, 5000 Forbes Avenue, Scaife Hall, Pittsburgh, PA, 15213 USAE-mail: [email protected], [email protected]Search for more papers by this authorCarmel Majidi, Corresponding Author Carmel Majidi Carnegie Mellon University, Mechanical Engineering Department, 5000 Forbes Avenue, Scaife Hall, Pittsburgh, PA, 15213 USAE-mail: [email protected], [email protected]Search for more papers by this author First published: 05 June 2014 https://doi.org/10.1002/adma.201400502Citations: 171Read the full textAboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onEmailFacebookTwitterLinkedInRedditWechat Graphical Abstract A method to produce soft and stretchable microelectronics composed of a liquid-phase Gallium-Indium alloy with micron-scale circuit features is introduced. Microchannels are molded onto the surface of a poly(dimethylsiloxane) (PDMS) elastomer and filled with EGaIn using a micro-transfer deposition step that exploits the unique wetting properties of EGaIn in air. The liquid-filled channels function as stretchable circuit wires or capacitor electrodes with a 2 μm linewidth and 1 μm spacing. Supporting Information As a service to our authors and readers, this journal provides supporting information supplied by the authors. Such materials are peer reviewed and may be re-organized for online delivery, but are not copy-edited or typeset. Technical support issues arising from supporting information (other than missing files) should be addressed to the authors. 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Majidi, Smart Mater. Struct. 2013, 22, 055023. Citing Literature Volume26, Issue30August 13, 2014Pages 5211-5216 ReferencesRelatedInformation
Publication Year: 2014
Publication Date: 2014-06-05
Language: en
Type: article
Indexed In: ['crossref', 'pubmed']
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Cited By Count: 194
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