Title: A compact multichannel transceiver module using planar-processed optical waveguides and flip-chip optoelectronic components
Abstract: A compact, planar-processed package using flip-chip, self-aligned optoelectronic components is described. The packaging concepts are compatible with existing high-speed, high-density electronic materials and processes and therefore have the potential for high-volume, low-cost manufacturing. The concepts are demonstrated using a four-channel transceiver module utilizing planar-processed optical waveguides and flip-chip optoelectronic components. An overview of the package is presented, and the substrate, the optoelectronic chip alignment, the module connector, and link tests are described.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
Publication Year: 2003
Publication Date: 2003-01-02
Language: en
Type: article
Indexed In: ['crossref']
Access and Citation
Cited By Count: 48
AI Researcher Chatbot
Get quick answers to your questions about the article from our AI researcher chatbot