Title: Pb-free Soldering Alternatives For Fine Pitched Electronics Packaging
Abstract: The possibility of a ban of Pb has forced the electronics industry to search for alternatives for Pb-based solders. We present a discussion of several of these alternatives and present preliminary results of experiments aimed at developing these solutions. Experimental results presented include an assessment of the strain rate sensitivity of Sn-Bi solder joints; the wetting properties of Sn-Bi solders on bare and hot-dipped Cu surfaces; and the development of a laser soldering process for fine pitched SMT using Sn-Ag solders.
Publication Year: 2005
Publication Date: 2005-08-24
Language: en
Type: article
Indexed In: ['crossref']
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Cited By Count: 6
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