Publication Information

{'id': 'https://openalex.org/W2105891220', 'doi': 'https://doi.org/10.1109/isse.2010.5547270', 'title': 'Bumping technologies of fine-pitch BGA components', 'display_name': 'Bumping technologies of fine-pitch BGA components', 'publication_year': 2010, 'publication_date': '2010-05-01', 'ids': {'openalex': 'https://openalex.org/W2105891220', 'doi': 'https://doi.org/10.1109/isse.2010.5547270', 'mag': '2105891220'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/isse.2010.5547270', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'proceedings-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5069707193', 'display_name': 'Réka Bátorfi', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I29770179', 'display_name': 'Budapest University of Technology and Economics', 'ror': 'https://ror.org/02w42ss30', 'country_code': 'HU', 'type': 'education', 'lineage': ['https://openalex.org/I29770179']}], 'countries': ['HU'], 'is_corresponding': False, 'raw_author_name': 'Reka Batorfi', 'raw_affiliation_strings': ['Department of electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary'], 'affiliations': [{'raw_affiliation_string': 'Department of electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary', 'institution_ids': ['https://openalex.org/I29770179']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5066560350', 'display_name': 'Peter Szoke', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I29770179', 'display_name': 'Budapest University of Technology and Economics', 'ror': 'https://ror.org/02w42ss30', 'country_code': 'HU', 'type': 'education', 'lineage': ['https://openalex.org/I29770179']}], 'countries': ['HU'], 'is_corresponding': False, 'raw_author_name': 'Peter Szoke', 'raw_affiliation_strings': ['Department of electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary'], 'affiliations': [{'raw_affiliation_string': 'Department of electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary', 'institution_ids': ['https://openalex.org/I29770179']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5030523928', 'display_name': 'Zoltan Olah', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I29770179', 'display_name': 'Budapest University of Technology and Economics', 'ror': 'https://ror.org/02w42ss30', 'country_code': 'HU', 'type': 'education', 'lineage': ['https://openalex.org/I29770179']}], 'countries': ['HU'], 'is_corresponding': False, 'raw_author_name': 'Zoltan Olah', 'raw_affiliation_strings': ['Department of electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary'], 'affiliations': [{'raw_affiliation_string': 'Department of electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary', 'institution_ids': ['https://openalex.org/I29770179']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5010915863', 'display_name': 'Attila Géczy', 'orcid': 'https://orcid.org/0000-0002-4125-8791'}, 'institutions': [{'id': 'https://openalex.org/I29770179', 'display_name': 'Budapest University of Technology and Economics', 'ror': 'https://ror.org/02w42ss30', 'country_code': 'HU', 'type': 'education', 'lineage': ['https://openalex.org/I29770179']}], 'countries': ['HU'], 'is_corresponding': False, 'raw_author_name': 'Attila Geczy', 'raw_affiliation_strings': ['Department of electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary'], 'affiliations': [{'raw_affiliation_string': 'Department of electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary', 'institution_ids': ['https://openalex.org/I29770179']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5027607271', 'display_name': 'Miklós Ruszinkó', 'orcid': 'https://orcid.org/0000-0003-1664-7717'}, 'institutions': [{'id': 'https://openalex.org/I29770179', 'display_name': 'Budapest University of Technology and Economics', 'ror': 'https://ror.org/02w42ss30', 'country_code': 'HU', 'type': 'education', 'lineage': ['https://openalex.org/I29770179']}], 'countries': ['HU'], 'is_corresponding': False, 'raw_author_name': 'Miklos Ruszinko', 'raw_affiliation_strings': ['Department of electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary'], 'affiliations': [{'raw_affiliation_string': 'Department of electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary', 'institution_ids': ['https://openalex.org/I29770179']}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5110195353', 'display_name': 'Zsolt Illyefalvi‐Vitéz', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I29770179', 'display_name': 'Budapest University of Technology and Economics', 'ror': 'https://ror.org/02w42ss30', 'country_code': 'HU', 'type': 'education', 'lineage': ['https://openalex.org/I29770179']}], 'countries': ['HU'], 'is_corresponding': False, 'raw_author_name': 'Zsolt Illyefalvi-Vitez', 'raw_affiliation_strings': ['Department of electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary'], 'affiliations': [{'raw_affiliation_string': 'Department of electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary', 'institution_ids': ['https://openalex.org/I29770179']}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 1, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 0.0, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 2, 'citation_normalized_percentile': {'value': 0.441951, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 71, 'max': 75}, 'biblio': {'volume': None, 'issue': None, 'first_page': '107', 'last_page': '112'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.9943, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 0.9943, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.993, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11429', 'display_name': 'Semiconductor Lasers and Optical Devices', 'score': 0.9181, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/bumping', 'display_name': 'Bumping', 'score': 0.9831821}, {'id': 'https://openalex.org/keywords/ball-grid-array', 'display_name': 'Ball grid array', 'score': 0.97160816}, {'id': 'https://openalex.org/keywords/stencil', 'display_name': 'Stencil', 'score': 0.6622186}, {'id': 'https://openalex.org/keywords/surface-mount-technology', 'display_name': 'Surface-mount technology', 'score': 0.54020125}, {'id': 'https://openalex.org/keywords/reflow-soldering', 'display_name': 'Reflow soldering', 'score': 0.4759595}, {'id': 'https://openalex.org/keywords/integrated-circuit-packaging', 'display_name': 'Integrated circuit packaging', 'score': 0.47344467}, {'id': 'https://openalex.org/keywords/solder-paste', 'display_name': 'Solder paste', 'score': 0.4716755}, {'id': 'https://openalex.org/keywords/package-on-package', 'display_name': 'Package on package', 'score': 0.45226943}, {'id': 'https://openalex.org/keywords/electronic-packaging', 'display_name': 'Electronic Packaging', 'score': 0.43416256}, {'id': 'https://openalex.org/keywords/chip-scale-package', 'display_name': 'Chip-scale package', 'score': 0.4197929}], 'concepts': [{'id': 'https://openalex.org/C2776512755', 'wikidata': 'https://www.wikidata.org/wiki/Q632543', 'display_name': 'Bumping', 'level': 2, 'score': 0.9831821}, {'id': 'https://openalex.org/C94709252', 'wikidata': 'https://www.wikidata.org/wiki/Q570628', 'display_name': 'Ball grid array', 'level': 3, 'score': 0.97160816}, {'id': 'https://openalex.org/C50296614', 'wikidata': 'https://www.wikidata.org/wiki/Q211387', 'display_name': 'Soldering', 'level': 2, 'score': 0.81710535}, {'id': 'https://openalex.org/C76752949', 'wikidata': 'https://www.wikidata.org/wiki/Q7607499', 'display_name': 'Stencil', 'level': 2, 'score': 0.6622186}, {'id': 'https://openalex.org/C2776584680', 'wikidata': 'https://www.wikidata.org/wiki/Q191042', 'display_name': 'Surface-mount technology', 'level': 3, 'score': 0.54020125}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.47813213}, {'id': 'https://openalex.org/C2778413121', 'wikidata': 'https://www.wikidata.org/wiki/Q2136790', 'display_name': 'Reflow soldering', 'level': 3, 'score': 0.4759595}, {'id': 'https://openalex.org/C120793396', 'wikidata': 'https://www.wikidata.org/wiki/Q173350', 'display_name': 'Printed circuit board', 'level': 2, 'score': 0.47489658}, {'id': 'https://openalex.org/C186260285', 'wikidata': 'https://www.wikidata.org/wiki/Q759494', 'display_name': 'Integrated circuit packaging', 'level': 3, 'score': 0.47344467}, {'id': 'https://openalex.org/C191281628', 'wikidata': 'https://www.wikidata.org/wiki/Q977971', 'display_name': 'Solder paste', 'level': 3, 'score': 0.4716755}, {'id': 'https://openalex.org/C78519656', 'wikidata': 'https://www.wikidata.org/wiki/Q101333', 'display_name': 'Mechanical engineering', 'level': 1, 'score': 0.4654468}, {'id': 'https://openalex.org/C184788189', 'wikidata': 'https://www.wikidata.org/wiki/Q130652', 'display_name': 'Package on package', 'level': 4, 'score': 0.45226943}, {'id': 'https://openalex.org/C69567186', 'wikidata': 'https://www.wikidata.org/wiki/Q5358403', 'display_name': 'Electronic packaging', 'level': 2, 'score': 0.43416256}, {'id': 'https://openalex.org/C126233035', 'wikidata': 'https://www.wikidata.org/wiki/Q5101572', 'display_name': 'Chip-scale package', 'level': 3, 'score': 0.4197929}, {'id': 'https://openalex.org/C530198007', 'wikidata': 'https://www.wikidata.org/wiki/Q80831', 'display_name': 'Integrated circuit', 'level': 2, 'score': 0.403689}, {'id': 'https://openalex.org/C41008148', 'wikidata': 'https://www.wikidata.org/wiki/Q21198', 'display_name': 'Computer science', 'level': 0, 'score': 0.3940609}, {'id': 'https://openalex.org/C24326235', 'wikidata': 'https://www.wikidata.org/wiki/Q126095', 'display_name': 'Electronic engineering', 'level': 1, 'score': 0.32642326}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.28795668}, {'id': 'https://openalex.org/C119599485', 'wikidata': 'https://www.wikidata.org/wiki/Q43035', 'display_name': 'Electrical engineering', 'level': 1, 'score': 0.22994685}, {'id': 'https://openalex.org/C160671074', 'wikidata': 'https://www.wikidata.org/wiki/Q267131', 'display_name': 'Wafer', 'level': 2, 'score': 0.17455807}, {'id': 'https://openalex.org/C191897082', 'wikidata': 'https://www.wikidata.org/wiki/Q11467', 'display_name': 'Metallurgy', 'level': 1, 'score': 0.13979176}, {'id': 'https://openalex.org/C49040817', 'wikidata': 'https://www.wikidata.org/wiki/Q193091', 'display_name': 'Optoelectronics', 'level': 1, 'score': 0.13483718}, {'id': 'https://openalex.org/C165013422', 'wikidata': 'https://www.wikidata.org/wiki/Q4388382', 'display_name': 'Wafer dicing', 'level': 3, 'score': 0.10773954}, {'id': 'https://openalex.org/C459310', 'wikidata': 'https://www.wikidata.org/wiki/Q117801', 'display_name': 'Computational science', 'level': 1, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1109/isse.2010.5547270', 'pdf_url': None, 'source': None, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [{'display_name': 'Industry, innovation and infrastructure', 'score': 0.63, 'id': 'https://metadata.un.org/sdg/9'}], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 3, 'referenced_works': ['https://openalex.org/W2041904451', 'https://openalex.org/W2104435966', 'https://openalex.org/W2130532276'], 'related_works': ['https://openalex.org/W4365791465', 'https://openalex.org/W2885755288', 'https://openalex.org/W2504097971', 'https://openalex.org/W2467361102', 'https://openalex.org/W2330905700', 'https://openalex.org/W2171549775', 'https://openalex.org/W2163156266', 'https://openalex.org/W2109256198', 'https://openalex.org/W2072819399', 'https://openalex.org/W2063908777'], 'abstract_inverted_index': {'The': [0, 125], 'assembling': [1], 'technology': [2, 16, 134], 'of': [3, 17, 52, 80, 91, 127, 139], 'fine-pitch': [4], 'Ball': [5], 'Grid': [6], 'Arrays': [7], '(BGAs)': [8], 'is': [9, 29, 36], 'used': [10], 'for': [11], 'high-end': [12], 'applications': [13], 'such': [14], 'as': [15, 34], 'very': [18, 39], 'high': [19], 'density': [20], 'circuits': [21], 'and': [22, 44, 60, 77, 97, 116, 131, 147], 'package-on-package': [23], 'structures': [24], '[1].': [25], 'Vapor': [26], 'phase': [27, 115], 'soldering': [28, 123], 'a': [30, 50], 'perspective': [31], 'technology,': [32], 'but': [33], 'it': [35], 'still': [37], 'not': [38], 'widespread': [40], 'in': [41, 45, 95, 136], 'the': [42, 58, 89, 128, 132, 137], 'industry': [43], 'research': [46], 'laboratories,': [47], 'there': [48], 'are': [49], 'lot': [51], 'things': [53], 'to': [54, 56, 61, 74, 78, 87], 'examine': [55], 'standardize': [57], 'process': [59], 'get': [62], 'more': [63], 'experiences.': [64], 'SAC': [65], 'solder': [66, 119, 129], 'bumps': [67, 79], 'made': [68], 'with': [69, 109, 113, 117, 120, 155], 'different': [70], 'technologies': [71], 'were': [72, 102], 'compared': [73], 'each': [75], 'other': [76], 'commercial': [81], 'BGA': [82, 107], 'components.': [83], 'Another': [84], 'aim': [85], 'was': [86, 135], 'determine': [88], 'limits': [90], 'our': [92, 140], 'laboratory': [93], 'facilities': [94], 'bumping': [96], 'PWB': [98], 'technologies.': [99], 'Bumping': [100], 'experiments': [101], 'carried': [103], 'out': [104], 'on': [105], 'model': [106], 'components': [108], 'stencil': [110], 'printing,': [111], 'reflowed': [112], 'vapor': [114], 'applying': [118], 'mini-wave': [121], 'selective': [122], 'equipment.': [124], 'optimization': [126], 'amount': [130], 'appropriate': [133], 'focus': [138], 'research.': [141], 'To': [142], 'have': [143], 'acceptable,': [144], 'high,': [145], 'uniform': [146], 'good': [148], 'quality': [149], 'bumps,': [150], 'we': [151], 'developed': [152], 'these': [153], 'processes': [154], 'parameter': [156], 'optimization.': [157]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2105891220', 'counts_by_year': [{'year': 2018, 'cited_by_count': 1}, {'year': 2014, 'cited_by_count': 1}], 'updated_date': '2024-12-10T18:11:33.794865', 'created_date': '2016-06-24'}