Title: Micromachining of Pyrex7740 glass and their applications to wafer-level hermetic packaging of MEMS devices
Abstract: A new wafer-level process to precisely fabricate regular arrays of deep cavities on the Pyrex7740 glass wafer as well as applications to wafer-level hermetic packaging of MEMS devices are presented. The process is based on the anodic bonding, and the Si substrate is employed as a mold layer to form the shape of the cavity. The appropriate processing parameter is obtained from a series of experiments. Finally, the wafer-level hermetic packaging process of MEMS devices is completed by the second anodic bonding process. The whole process has been carried out with dew point sensors in wafer-level and illustrated in detail.
Publication Year: 2010
Publication Date: 2010-01-01
Language: en
Type: article
Indexed In: ['crossref']
Access and Citation
Cited By Count: 11
AI Researcher Chatbot
Get quick answers to your questions about the article from our AI researcher chatbot