Abstract: A novel rack-mount liquid cooler is described that is specifically architected for electronics cooling. This non-refrigerated liquid cooling system enables compact electronics packaging by transporting the heat to a rack location where it is easier to dissipate the heat. An experimental performance assessment demonstrates the cooler in a 3RU form factor is capable of dissipating 1kW of heat with a non-electrically conducting fluid
Publication Year: 2006
Publication Date: 2006-07-10
Language: en
Type: article
Indexed In: ['crossref']
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Cited By Count: 1
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