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{'id': 'https://openalex.org/W2018388713', 'doi': 'https://doi.org/10.1007/bf02665064', 'title': 'The growth of Cu-Sn intermetallics at a pretinned copper-solder interface', 'display_name': 'The growth of Cu-Sn intermetallics at a pretinned copper-solder interface', 'publication_year': 1992, 'publication_date': '1992-04-01', 'ids': {'openalex': 'https://openalex.org/W2018388713', 'doi': 'https://doi.org/10.1007/bf02665064', 'mag': '2018388713'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1007/bf02665064', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S4210190402', 'display_name': 'Metallurgical Transactions A', 'issn_l': '0360-2133', 'issn': ['0360-2133', '2379-0180'], 'is_oa': False, 'is_in_doaj': False, 'is_core': False, 'host_organization': 'https://openalex.org/P4310319900', 'host_organization_name': 'Springer Science+Business Media', 'host_organization_lineage': ['https://openalex.org/P4310319965', 'https://openalex.org/P4310319900'], 'host_organization_lineage_names': ['Springer Nature', 'Springer Science+Business Media'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'journal-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5050367540', 'display_name': 'A.J. Sunwoo', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I1282311441', 'display_name': 'Lawrence Livermore National Laboratory', 'ror': 'https://ror.org/041nk4h53', 'country_code': 'US', 'type': 'facility', 'lineage': ['https://openalex.org/I1282311441', 'https://openalex.org/I1330989302', 'https://openalex.org/I198811213', 'https://openalex.org/I4210138311']}], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'A. J. Sunwoo', 'raw_affiliation_strings': ['Lawrence Livermore National Laboratory'], 'affiliations': [{'raw_affiliation_string': 'Lawrence Livermore National Laboratory', 'institution_ids': ['https://openalex.org/I1282311441']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5091325124', 'display_name': 'J. W. Morris', 'orcid': 'https://orcid.org/0000-0002-3300-8880'}, 'institutions': [{'id': 'https://openalex.org/I2803209242', 'display_name': 'University of California System', 'ror': 'https://ror.org/00pjdza24', 'country_code': 'US', 'type': 'education', 'lineage': ['https://openalex.org/I2803209242']}], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'J. W. Morris', 'raw_affiliation_strings': ['University of California'], 'affiliations': [{'raw_affiliation_string': 'University of California', 'institution_ids': ['https://openalex.org/I2803209242']}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5077406960', 'display_name': 'George K. Lucey', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I1304082316', 'display_name': 'United States Department of the Army', 'ror': 'https://ror.org/035w1gb98', 'country_code': 'US', 'type': 'government', 'lineage': ['https://openalex.org/I1304082316', 'https://openalex.org/I1330347796']}], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'G. K. Lucey', 'raw_affiliation_strings': ['United States Army’s Harry Diamond Laboratories'], 'affiliations': [{'raw_affiliation_string': 'United States Army’s Harry Diamond Laboratories', 'institution_ids': ['https://openalex.org/I1304082316']}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 3, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 3.885, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 175, 'citation_normalized_percentile': {'value': 0.988863, 'is_in_top_1_percent': False, 'is_in_top_10_percent': True}, 'cited_by_percentile_year': {'min': 98, 'max': 99}, 'biblio': {'volume': '23', 'issue': '4', 'first_page': '1323', 'last_page': '1332'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 1.0, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T10460', 'display_name': 'Electronic Packaging and Soldering Technologies', 'score': 1.0, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11100', 'display_name': 'Intermetallics and Advanced Alloy Properties', 'score': 0.9971, 'subfield': {'id': 'https://openalex.org/subfields/2210', 'display_name': 'Mechanical Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11527', 'display_name': '3D IC and TSV technologies', 'score': 0.9935, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/solderability', 'display_name': 'Solderability', 'score': 0.86071527}], 'concepts': [{'id': 'https://openalex.org/C27501479', 'wikidata': 'https://www.wikidata.org/wiki/Q428069', 'display_name': 'Intermetallic', 'level': 3, 'score': 0.98563826}, {'id': 'https://openalex.org/C50296614', 'wikidata': 'https://www.wikidata.org/wiki/Q211387', 'display_name': 'Soldering', 'level': 2, 'score': 0.8767045}, {'id': 'https://openalex.org/C18168003', 'wikidata': 'https://www.wikidata.org/wiki/Q628595', 'display_name': 'Eutectic system', 'level': 3, 'score': 0.8655587}, {'id': 'https://openalex.org/C2778115343', 'wikidata': 'https://www.wikidata.org/wiki/Q7557224', 'display_name': 'Solderability', 'level': 3, 'score': 0.86071527}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.836905}, {'id': 'https://openalex.org/C191897082', 'wikidata': 'https://www.wikidata.org/wiki/Q11467', 'display_name': 'Metallurgy', 'level': 1, 'score': 0.64565444}, {'id': 'https://openalex.org/C44280652', 'wikidata': 'https://www.wikidata.org/wiki/Q104837', 'display_name': 'Phase (matter)', 'level': 2, 'score': 0.6006288}, {'id': 'https://openalex.org/C2779227376', 'wikidata': 'https://www.wikidata.org/wiki/Q6505497', 'display_name': 'Layer (electronics)', 'level': 2, 'score': 0.59011805}, {'id': 'https://openalex.org/C134514944', 'wikidata': 'https://www.wikidata.org/wiki/Q817136', 'display_name': 'Wetting', 'level': 2, 'score': 0.5194611}, {'id': 'https://openalex.org/C544778455', 'wikidata': 'https://www.wikidata.org/wiki/Q753', 'display_name': 'Copper', 'level': 2, 'score': 0.42697972}, {'id': 'https://openalex.org/C159985019', 'wikidata': 'https://www.wikidata.org/wiki/Q181790', 'display_name': 'Composite material', 'level': 1, 'score': 0.32852587}, {'id': 'https://openalex.org/C87976508', 'wikidata': 'https://www.wikidata.org/wiki/Q1498213', 'display_name': 'Microstructure', 'level': 2, 'score': 0.3227834}, {'id': 'https://openalex.org/C2780026712', 'wikidata': 'https://www.wikidata.org/wiki/Q37756', 'display_name': 'Alloy', 'level': 2, 'score': 0.27604038}, {'id': 'https://openalex.org/C185592680', 'wikidata': 'https://www.wikidata.org/wiki/Q2329', 'display_name': 'Chemistry', 'level': 0, 'score': 0.07699147}, {'id': 'https://openalex.org/C178790620', 'wikidata': 'https://www.wikidata.org/wiki/Q11351', 'display_name': 'Organic chemistry', 'level': 1, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1007/bf02665064', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S4210190402', 'display_name': 'Metallurgical Transactions A', 'issn_l': '0360-2133', 'issn': ['0360-2133', '2379-0180'], 'is_oa': False, 'is_in_doaj': False, 'is_core': False, 'host_organization': 'https://openalex.org/P4310319900', 'host_organization_name': 'Springer Science+Business Media', 'host_organization_lineage': ['https://openalex.org/P4310319965', 'https://openalex.org/P4310319900'], 'host_organization_lineage_names': ['Springer Nature', 'Springer Science+Business Media'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [{'id': 'https://metadata.un.org/sdg/14', 'score': 0.83, 'display_name': 'Life below water'}], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 22, 'referenced_works': ['https://openalex.org/W1439379214', 'https://openalex.org/W1982821772', 'https://openalex.org/W1989493947', 'https://openalex.org/W2006192563', 'https://openalex.org/W2006432057', 'https://openalex.org/W2007510949', 'https://openalex.org/W2028341385', 'https://openalex.org/W2032830807', 'https://openalex.org/W2038821009', 'https://openalex.org/W2038950124', 'https://openalex.org/W2042028632', 'https://openalex.org/W2050484740', 'https://openalex.org/W2057106889', 'https://openalex.org/W2062932758', 'https://openalex.org/W2090642747', 'https://openalex.org/W2121725596', 'https://openalex.org/W2123241637', 'https://openalex.org/W2125267684', 'https://openalex.org/W2611980440', 'https://openalex.org/W4238496400', 'https://openalex.org/W564456724', 'https://openalex.org/W583593539'], 'related_works': ['https://openalex.org/W3214325749', 'https://openalex.org/W3155273384', 'https://openalex.org/W2907091467', 'https://openalex.org/W2792379173', 'https://openalex.org/W2528811518', 'https://openalex.org/W2088819926', 'https://openalex.org/W2013003672', 'https://openalex.org/W1964761794', 'https://openalex.org/W1852960452', 'https://openalex.org/W1599794128'], 'abstract_inverted_index': None, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2018388713', 'counts_by_year': [{'year': 2023, 'cited_by_count': 2}, {'year': 2022, 'cited_by_count': 3}, {'year': 2021, 'cited_by_count': 1}, {'year': 2020, 'cited_by_count': 3}, {'year': 2019, 'cited_by_count': 5}, {'year': 2018, 'cited_by_count': 4}, {'year': 2017, 'cited_by_count': 6}, {'year': 2016, 'cited_by_count': 3}, {'year': 2015, 'cited_by_count': 2}, {'year': 2014, 'cited_by_count': 9}, {'year': 2013, 'cited_by_count': 5}, {'year': 2012, 'cited_by_count': 5}], 'updated_date': '2025-01-08T03:18:52.832780', 'created_date': '2016-06-24'}