Title: Thermal Transient Response and Its Modeling for Joule Heating in Cu/Low-κ Interconnects Under Pulsed Current
Abstract: We propose a thermal transient response due to Joule heating and its modeling in Cu/low-κ interconnects. By incorporating a shape parameter on the model, the observed thermal response is more accurately represented compared to the conventional exponential function model. The effective thermal time constant in multilayered Cu/low-κ interconnects is experimentally investigated on the basis of the transient thermal response.
Publication Year: 2012
Publication Date: 2012-05-01
Language: en
Type: article
Indexed In: ['crossref']
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Cited By Count: 10
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