Title: The effects of conducting particle distribution on the behaviour of anisotropic conducting adhesives: non-uniform conductivity and shorting between connections
Abstract: Journal of Electronics ManufacturingVol. 03, No. 02, pp. 85-94 (1993) PAPERSNo AccessThe effects of conducting particle distribution on the behaviour of anisotropic conducting adhesives: non-uniform conductivity and shorting between connectionsDAVID J. WILLIAMS and DAVID C. WHALLEYDAVID J. WILLIAMSDepartment of Manufacturing Engineering, Loughborough University of Technology, UK Search for more papers by this author and DAVID C. WHALLEYDepartment of Manufacturing Engineering, Loughborough University of Technology, UK Search for more papers by this author https://doi.org/10.1142/S0960313193000103Cited by:26 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractThis paper presents mathematical models that are intended to assist in the design of anisotropic conducting materials. Such materials are usually random distributions of hard conducting spheres in epoxy resin matrices. Conducting joints are constructed in soft conducting materials by the plastic deformation of the conductor on the printed circuit boards. An earlier paper (Williams et al., 1993) describes some of the average behaviour of the materials during joint assembly and after assembly. This work explores the effects of the random distribution of particles in the material on resistivity variation and the probability of shorting between fine-pitch interconnections.Keywords:Adhesivessurface mountanisotropic conducting materials FiguresReferencesRelatedDetailsCited By 26Characterisation of thermocompression bonds formed using metal coated polymer core particles for fine pitch interconnectionsMark W. Sugden, Junlei Tao, Changqing Liu, David A. Hutt and David C. Whalley et al.1 Sep 2016Effects of Pad Array Dimensions and Misalignment Offsets on Optimal Fraction of Conductive Particles in Anisotropic Conductive Film PackagesChao-Ming Lin1 Mar 2013 | IEEE Transactions on Device and Materials Reliability, Vol. 13, No. 1ACF particle distribution in COG processYee-Wen Yen and Chun-Yu Lee1 Mar 2011 | Microelectronics Reliability, Vol. 51, No. 3Statistical Characterization of Open Failures in the Fine-Pitch COG InterconnectionS. Choi, S.Y. Hwang and W.S. Oh16 September 2008 | Journal of Electronic Materials, Vol. 37, No. 12Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics PackagingMelida Chin, S. Jack Hu and James R. Barber8 May 2008 | Journal of Electronic Packaging, Vol. 130, No. 2A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applicationsY. C. Lin and Jue Zhong1 May 2008 | Journal of Materials Science, Vol. 43, No. 9Effects of Systematic and Stochastic Errors on Estimated Failure Probability of Anisotropic Conductive Film Chao-Ming Lin1 Sep 2007 | IEEE Transactions on Device and Materials Reliability, Vol. 7, No. 3Analysis of new anisotropic conductive film (ACF) Chao-Ming Lin, Win-Jin Chang and Te-Hua Fang1 Dec 2005 | IEEE Transactions on Device and Materials Reliability, Vol. 5, No. 4A general Weibull model for reliability analysis under different failure Criteria-application on anisotropic conductive adhesive joining technology Johan Liu, Liqiang Cao, Min Xie, Thong-Ngee Goh and Yong Tang1 Oct 2005 | IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, No. 4Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applicationsJohan Liu, Yu Wang, James Morris and Helge Kristiansen1 Jun 2005Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics PackagingM. Chin, S. J. Hu and J. R. Barber5 February 2008Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 SubstrateJohan Liu and Zonghe Lai26 July 2002 | Journal of Electronic Packaging, Vol. 124, No. 3Erratum1 Aug 1999 | Microelectronics International, Vol. 16, No. 2Anisotropic conducting adhesives for electronic assemblyDavid C. Whalley, Samjid H. Mannan and David J. Williams1 Mar 1997 | Assembly Automation, Vol. 17, No. 1Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: pt.I. ExperimentA.O. Ogunjimi, S.H. Mannan, D.C. Whalley and D.J. Williams1 Oct 1996 | IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, Vol. 19, No. 4Understanding Anisotropic Conducting Adhesive BehaviourJ.M. Goward, D.C. Whalley and D.J. Williams1 May 1995 | Microelectronics International, Vol. 12, No. 2Electrically Conductive Adhesives: A Research Status ReviewJames E. Morris and Johan LiuFlip-chip assembly using anisotropic conducting adhesives: experimental and modelling resultsC.N. Oguibe, S.H. Mannan, D.C. Whalley and D.J. WilliamsACA bonding technology for low cost electronics packaging applications-current status and remaining challengesJ. LiuFine pitch COG interconnections using anisotropically conductive adhesives Chang Hoon Lee and K.I. LohAssembly of a prototype flip-chip-on-glass liquid crystal display Fei-Jain Wu, Chang Hoon Lee and K. LohComputational modelling of the anisotropic conductive adhesive assembly processD.C. Whalley, G. Glinsky, C. Bailey and J. LiuDevelopment of ontology for the anisotropic conductive adhesive interconnect technology in electronics applicationsJ. Liu, Y. Wang, J. Morris and H. KristiansenRecent advances in conductive adhesives for direct chip attach applicationsJ. LiuElectrical conduction characteristics of solid metal anisotropic conductive adhesive particlesG. Don, D.C. Whalley and Changqing LiuA general weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology Johao Liu, Liqiang Cao, Min Xie, Thong-Ngee Goh and Yong Tang Recommended Vol. 03, No. 02 Metrics History Received 1 February 1993 Accepted 1 March 1993 KeywordsAdhesivessurface mountanisotropic conducting materialsPDF download
Publication Year: 1993
Publication Date: 1993-06-01
Language: en
Type: article
Indexed In: ['crossref']
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Cited By Count: 29
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