Title: Transfer Printing of Metallic Microstructures on Adhesion‐Promoting Hydrogel Substrates
Abstract: Advanced MaterialsVolume 27, Issue 22 p. 3398-3404 Communication Transfer Printing of Metallic Microstructures on Adhesion-Promoting Hydrogel Substrates Haosheng Wu, Haosheng Wu Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USASearch for more papers by this authorVeikko Sariola, Veikko Sariola Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USA Department of Electrical Engineering and Automation, Aalto University, Helsinki, 00076 FinlandSearch for more papers by this authorCongcong Zhu, Congcong Zhu Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USASearch for more papers by this authorJingsi Zhao, Jingsi Zhao Department of Biomedical Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USASearch for more papers by this authorMetin Sitti, Metin Sitti Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USA Max Planck Institute for Intelligent Systems, Stuttgart, 70569 GermanySearch for more papers by this authorChristopher J. Bettinger, Corresponding Author Christopher J. Bettinger Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USA Department of Biomedical Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USA McGowan Institute of Regenerative Medicine, 450 Technology Drive, Suite 300, Pittsburgh, PA, 15219 USAE-mail: [email protected]Search for more papers by this author Haosheng Wu, Haosheng Wu Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USASearch for more papers by this authorVeikko Sariola, Veikko Sariola Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USA Department of Electrical Engineering and Automation, Aalto University, Helsinki, 00076 FinlandSearch for more papers by this authorCongcong Zhu, Congcong Zhu Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USASearch for more papers by this authorJingsi Zhao, Jingsi Zhao Department of Biomedical Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USASearch for more papers by this authorMetin Sitti, Metin Sitti Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USA Max Planck Institute for Intelligent Systems, Stuttgart, 70569 GermanySearch for more papers by this authorChristopher J. Bettinger, Corresponding Author Christopher J. Bettinger Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USA Department of Biomedical Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213 USA McGowan Institute of Regenerative Medicine, 450 Technology Drive, Suite 300, Pittsburgh, PA, 15219 USAE-mail: [email protected]Search for more papers by this author First published: 22 April 2015 https://doi.org/10.1002/adma.201500954Citations: 40Read the full textAboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Graphical Abstract Fabrication schemes that integrate inorganic microstructures with hydrogel substrates are essential for advancing flexible electronics. A transfer printing process that is made possible through the design and synthesis of adhesion-promoting hydrogels as target substrates is reported. This fabrication technique may advance ultracompliant electronics by melding microfabricated structures with swollen hydrogel substrates. Citing Literature Supporting Information As a service to our authors and readers, this journal provides supporting information supplied by the authors. Such materials are peer reviewed and may be re-organized for online delivery, but are not copy-edited or typeset. Technical support issues arising from supporting information (other than missing files) should be addressed to the authors. Filename Description adma201500954-sup-0001-S1.pdf1.8 MB Supplementary Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article. Volume27, Issue22June 10, 2015Pages 3398-3404 RelatedInformation
Publication Year: 2015
Publication Date: 2015-04-22
Language: en
Type: article
Indexed In: ['crossref', 'pubmed']
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Cited By Count: 48
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