Title: Simple but Effective Heterogeneous Main Memory with On-Chip Memory Controller Support
Abstract: System-in-Package (SiP) and 3D integration are promising technologies to bring more memory onto a microprocessor package to mitigate the "memory wall" problem. In this paper, instead of using them to build caches, we study a heterogenous main memory using both on- and off-package memories providing both fast and high-bandwidth on-package accesses and expandable and low-cost commodity off-package memory capacity. We introduce another layer of address translation coupled with an on-chip memory controller that can dynamically migrate data between off-package and off-package memory either in hardware or with operating system assistance depending on the migration granularity. Our experimental results demonstrate that such design can achieve the average effectiveness of 83% of the ideal case where all memory can be placed in high-speed on-package memory for our simulated benchmarks.
Publication Year: 2010
Publication Date: 2010-11-01
Language: en
Type: article
Indexed In: ['crossref']
Access and Citation
Cited By Count: 128
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