Publication Information

{'id': 'https://openalex.org/W1989433724', 'doi': 'https://doi.org/10.1117/12.978046', 'title': 'Magnetron-Enhanced Etching Of Photoresist For Sub-Micron Patterning', 'display_name': 'Magnetron-Enhanced Etching Of Photoresist For Sub-Micron Patterning', 'publication_year': 1990, 'publication_date': '1990-01-30', 'ids': {'openalex': 'https://openalex.org/W1989433724', 'doi': 'https://doi.org/10.1117/12.978046', 'mag': '1989433724'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1117/12.978046', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S183492911', 'display_name': 'Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE', 'issn_l': '0277-786X', 'issn': ['0277-786X', '1996-756X'], 'is_oa': False, 'is_in_doaj': False, 'is_core': True, 'host_organization': 'https://openalex.org/P4310315543', 'host_organization_name': 'SPIE', 'host_organization_lineage': ['https://openalex.org/P4310315543'], 'host_organization_lineage_names': ['SPIE'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'proceedings-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5066111859', 'display_name': 'A. Selino', 'orcid': None}, 'institutions': [], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'A. Selino', 'raw_affiliation_strings': ['Materials Research Corp. (United States)'], 'affiliations': [{'raw_affiliation_string': 'Materials Research Corp. (United States)', 'institution_ids': []}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5110608663', 'display_name': 'M. Siegel', 'orcid': None}, 'institutions': [], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'M. Siegel', 'raw_affiliation_strings': ['Materials Research Corp. (United States)'], 'affiliations': [{'raw_affiliation_string': 'Materials Research Corp. (United States)', 'institution_ids': []}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5004726741', 'display_name': 'R. Lombaerts', 'orcid': None}, 'institutions': [{'id': 'https://openalex.org/I85722119', 'display_name': 'UCB Pharma (Belgium)', 'ror': 'https://ror.org/01n029866', 'country_code': 'BE', 'type': 'company', 'lineage': ['https://openalex.org/I85722119']}], 'countries': ['BE'], 'is_corresponding': False, 'raw_author_name': 'R. Lombaerts', 'raw_affiliation_strings': ['UCB Electronics (Belgium)'], 'affiliations': [{'raw_affiliation_string': 'UCB Electronics (Belgium)', 'institution_ids': ['https://openalex.org/I85722119']}]}], 'institution_assertions': [], 'countries_distinct_count': 2, 'institutions_distinct_count': 1, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 0.0, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 0, 'citation_normalized_percentile': {'value': 0.0, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 0, 'max': 54}, 'biblio': {'volume': '1185', 'issue': None, 'first_page': '51', 'last_page': '51'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T11338', 'display_name': 'Advancements in Photolithography Techniques', 'score': 0.9947, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T11338', 'display_name': 'Advancements in Photolithography Techniques', 'score': 0.9947, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11661', 'display_name': 'Copper Interconnects and Reliability', 'score': 0.9824, 'subfield': {'id': 'https://openalex.org/subfields/2504', 'display_name': 'Electronic, Optical and Magnetic Materials'}, 'field': {'id': 'https://openalex.org/fields/25', 'display_name': 'Materials Science'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T11301', 'display_name': 'Advanced Surface Polishing Techniques', 'score': 0.9737, 'subfield': {'id': 'https://openalex.org/subfields/2204', 'display_name': 'Biomedical Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/photoresist', 'display_name': 'Photoresist', 'score': 0.89608544}, {'id': 'https://openalex.org/keywords/cavity-magnetron', 'display_name': 'Cavity magnetron', 'score': 0.57841796}, {'id': 'https://openalex.org/keywords/dry-etching', 'display_name': 'Dry etching', 'score': 0.41056448}], 'concepts': [{'id': 'https://openalex.org/C134406635', 'wikidata': 'https://www.wikidata.org/wiki/Q1439684', 'display_name': 'Photoresist', 'level': 3, 'score': 0.89608544}, {'id': 'https://openalex.org/C100460472', 'wikidata': 'https://www.wikidata.org/wiki/Q2368605', 'display_name': 'Etching (microfabrication)', 'level': 3, 'score': 0.7607142}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.723927}, {'id': 'https://openalex.org/C49040817', 'wikidata': 'https://www.wikidata.org/wiki/Q193091', 'display_name': 'Optoelectronics', 'level': 1, 'score': 0.62949103}, {'id': 'https://openalex.org/C123408415', 'wikidata': 'https://www.wikidata.org/wiki/Q194154', 'display_name': 'Cavity magnetron', 'level': 4, 'score': 0.57841796}, {'id': 'https://openalex.org/C53524968', 'wikidata': 'https://www.wikidata.org/wiki/Q7315582', 'display_name': 'Resist', 'level': 3, 'score': 0.5043744}, {'id': 'https://openalex.org/C61427134', 'wikidata': 'https://www.wikidata.org/wiki/Q847609', 'display_name': 'Sputter deposition', 'level': 4, 'score': 0.48873162}, {'id': 'https://openalex.org/C130472188', 'wikidata': 'https://www.wikidata.org/wiki/Q1640159', 'display_name': 'Reactive-ion etching', 'level': 4, 'score': 0.4157068}, {'id': 'https://openalex.org/C1291036', 'wikidata': 'https://www.wikidata.org/wiki/Q1191918', 'display_name': 'Dry etching', 'level': 4, 'score': 0.41056448}, {'id': 'https://openalex.org/C171250308', 'wikidata': 'https://www.wikidata.org/wiki/Q11468', 'display_name': 'Nanotechnology', 'level': 1, 'score': 0.37357962}, {'id': 'https://openalex.org/C22423302', 'wikidata': 'https://www.wikidata.org/wiki/Q898444', 'display_name': 'Sputtering', 'level': 3, 'score': 0.17844653}, {'id': 'https://openalex.org/C19067145', 'wikidata': 'https://www.wikidata.org/wiki/Q1137203', 'display_name': 'Thin film', 'level': 2, 'score': 0.16695836}, {'id': 'https://openalex.org/C2779227376', 'wikidata': 'https://www.wikidata.org/wiki/Q6505497', 'display_name': 'Layer (electronics)', 'level': 2, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1117/12.978046', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S183492911', 'display_name': 'Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE', 'issn_l': '0277-786X', 'issn': ['0277-786X', '1996-756X'], 'is_oa': False, 'is_in_doaj': False, 'is_core': True, 'host_organization': 'https://openalex.org/P4310315543', 'host_organization_name': 'SPIE', 'host_organization_lineage': ['https://openalex.org/P4310315543'], 'host_organization_lineage_names': ['SPIE'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 0, 'referenced_works': [], 'related_works': ['https://openalex.org/W2920584510', 'https://openalex.org/W2321285900', 'https://openalex.org/W2142584595', 'https://openalex.org/W2093141138', 'https://openalex.org/W2092925226', 'https://openalex.org/W2045098484', 'https://openalex.org/W2008860117', 'https://openalex.org/W1999595755', 'https://openalex.org/W1992895626', 'https://openalex.org/W1990950348'], 'abstract_inverted_index': {'Design': [0], 'rules': [1], 'for': [2, 27, 65], 'the': [3, 14, 28, 51, 63], 'next': [4], 'generation': [5], 'of': [6, 17, 32, 54, 59, 71, 77], 'VLSI': [7], 'and': [8, 30, 36, 50], 'ULSI': [9], 'devices': [10], 'will': [11, 22], 'routinely': [12], 'require': [13], 'plasma': [15], 'etching': [16], 'sub-micron': [18], 'geometries.': [19], 'These': [20], 'requirements': [21], 'create': [23], 'even': [24], 'greater': [25], 'challenges': [26, 45], 'exposure': [29], 'devolopment': [31], 'photoresist': [33, 72], 'on': [34], 'reflective': [35], 'severe': [37], 'topographies.': [38], 'Two': [39], 'processes': [40, 61], 'developed': [41], 'to': [42, 57], 'meet': [43], 'these': [44, 60], 'are': [46], 'Multi-Level': [47], 'Resist': [48], 'processing': [49], 'Dry': [52], 'Development': [53], 'Photoresist.': [55], 'Critical': [56], 'both': [58], 'is': [62], 'need': [64], 'a': [66], 'productive,': [67], '>4000A/min,': [68], 'anisotropic': [69], 'etch': [70], 'with': [73], 'critical': [74], 'dimension': [75], 'loss': [76], '<0.05um.': [78]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W1989433724', 'counts_by_year': [], 'updated_date': '2024-12-11T23:20:02.554026', 'created_date': '2016-06-24'}